HK1188671A1 - -directed delay line components for printed circuit boards - Google Patents

-directed delay line components for printed circuit boards

Info

Publication number
HK1188671A1
HK1188671A1 HK14101595.1A HK14101595A HK1188671A1 HK 1188671 A1 HK1188671 A1 HK 1188671A1 HK 14101595 A HK14101595 A HK 14101595A HK 1188671 A1 HK1188671 A1 HK 1188671A1
Authority
HK
Hong Kong
Prior art keywords
printed circuit
circuit boards
delay line
line components
directed delay
Prior art date
Application number
HK14101595.1A
Other languages
Chinese (zh)
Inventor
凱斯．布萊恩．哈丁
約翰．托馬斯．費斯勒
保羅．凱文．霍爾
布萊恩．李．娜莉
羅伯特．亞倫．奧萊斯比
Original Assignee
利盟國際有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 利盟國際有限公司 filed Critical 利盟國際有限公司
Publication of HK1188671A1 publication Critical patent/HK1188671A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0248—Skew reduction or using delay lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
HK14101595.1A 2011-01-21 2014-02-19 -directed delay line components for printed circuit boards HK1188671A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/022019 WO2012148374A1 (en) 2011-01-21 2011-01-21 Z-directed delay line components for printed circuit boards

Publications (1)

Publication Number Publication Date
HK1188671A1 true HK1188671A1 (en) 2014-05-09

Family

ID=47072619

Family Applications (1)

Application Number Title Priority Date Filing Date
HK14101595.1A HK1188671A1 (en) 2011-01-21 2014-02-19 -directed delay line components for printed circuit boards

Country Status (3)

Country Link
CN (1) CN103314650B (en)
HK (1) HK1188671A1 (en)
WO (1) WO2012148374A1 (en)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3798394A (en) * 1972-10-11 1974-03-19 Bell Telephone Labor Inc Keyboard switch assembly with conductive diaphragm operators and rotary switch operators for adjustably selecting a multidigit number
US4109296A (en) * 1977-08-01 1978-08-22 Ncr Corporation Machine insertable circuit board electronic component
US4675625A (en) * 1985-03-26 1987-06-23 Rogers Corporation Rolled delay line of the coplanar line type
US4850892A (en) * 1985-12-16 1989-07-25 Wang Laboratories, Inc. Connecting apparatus for electrically connecting memory modules to a printed circuit board
US5603847A (en) * 1993-04-07 1997-02-18 Zycon Corporation Annular circuit components coupled with printed circuit board through-hole
US6593535B2 (en) * 2001-06-26 2003-07-15 Teradyne, Inc. Direct inner layer interconnect for a high speed printed circuit board
US7258549B2 (en) * 2004-02-20 2007-08-21 Matsushita Electric Industrial Co., Ltd. Connection member and mount assembly and production method of the same
US7567163B2 (en) * 2004-08-31 2009-07-28 Pulse Engineering, Inc. Precision inductive devices and methods
US7782629B2 (en) * 2007-02-26 2010-08-24 Flextronics Ap, Llc Embedding an electronic component between surfaces of a printed circuit board
US8064214B2 (en) * 2008-01-04 2011-11-22 Dialogic Corporation Press fit passive component
CN101668385B (en) * 2008-09-05 2012-01-25 华硕电脑股份有限公司 Delay line suitable for printed circuit board

Also Published As

Publication number Publication date
CN103314650A (en) 2013-09-18
CN103314650B (en) 2016-05-25
WO2012148374A1 (en) 2012-11-01

Similar Documents

Publication Publication Date Title
EP2684431A4 (en) Printed circuit board design for high speed application
SG10201605363VA (en) Resin composition for printed wiring boards
GB2494919B (en) Method for connecting printed circuit boards.
EP2760264A4 (en) Electronic circuit component mounter
EP2801123A4 (en) Printed circuit board with reduced cross-talk
EP2705735A4 (en) Method for manufacturing printed circuit board
EP2647267A4 (en) Method for manufacturing printed circuit board
GB2490072B (en) printed circuit board
RS61026B1 (en) System for manufacturing printed circuit boards
EP2743955A4 (en) Electronic component
TWI562696B (en) Printed circuit board and method for manufacturing the same
EP2760121A4 (en) Electronic circuit
EP2750490A4 (en) Component-mounting printed circuit board and manufacturing method for same
EP2571340A4 (en) Method for producing circuit board
TWI562697B (en) Printed circuit board
EP2808890A4 (en) Multilayer printed board
EP2792026A4 (en) Electrical connectors for use with printed circuit boards
EP2680278A4 (en) Mounting structure for electronic components
EP2915415A4 (en) Printed circuit board
GB201119037D0 (en) Flexible printed circuit board harness
EP2728990A4 (en) Electronic circuit component mounting system
TWI561129B (en) Light-pervious printed circuit board method for manufacturing same
EP2664029A4 (en) Printed circuit board based feed horn
GB2502148B (en) Printed circuit board heatsink mounting
EP2705736A4 (en) The printed circuit board and the method for manufacturing the same