HK1206151A1 - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device

Info

Publication number
HK1206151A1
HK1206151A1 HK15106725.2A HK15106725A HK1206151A1 HK 1206151 A1 HK1206151 A1 HK 1206151A1 HK 15106725 A HK15106725 A HK 15106725A HK 1206151 A1 HK1206151 A1 HK 1206151A1
Authority
HK
Hong Kong
Prior art keywords
light emitting
emitting device
semiconductor light
semiconductor
light
Prior art date
Application number
HK15106725.2A
Other languages
English (en)
Chinese (zh)
Inventor
Yoshiaki Sugizaki
Akihiro Kojima
Original Assignee
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Kk filed Critical Toshiba Kk
Publication of HK1206151A1 publication Critical patent/HK1206151A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
HK15106725.2A 2013-08-30 2015-07-14 Semiconductor light emitting device HK1206151A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013180045A JP2015050270A (ja) 2013-08-30 2013-08-30 半導体発光装置

Publications (1)

Publication Number Publication Date
HK1206151A1 true HK1206151A1 (en) 2015-12-31

Family

ID=50238245

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15106725.2A HK1206151A1 (en) 2013-08-30 2015-07-14 Semiconductor light emitting device

Country Status (6)

Country Link
US (1) US20150060899A1 (ja)
EP (1) EP2843702A1 (ja)
JP (1) JP2015050270A (ja)
KR (1) KR20150026732A (ja)
HK (1) HK1206151A1 (ja)
TW (1) TW201508955A (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3038452A1 (fr) * 2015-06-30 2017-01-06 Commissariat Energie Atomique Dispositif electroluminescent a semiconducteur comportant une couche photoluminescente structuree
DE102016104385A1 (de) 2016-03-10 2017-09-14 Osram Opto Semiconductors Gmbh Projektionsoptik, optoelektronischer Halbleiterchip, optoelektronisches Beleuchtungssystem, Kamera, Endgerät
DE102016124873B4 (de) * 2016-12-19 2023-09-21 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Weißlichtquelle und Verfahren zur Herstellung einer Weißlichtquelle
US10923635B2 (en) * 2016-12-30 2021-02-16 Lumileds Llc Phosphor deposition system for LEDs
DE102017119872A1 (de) * 2017-08-30 2019-02-28 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
US11398458B2 (en) 2019-12-13 2022-07-26 Lumileds Llc Multi-color phosphor converted LED package with single cavity
EP4073838A1 (en) * 2019-12-13 2022-10-19 Lumileds LLC Leds and multi-color phosphors
JP7283489B2 (ja) * 2021-01-20 2023-05-30 三菱電機株式会社 発光装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005100800A (ja) * 2003-09-25 2005-04-14 Matsushita Electric Ind Co Ltd Ｌｅｄ照明光源
WO2007052777A1 (en) * 2005-11-04 2007-05-10 Matsushita Electric Industrial Co., Ltd. Light-emitting module, and display unit and lighting unit using the same
CN102341740B (zh) * 2009-06-22 2015-09-16 财团法人工业技术研究院 发光单元阵列、其制造方法和投影设备
KR20120092549A (ko) * 2009-06-30 2012-08-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 조정가능 색 온도를 갖는 백색광 전계발광 디바이스
US8604498B2 (en) * 2010-03-26 2013-12-10 Tsmc Solid State Lighting Ltd. Single phosphor layer photonic device for generating white light or color lights
US10522518B2 (en) * 2010-12-23 2019-12-31 Bench Walk Lighting, LLC Light source with tunable CRI
JP2012199539A (ja) * 2011-03-08 2012-10-18 Mitsubishi Chemicals Corp 発光装置及び発光装置を備えた照明装置
JP5498417B2 (ja) * 2011-03-15 2014-05-21 株式会社東芝 半導体発光装置及びその製造方法
JP5662277B2 (ja) * 2011-08-08 2015-01-28 株式会社東芝 半導体発光装置及び発光モジュール
JP2013065726A (ja) * 2011-09-16 2013-04-11 Toshiba Corp 半導体発光装置及びその製造方法

Also Published As

Publication number Publication date
US20150060899A1 (en) 2015-03-05
TW201508955A (zh) 2015-03-01
JP2015050270A (ja) 2015-03-16
KR20150026732A (ko) 2015-03-11
EP2843702A1 (en) 2015-03-04

Similar Documents

Publication Publication Date Title
EP2851969A4 (en) LIGHT-EMITTING SEMICONDUCTOR ELEMENT
PL3011608T3 (pl) Urządzenie emitujące światło
EP2981952A4 (en) DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE
HK1218900A1 (zh) 照明裝置
HK1207470A1 (en) Semiconductor light emitting device
HK1212506A1 (en) Semiconductor light emitting device
EP3032594A4 (en) Light emitting device
HK1199326A1 (en) Semiconductor light emitting device and light emitting device
EP3036969A4 (en) Display device using semiconductor light emitting device
EP3043395A4 (en) LIGHT-EMITTING DEVICE
EP3036970A4 (en) Display device using semiconductor light emitting device
EP2954836A4 (en) LIGHT SOURCE DEVICE
PL2827053T3 (pl) Oprawa oświetleniowa
EP2986082A4 (en) LIGHT EMITTING DEVICE
EP3061081A4 (en) Display device using semiconductor light emitting device
EP3061082A4 (en) Display device using semiconductor light emitting device
EP3010048A4 (en) SEMICONDUCTOR LIGHT EMITTING DEVICE
EP2996164A4 (en) LIGHT EMITTING DEVICE
TWI563706B (en) Organic light emitting device
TWI560902B (en) Semiconductor light emitting device
EP2784832A4 (en) SEMICONDUCTOR LIGHT EMITTING DEVICE
HK1207472A1 (en) Semiconductor light emitting device
HK1206151A1 (en) Semiconductor light emitting device
ZA201401535B (en) Lighting device
SG11201604563VA (en) Light-emitting device