HK1211900A1 - 用於提取元件的系統和方法 - Google Patents
用於提取元件的系統和方法Info
- Publication number
- HK1211900A1 HK1211900A1 HK16100018.0A HK16100018A HK1211900A1 HK 1211900 A1 HK1211900 A1 HK 1211900A1 HK 16100018 A HK16100018 A HK 16100018A HK 1211900 A1 HK1211900 A1 HK 1211900A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- extracting elements
- extracting
- elements
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
- B32B43/006—Delaminating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
- Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
- Y10T156/1168—Gripping and pulling work apart during delaminating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/19—Delaminating means
- Y10T156/1911—Heating or cooling delaminating means [e.g., melting means, freezing means, etc.]
- Y10T156/1917—Electromagnetic radiation delaminating means [e.g., microwave, uv, ir, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK16100018.0A HK1211900A1 (zh) | 2014-02-14 | 2016-01-04 | 用於提取元件的系統和方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK14101452.3A HK1198351A2 (zh) | 2014-02-14 | 2014-02-14 | 用於提取部件的系統和方法 |
HK16100018.0A HK1211900A1 (zh) | 2014-02-14 | 2016-01-04 | 用於提取元件的系統和方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1211900A1 true HK1211900A1 (zh) | 2016-06-03 |
Family
ID=53799419
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14101452.3A HK1198351A2 (zh) | 2014-02-14 | 2014-02-14 | 用於提取部件的系統和方法 |
HK16100018.0A HK1211900A1 (zh) | 2014-02-14 | 2016-01-04 | 用於提取元件的系統和方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14101452.3A HK1198351A2 (zh) | 2014-02-14 | 2014-02-14 | 用於提取部件的系統和方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9578795B2 (zh) |
CN (1) | CN104842034B (zh) |
HK (2) | HK1198351A2 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3049813A1 (fr) * | 2016-03-29 | 2017-10-06 | D3Epaca | Equipement et procede de separation de composants d'une carte electronique. |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2707189B2 (ja) * | 1992-08-26 | 1998-01-28 | 株式会社日立製作所 | 電子部品の基板からの取外し方法及び装置 |
US5715592A (en) * | 1994-11-08 | 1998-02-10 | Nec Corporation | Parts disassembling apparatus |
US5601675A (en) * | 1994-12-06 | 1997-02-11 | International Business Machines Corporation | Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor |
US5758817A (en) * | 1996-03-19 | 1998-06-02 | Resource Concepts, Inc. | Apparatus and process for removing surface mounted components from printed wiring assemblies |
US6173750B1 (en) * | 1998-02-18 | 2001-01-16 | Hover-Davis, Inc. | Method and apparatus for removing die from a wafer and conveying die to a pickup location |
US6059170A (en) * | 1998-06-24 | 2000-05-09 | International Business Machines Corporation | Method and apparatus for insulating moisture sensitive PBGA's |
JP4985513B2 (ja) * | 2008-03-26 | 2012-07-25 | 富士通セミコンダクター株式会社 | 電子部品の剥離方法及び剥離装置 |
CN101362239B (zh) * | 2008-09-18 | 2010-06-09 | 中国人民解放军后勤工程学院 | 电路板元器件的自动拆解装置 |
US8758552B2 (en) * | 2010-06-07 | 2014-06-24 | Skyworks Solutions, Inc. | Debonders and related devices and methods for semiconductor fabrication |
CN103480933B (zh) * | 2013-09-12 | 2016-03-23 | 伟翔环保科技发展(上海)有限公司 | 一种利用高压热风自动分离废弃线路板元件的方法 |
-
2014
- 2014-02-14 HK HK14101452.3A patent/HK1198351A2/zh not_active IP Right Cessation
-
2015
- 2015-02-05 CN CN201510061015.3A patent/CN104842034B/zh active Active
- 2015-02-13 US US14/621,876 patent/US9578795B2/en active Active
-
2016
- 2016-01-04 HK HK16100018.0A patent/HK1211900A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN104842034A (zh) | 2015-08-19 |
HK1198351A2 (zh) | 2015-04-02 |
CN104842034B (zh) | 2020-03-17 |
US9578795B2 (en) | 2017-02-21 |
US20150237774A1 (en) | 2015-08-20 |
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