HK1103809A1 - Extreme ultraviolet reticle protection apparatus and methods - Google Patents
Extreme ultraviolet reticle protection apparatus and methodsInfo
- Publication number
- HK1103809A1 HK1103809A1 HK07112331.6A HK07112331A HK1103809A1 HK 1103809 A1 HK1103809 A1 HK 1103809A1 HK 07112331 A HK07112331 A HK 07112331A HK 1103809 A1 HK1103809 A1 HK 1103809A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- methods
- extreme ultraviolet
- protection apparatus
- reticle protection
- ultraviolet reticle
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
- G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
Landscapes
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Toxicology (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/898,475 US7030959B2 (en) | 2004-07-23 | 2004-07-23 | Extreme ultraviolet reticle protection using gas flow thermophoresis |
PCT/US2005/025958 WO2006012462A1 (en) | 2004-07-23 | 2005-07-21 | Extreme ultraviolet reticle protection |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1103809A1 true HK1103809A1 (en) | 2007-12-28 |
Family
ID=35656764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK07112331.6A HK1103809A1 (en) | 2004-07-23 | 2007-11-12 | Extreme ultraviolet reticle protection apparatus and methods |
Country Status (7)
Country | Link |
---|---|
US (2) | US7030959B2 (zh) |
EP (1) | EP1771770A4 (zh) |
JP (1) | JP2008507848A (zh) |
CN (1) | CN1989452B (zh) |
HK (1) | HK1103809A1 (zh) |
IL (1) | IL180878A0 (zh) |
WO (1) | WO2006012462A1 (zh) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050223973A1 (en) * | 2004-03-30 | 2005-10-13 | Infineon Technologies Ag | EUV lithography system and chuck for releasing reticle in a vacuum isolated environment |
US7030959B2 (en) * | 2004-07-23 | 2006-04-18 | Nikon Corporation | Extreme ultraviolet reticle protection using gas flow thermophoresis |
US7259834B2 (en) * | 2004-10-18 | 2007-08-21 | Nikon Corporation | Method and apparatus having a reticle stage safety feature |
JP2006287003A (ja) * | 2005-04-01 | 2006-10-19 | Tohoku Univ | 露光装置 |
US7554648B2 (en) * | 2005-11-04 | 2009-06-30 | Nikon Corporation | Blind devices and methods for providing continuous thermophoretic protection of lithographic reticle |
US7745079B2 (en) * | 2006-03-09 | 2010-06-29 | Nikon Corporation | Apparatus for and method of thermophoretic protection of an object in a high-vacuum environment |
JP2007281142A (ja) | 2006-04-05 | 2007-10-25 | Canon Inc | 露光装置及び方法、並びに、デバイス製造方法 |
US20070285632A1 (en) * | 2006-06-08 | 2007-12-13 | Nikon Corporation | EUVL reticle stage and reticle protection system and method |
JP2008258477A (ja) * | 2007-04-06 | 2008-10-23 | Canon Inc | 処理装置及び雰囲気置換方法 |
NL1036181A1 (nl) * | 2007-11-30 | 2009-06-04 | Asml Netherlands Bv | A lithographic apparatus, a projection system and a device manufacturing method. |
US8329260B2 (en) * | 2008-03-11 | 2012-12-11 | Varian Semiconductor Equipment Associates, Inc. | Cooled cleaving implant |
DE102008028868A1 (de) * | 2008-06-19 | 2009-12-24 | Carl Zeiss Smt Ag | Optische Baugruppe |
TWI427839B (zh) * | 2010-12-03 | 2014-02-21 | Ind Tech Res Inst | 薄膜圖案的沉積裝置與方法 |
US20130235357A1 (en) * | 2012-03-12 | 2013-09-12 | Kla-Tencor Corporation | System and Method for Particle Control Near A Reticle |
KR102141138B1 (ko) * | 2012-03-14 | 2020-08-05 | 에이에스엠엘 네델란즈 비.브이. | 리소그래피 장치 |
