HK1133130A1 - An ic for a high frequency communication device with a minimal off chip components - Google Patents

An ic for a high frequency communication device with a minimal off chip components

Info

Publication number
HK1133130A1
HK1133130A1 HK09110700.1A HK09110700A HK1133130A1 HK 1133130 A1 HK1133130 A1 HK 1133130A1 HK 09110700 A HK09110700 A HK 09110700A HK 1133130 A1 HK1133130 A1 HK 1133130A1
Authority
HK
Hong Kong
Prior art keywords
minimal
communication device
high frequency
frequency communication
chip components
Prior art date
Application number
HK09110700.1A
Other languages
English (en)
Inventor
Theodoros Georgantas
Konstantions Vavelidis
Sofoklis Plevridis
Babis Kapnistis
Spyridon Kavadias
Original Assignee
Broadcom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Broadcom Corp filed Critical Broadcom Corp
Publication of HK1133130A1 publication Critical patent/HK1133130A1/xx

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/0003Software-defined radio [SDR] systems, i.e. systems wherein components typically implemented in hardware, e.g. filters or modulators/demodulators, are implented using software, e.g. by involving an AD or DA conversion stage such that at least part of the signal processing is performed in the digital domain
    • H04B1/0028Software-defined radio [SDR] systems, i.e. systems wherein components typically implemented in hardware, e.g. filters or modulators/demodulators, are implented using software, e.g. by involving an AD or DA conversion stage such that at least part of the signal processing is performed in the digital domain wherein the AD/DA conversion occurs at baseband stage
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • H04B1/403Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency
    • H04B1/406Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency with more than one transmission mode, e.g. analog and digital modes
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04WWIRELESS COMMUNICATION NETWORKS
    • H04W88/00Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
    • H04W88/02Terminal devices
    • H04W88/06Terminal devices adapted for operation in multiple networks or having at least two operational modes, e.g. multi-mode terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Transmitters (AREA)
HK09110700.1A 2007-11-02 2009-11-16 An ic for a high frequency communication device with a minimal off chip components HK1133130A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/934,504 US20090117938A1 (en) 2007-11-02 2007-11-02 Ic for a high frequency communication device with minimal off chip components

Publications (1)

Publication Number Publication Date
HK1133130A1 true HK1133130A1 (en) 2010-03-12

Family

ID=40524701

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09110700.1A HK1133130A1 (en) 2007-11-02 2009-11-16 An ic for a high frequency communication device with a minimal off chip components

Country Status (6)

Country Link
US (1) US20090117938A1 (zh)
EP (1) EP2063539A3 (zh)
KR (1) KR101015918B1 (zh)
CN (1) CN101442322B (zh)
HK (1) HK1133130A1 (zh)
TW (1) TWI426720B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1956711B1 (de) * 2007-02-02 2009-08-12 Feig Electronic GmbH Elektronische Schaltung für einen Hochfrequenzschalter
US8200181B1 (en) * 2008-08-29 2012-06-12 Rf Micro Devices, Inc. Noise reduction in a dual radio frequency receiver
US8155612B1 (en) 2008-11-19 2012-04-10 Qualcomm Atheros, Inc. Wireless device using a shared gain stage for simultaneous reception of multiple protocols
US8340621B1 (en) * 2008-11-19 2012-12-25 Qualcomm Incorporated Wireless device using a shared gain stage for simultaneous reception of multiple protocols
US8213982B2 (en) * 2009-06-01 2012-07-03 Hewlett-Packard Development Company, L.P. Enhanced internal antenna architecture for a mobile computing device
US8417286B2 (en) * 2010-01-06 2013-04-09 Rfaxis, Inc. Transmit-receive radio frequency front end integrated circuits for laptop computer applications
US8547207B2 (en) 2010-03-11 2013-10-01 Checkpoint System, Inc. RFID converter module
US8349648B2 (en) 2010-06-15 2013-01-08 Stats Chippac, Ltd. Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate
CN107276641B (zh) * 2012-03-02 2021-07-02 凯萨股份有限公司 双工通信系统和方法
US9362958B2 (en) * 2012-03-02 2016-06-07 Qualcomm Incorporated Single chip signal splitting carrier aggregation receiver architecture
CN106446734B (zh) * 2013-11-27 2019-04-23 苏州木兰电子科技有限公司 用于物联网的射频天线激活源
CN103812519A (zh) * 2014-02-13 2014-05-21 佳泷芯电子科技(上海)有限公司 一种2.4GHz可调速率无线收发机系统
FR3025897B1 (fr) * 2014-09-12 2018-05-04 Zodiac Actuation Systems Equipement de siege d'avion sans fil
US9853683B2 (en) * 2015-10-09 2017-12-26 Qorvo Us, Inc. Radio frequency front end circuitry for uplink carrier aggregation
CN106464289B (zh) * 2015-11-04 2019-07-05 深圳博芯科技股份有限公司 5.8g远距离无线数据传输系统
US11003205B2 (en) 2019-02-04 2021-05-11 Sigmasense, Llc. Receive analog to digital circuit of a low voltage drive circuit data communication system
CN115865015A (zh) * 2023-02-22 2023-03-28 杭州地芯科技有限公司 一种射频放大电路、射频模组和射频芯片

