HK1151386A1 - Die bonding apparatus which provides a large bond force - Google Patents

Die bonding apparatus which provides a large bond force

Info

Publication number
HK1151386A1
HK1151386A1 HK11105259.2A HK11105259A HK1151386A1 HK 1151386 A1 HK1151386 A1 HK 1151386A1 HK 11105259 A HK11105259 A HK 11105259A HK 1151386 A1 HK1151386 A1 HK 1151386A1
Authority
HK
Hong Kong
Prior art keywords
provides
bonding apparatus
die bonding
bond force
large bond
Prior art date
Application number
HK11105259.2A
Other languages
English (en)
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of HK1151386A1 publication Critical patent/HK1151386A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
HK11105259.2A 2009-09-02 2011-05-26 Die bonding apparatus which provides a large bond force HK1151386A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/552,585 US8016010B2 (en) 2009-09-02 2009-09-02 Rotary bonding tool which provides a large bond force

Publications (1)

Publication Number Publication Date
HK1151386A1 true HK1151386A1 (en) 2012-01-27

Family

ID=43623093

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11105259.2A HK1151386A1 (en) 2009-09-02 2011-05-26 Die bonding apparatus which provides a large bond force

Country Status (5)

Country Link
US (1) US8016010B2 (xx)
KR (1) KR101149391B1 (xx)
CN (1) CN102005399B (xx)
HK (1) HK1151386A1 (xx)
TW (1) TWI397970B (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8387851B1 (en) * 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
CN103367566B (zh) * 2013-06-26 2016-01-20 广东工业大学 基于音圈电机和花键轴的固晶机焊头机构及固晶机
FR3073763B1 (fr) 2017-11-17 2021-05-14 Besi Switzerland Ag Tete de soudage pour monter des composants et microsoudeuse de puce avec une telle tete de soudage
DE102018115144A1 (de) * 2018-06-23 2019-12-24 Besi Switzerland Ag Stellantrieb für einen Bondkopf

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6651866B2 (en) * 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
US6844635B2 (en) * 2002-05-24 2005-01-18 Dover Instrument Corporation Reaction force transfer system
US7059159B2 (en) * 2003-02-06 2006-06-13 Mi-Jack Products, Inc. Security system for cargo trailers
US7240711B2 (en) * 2004-01-21 2007-07-10 Asm Assembly Automation Ltd. Apparatus and method for alignment of a bonding tool
US7727800B2 (en) * 2005-12-12 2010-06-01 Asm Assembly Automation Ltd. High precision die bonding apparatus

Also Published As

Publication number Publication date
TWI397970B (zh) 2013-06-01
KR101149391B1 (ko) 2012-06-01
TW201110258A (en) 2011-03-16
CN102005399A (zh) 2011-04-06
US8016010B2 (en) 2011-09-13
CN102005399B (zh) 2012-06-27
KR20110025094A (ko) 2011-03-09
US20110048648A1 (en) 2011-03-03

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