NL2010916A (en) | 2012-07-06 | 2014-01-07 | Asml Netherlands Bv | A lithographic apparatus. |
US9244368B2 (en) | 2012-09-26 | 2016-01-26 | Kla-Tencor Corporation | Particle control near reticle and optics using showerhead |
JP6328126B2 (ja) | 2012-10-31 | 2018-05-23 | エーエスエムエル ホールディング エヌ.ブイ. | パターニングデバイス支持体、リソグラフィ装置及びパターニングデバイスの温度制御方法 |
US9389180B2 (en) | 2013-02-15 | 2016-07-12 | Kla-Tencor Corporation | Methods and apparatus for use with extreme ultraviolet light having contamination protection |
NL2012291A (en) * | 2013-02-20 | 2014-08-21 | Asml Netherlands Bv | Gas flow optimization in reticle stage environment. |
CN107111249A (zh) * | 2014-12-31 | 2017-08-29 | Asml控股股份有限公司 | 具有图案化装置环境的光刻设备 |
KR102502727B1 (ko) | 2015-11-09 | 2023-02-23 | 삼성전자주식회사 | 레티클 및 그를 포함하는 노광 장치 |
US10088761B1 (en) * | 2017-03-28 | 2018-10-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Lithography device and apparatus and method for lithography device |
CN109524286B (zh) * | 2017-09-20 | 2021-05-11 | 台湾积体电路制造股份有限公司 | 半导体晶圆加工方法、系统及系统的清洁方法 |
US10714371B2 (en) * | 2017-11-16 | 2020-07-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for lithography in semiconductor fabrication |
US11156926B2 (en) * | 2019-08-12 | 2021-10-26 | Kla Corporation | Vacuum actuator containment for molecular contaminant and particle mitigation |
CN113210381B (zh) * | 2021-04-14 | 2022-08-05 | 东软威特曼生物科技(沈阳)有限公司 | 用于清洗生化分析仪中比色杯的清洗组件及生化分析仪 |
CN117234032B (zh) * | 2023-11-13 | 2024-02-06 | 睿晶半导体(宁波)有限公司 | 掩模版上污染物的去除方法及吹扫装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0394445A (ja) * | 1989-09-06 | 1991-04-19 | Mitsubishi Electric Corp | 半導体ウエハ搬送システム |
JP2860174B2 (ja) * | 1991-03-05 | 1999-02-24 | 三菱電機株式会社 | 化学気相成長装置 |
JP3537843B2 (ja) * | 1993-03-19 | 2004-06-14 | 株式会社テクノ菱和 | クリーンルーム用イオナイザー |
US5528118A (en) * | 1994-04-01 | 1996-06-18 | Nikon Precision, Inc. | Guideless stage with isolated reaction stage |
US5874820A (en) * | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
US6110844A (en) * | 1995-09-29 | 2000-08-29 | Sandia Corporation | Reduction of particle deposition on substrates using temperature gradient control |
JP3783973B2 (ja) | 1996-03-22 | 2006-06-07 | 独立行政法人 日本原子力研究開発機構 | 減圧容器内におけるダスト回収方法 |
US6153044A (en) * | 1998-04-30 | 2000-11-28 | Euv Llc | Protection of lithographic components from particle contamination |
US6072157A (en) * | 1998-12-11 | 2000-06-06 | Euv Llc | Thermophoretic vacuum wand |
US6106634A (en) * | 1999-02-11 | 2000-08-22 | Applied Materials, Inc. | Methods and apparatus for reducing particle contamination during wafer transport |
TW480372B (en) * | 1999-11-05 | 2002-03-21 | Asm Lithography Bv | Lithographic projection apparatus, method of manufacturing a device using the apparatus, and device manufactured according to the method |
TW563002B (en) * | 1999-11-05 | 2003-11-21 | Asml Netherlands Bv | Lithographic projection apparatus, method of manufacturing a device using a lithographic projection apparatus, and device manufactured by the method |
US6492067B1 (en) * | 1999-12-03 | 2002-12-10 | Euv Llc | Removable pellicle for lithographic mask protection and handling |
JP2002151400A (ja) * | 2000-11-15 | 2002-05-24 | Canon Inc | 露光装置、その保守方法並びに同装置を用いた半導体デバイス製造方法及び半導体製造工場 |
EP1256844A1 (en) * | 2001-05-09 | 2002-11-13 | ASML Netherlands B.V. | Lithographic apparatus |
JP2002373852A (ja) * | 2001-06-15 | 2002-12-26 | Canon Inc | 露光装置 |