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990011052A (ko) * 1997-07-21 1999-02-18 윤종용 광대역 코드 분할 다중 접속 무선 가입자 망 기지국 시스템의 송수신기 장치
KR100260252B1 (ko) * 1998-02-14 2000-07-01 이계철 로컬 멀티포인트 통신시스템(lmcs)의 고주파(rf) 송수신기
US6181734B1 (en) * 1998-05-29 2001-01-30 Motorola, Inc. Multiple waveform software radio
JP3399400B2 (ja) * 1999-04-15 2003-04-21 日本電気株式会社 周波数偏移復調回路
JP2005504476A (ja) * 2001-09-19 2005-02-10 シーメンス アクチエンゲゼルシヤフト マルチバンド受信器および関連方法
EP1331742A3 (en) * 2002-01-22 2003-12-17 Broadcom Corporation Radio frequency integrated circuit
US7139332B2 (en) * 2002-05-17 2006-11-21 Broadcom Corporation Quadrature receiver sampling architecture
US7356314B2 (en) * 2003-04-17 2008-04-08 Kyocera Wireless Corp. Systems and methods for reusing a low noise amplifier in a wireless communications device
JP2005012648A (ja) * 2003-06-20 2005-01-13 Toshiba Corp 無線通信装置及びその送受信回路
US7623580B2 (en) * 2003-06-30 2009-11-24 Nxp B.V. Simultaneous multiple channel receiver
US7444166B2 (en) * 2004-02-12 2008-10-28 Qualcomm Incorporated Wireless diversity receiver with shared receive path
JP2007529181A (ja) * 2004-03-15 2007-10-18 サムスン エレクトロニクス カンパニー リミテッド マルチモード/マルチバンド移動局及びその移動局の動作方法
US7903772B2 (en) * 2005-02-04 2011-03-08 Broadcom Corporation Digital demodulator with improved hardware and power efficiency
US7787843B2 (en) * 2005-03-29 2010-08-31 Broadcom Corporation Multiple band direct conversion radio frequency transceiver integrated circuit
CN100583663C (zh) * 2005-03-29 2010-01-20 美国博通公司 多频带多入多出收发器集成电路
US7590396B2 (en) * 2005-10-06 2009-09-15 Broadcom Corporation Multimode communication device with shared signal path programmable filter
US7912428B2 (en) * 2005-11-16 2011-03-22 Broadcom Corporation System and method providing variable-frequency IF conversion in a multimode communication device

Also Published As

Publication number Publication date
EP2063539A2 (en) 2009-05-27
US20090117938A1 (en) 2009-05-07
TW200939652A (en) 2009-09-16
KR101015918B1 (ko) 2011-02-23
TWI426720B (zh) 2014-02-11
CN101442322B (zh) 2012-10-03
KR20090045879A (ko) 2009-05-08
EP2063539A3 (en) 2012-04-04
CN101442322A (zh) 2009-05-27

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20171103