HK1213689A1 - 用於溫度控制的裝置和方法 - Google Patents

用於溫度控制的裝置和方法

Info

Publication number
HK1213689A1
HK1213689A1 HK16101404.0A HK16101404A HK1213689A1 HK 1213689 A1 HK1213689 A1 HK 1213689A1 HK 16101404 A HK16101404 A HK 16101404A HK 1213689 A1 HK1213689 A1 HK 1213689A1
Authority
HK
Hong Kong
Prior art keywords
temperature control
temperature
control
Prior art date
Application number
HK16101404.0A
Other languages
English (en)
Inventor
Scott Davis
Original Assignee
Forced Physics Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forced Physics Llc filed Critical Forced Physics Llc
Publication of HK1213689A1 publication Critical patent/HK1213689A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
    • F25B9/004—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant the refrigerant being air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/06—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using expanders
    • F25B9/065—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using expanders using pressurised gas jets
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/08—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by varying the cross-section of the flow channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
HK16101404.0A 2012-10-01 2016-02-05 用於溫度控制的裝置和方法 HK1213689A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261708619P 2012-10-01 2012-10-01
PCT/US2013/061887 WO2014055323A1 (en) 2012-10-01 2013-09-26 Device and method for temperature control

Publications (1)

Publication Number Publication Date
HK1213689A1 true HK1213689A1 (zh) 2016-07-08

Family

ID=49304416

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16101404.0A HK1213689A1 (zh) 2012-10-01 2016-02-05 用於溫度控制的裝置和方法

Country Status (13)

Country Link
US (2) US10393409B2 (zh)
EP (2) EP2904637B1 (zh)
JP (1) JP6539582B2 (zh)
CN (2) CN109990644B (zh)
AU (2) AU2013327726A1 (zh)
BR (1) BR112015007173B1 (zh)
CA (1) CA2886390C (zh)
HK (1) HK1213689A1 (zh)
IL (1) IL237958B (zh)
RU (1) RU2676391C2 (zh)
SG (1) SG11201502447VA (zh)
TW (1) TWI635249B (zh)
WO (1) WO2014055323A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020017631A (ja) * 2018-07-25 2020-01-30 日本軽金属株式会社 ヒートシンク及び溝入れ加工方法
US11437948B2 (en) 2019-09-11 2022-09-06 Community Adaptation, LLC Modular sustainable power generation unit

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WO2006017301A2 (en) * 2004-07-13 2006-02-16 Thorrn Micro Technologies, Inc. Micro-channel heat sink
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US7593230B2 (en) * 2005-05-05 2009-09-22 Sensys Medical, Inc. Apparatus for absorbing and dissipating excess heat generated by a system
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TWI361880B (en) * 2008-11-17 2012-04-11 Heat exchanging module and working fluid distributor thereof and method for manufacturing heat exchange module

Also Published As

Publication number Publication date
BR112015007173A2 (pt) 2017-07-04
BR112015007173B1 (pt) 2022-03-29
EP2904637A1 (en) 2015-08-12
AU2017261474B2 (en) 2019-10-03
EP2904637B1 (en) 2021-07-21
CA2886390A1 (en) 2014-04-10
AU2013327726A1 (en) 2015-05-14
JP2015536813A (ja) 2015-12-24
CN104823278A (zh) 2015-08-05
CA2886390C (en) 2023-09-12
TW201428227A (zh) 2014-07-16
RU2015116141A (ru) 2016-11-20
CN104823278B (zh) 2019-04-23
IL237958A0 (en) 2015-05-31
CN109990644B (zh) 2020-11-20
JP6539582B2 (ja) 2019-07-03
CN109990644A (zh) 2019-07-09
AU2017261474A1 (en) 2017-12-07
IL237958B (en) 2019-08-29
WO2014055323A1 (en) 2014-04-10
EP3944307A1 (en) 2022-01-26
US10677497B2 (en) 2020-06-09
US20190331365A1 (en) 2019-10-31
US20150253041A1 (en) 2015-09-10
US10393409B2 (en) 2019-08-27
SG11201502447VA (en) 2015-04-29
TWI635249B (zh) 2018-09-11
RU2676391C2 (ru) 2018-12-28

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