US7159719B2 (en) * | 2003-07-31 | 2007-01-09 | Intel Corporation | Thermophoretic protection of reticles |
JP2006049815A (ja) * | 2004-07-02 | 2006-02-16 | Canon Inc | 露光装置 |
US7030959B2 (en) * | 2004-07-23 | 2006-04-18 | Nikon Corporation | Extreme ultraviolet reticle protection using gas flow thermophoresis |
JP2006198577A (ja) * | 2005-01-24 | 2006-08-03 | Canon Inc | 微粒子の分級方法および成膜方法 |
JP2006269942A (ja) * | 2005-03-25 | 2006-10-05 | Canon Inc | 露光装置及びデバイス製造方法 |
US7745079B2 (en) * | 2006-03-09 | 2010-06-29 | Nikon Corporation | Apparatus for and method of thermophoretic protection of an object in a high-vacuum environment |
US20070285632A1 (en) * | 2006-06-08 | 2007-12-13 | Nikon Corporation | EUVL reticle stage and reticle protection system and method |
-
2004
- 2004-07-23 US US10/898,475 patent/US7030959B2/en not_active Expired - Fee Related
-
2005
- 2005-07-21 WO PCT/US2005/025958 patent/WO2006012462A1/en active Application Filing
- 2005-07-21 EP EP05775034A patent/EP1771770A4/en not_active Withdrawn
- 2005-07-21 JP JP2007522774A patent/JP2008507848A/ja active Pending
- 2005-07-21 CN CN2005800247130A patent/CN1989452B/zh not_active Expired - Fee Related
-
2007
- 2007-01-19 US US11/572,394 patent/US20070121091A1/en not_active Abandoned
- 2007-01-22 IL IL180878A patent/IL180878A0/en unknown
- 2007-11-12 HK HK07112331.6A patent/HK1103809A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2006012462A1 (en) | 2006-02-02 |
CN1989452B (zh) | 2010-05-26 |
US7030959B2 (en) | 2006-04-18 |
IL180878A0 (en) | 2007-07-04 |
JP2008507848A (ja) | 2008-03-13 |
CN1989452A (zh) | 2007-06-27 |
US20070121091A1 (en) | 2007-05-31 |
EP1771770A1 (en) | 2007-04-11 |
US20060017895A1 (en) | 2006-01-26 |
EP1771770A4 (en) | 2011-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1103809A1 (en) | Extreme ultraviolet reticle protection apparatus and methods | |
HK1220516A1 (zh) | 曝光裝置與曝光方法 | |
HK1199771A1 (zh) | 曝光裝置和方法 | |
TWI348596B (en) | Exposure apparatus and method | |
EP1796144A4 (en) | PLATINUM APPARATUS AND EXPOSURE APPARATUS | |
EP1918983A4 (en) | STAGE EQUIPMENT AND EXPOSURE DEVICE | |
HK1087315A1 (en) | Instrument and apparatus for ultraviolet irradiation | |
GB2431016B (en) | Projection apparatus and method | |
HK1152117A1 (en) | Exposure apparatus | |
GB2445282B (en) | Pattern exposure method and pattern exposure apparatus | |
SG131829A1 (en) | Immersion lithography apparatus and methods | |
EP1965987A4 (en) | METHOD AND DEVICE FOR PROTECTING AGAINST COUNTERFEITING | |
EP1965988A4 (en) | PROCESS AND DEVICE FOR PROTECTION FROM PANEL COPIES | |
EP1780786A4 (en) | STAGE DEVICE, EXPOSURE DEVICE AND EXPOSURE METHOD | |
EP1965989A4 (en) | METHOD AND APPARATUS FOR PROTECTING AGAINST COUNTERFEITING | |
HK1120017A1 (en) | Biocides and apparatus | |
EP1975980A4 (en) | EXPOSURE DEVICE AND MANUFACTURING METHOD THEREFOR | |
EP1922588A4 (en) | METHOD AND SHAPE EXPOSURE DEVICE | |
EP1811545A4 (en) | EXPOSURE EQUIPMENT AND EXPOSURE METHOD | |
HK1116686A1 (zh) | 用於治療澱粉樣變性的製劑和方法 | |
ZA200703763B (en) | Line protecting apparatus | |
GB0522150D0 (en) | Projection apparatus and method | |
GB0513051D0 (en) | Copy protection method and apparatus | |
SG112969A1 (en) | Lithographic apparatus and methods for use thereof | |
SG122005A1 (en) | Lithographic apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20150721 |