HK1114050A1 - Material treatment method by laser ablation and material treated by the treatment method - Google Patents

Material treatment method by laser ablation and material treated by the treatment method

Info

Publication number
HK1114050A1
HK1114050A1 HK08103895.2A HK08103895A HK1114050A1 HK 1114050 A1 HK1114050 A1 HK 1114050A1 HK 08103895 A HK08103895 A HK 08103895A HK 1114050 A1 HK1114050 A1 HK 1114050A1
Authority
HK
Hong Kong
Prior art keywords
treatment method
laser ablation
treated
material treated
ablation
Prior art date
Application number
HK08103895.2A
Other languages
English (en)
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of HK1114050A1 publication Critical patent/HK1114050A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
HK08103895.2A 2005-03-02 2008-04-08 Material treatment method by laser ablation and material treated by the treatment method HK1114050A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005058180A JP2006239730A (ja) 2005-03-02 2005-03-02 レーザーアブレーションによる加工方法と前記加工方法により加工された材料
PCT/JP2006/303284 WO2006093017A1 (ja) 2005-03-02 2006-02-23 レーザーアブレーションによる材料の加工方法とその加工方法により加工された材料

Publications (1)

Publication Number Publication Date
HK1114050A1 true HK1114050A1 (en) 2008-10-24

Family

ID=36941051

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08103895.2A HK1114050A1 (en) 2005-03-02 2008-04-08 Material treatment method by laser ablation and material treated by the treatment method

Country Status (9)

Country Link
US (1) US20090152246A1 (ja)
EP (1) EP1859894A1 (ja)
JP (1) JP2006239730A (ja)
KR (1) KR20070114372A (ja)
CN (1) CN100528456C (ja)
CA (1) CA2598056A1 (ja)
HK (1) HK1114050A1 (ja)
TW (1) TW200635690A (ja)
WO (1) WO2006093017A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT2958531T (pt) * 2014-05-22 2016-11-04 Wavelight Gmbh Técnica para definir parâmetros de pulso de laser relacionados com energia
CN113210873B (zh) * 2021-06-03 2022-04-05 北京理工大学 一种基于电子动态调控的金属纳米网的制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US6156030A (en) * 1997-06-04 2000-12-05 Y-Beam Technologies, Inc. Method and apparatus for high precision variable rate material removal and modification
JP3804359B2 (ja) * 1999-10-27 2006-08-02 コニカミノルタホールディングス株式会社 インクジェットヘッドの製造方法
JP2002283090A (ja) * 2001-03-27 2002-10-02 Mitsui Chemicals Inc レーザーアブレーション装置のレーザ光導入光学窓用防着部材、レーザアブレーション装置およびレーザアブレーション方法
JP4209615B2 (ja) * 2001-12-28 2009-01-14 株式会社ニデック レーザ加工装置
JP2004351466A (ja) * 2003-05-29 2004-12-16 Aisin Seiki Co Ltd レーザ加工方法及びレーザ加工装置
JP4644797B2 (ja) * 2004-01-28 2011-03-02 国立大学法人京都大学 レーザ照射方法及び装置、微細加工方法及び装置、並びに薄膜形成方法及び装置

Also Published As

Publication number Publication date
KR20070114372A (ko) 2007-12-03
WO2006093017A1 (ja) 2006-09-08
TW200635690A (en) 2006-10-16
JP2006239730A (ja) 2006-09-14
CN100528456C (zh) 2009-08-19
US20090152246A1 (en) 2009-06-18
CN101128280A (zh) 2008-02-20
CA2598056A1 (en) 2006-09-08
EP1859894A1 (en) 2007-11-28

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20130223