HK1097005A1 - Refining method of copper chloride etching waste fluid and refined copper chloride - Google Patents

Refining method of copper chloride etching waste fluid and refined copper chloride

Info

Publication number
HK1097005A1
HK1097005A1 HK07101668.2A HK07101668A HK1097005A1 HK 1097005 A1 HK1097005 A1 HK 1097005A1 HK 07101668 A HK07101668 A HK 07101668A HK 1097005 A1 HK1097005 A1 HK 1097005A1
Authority
HK
Hong Kong
Prior art keywords
copper chloride
waste fluid
refining method
etching waste
refined
Prior art date
Application number
HK07101668.2A
Inventor
Shiroshi Matsuki
Original Assignee
Tsurumisoda Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tsurumisoda Co Ltd filed Critical Tsurumisoda Co Ltd
Publication of HK1097005A1 publication Critical patent/HK1097005A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Treatment Of Water By Ion Exchange (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacture And Refinement Of Metals (AREA)
HK07101668.2A 2005-03-31 2007-02-12 Refining method of copper chloride etching waste fluid and refined copper chloride HK1097005A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005103814A JP4664719B2 (en) 2005-03-31 2005-03-31 Purification method of copper chloride etching waste liquid and purified copper chloride solution

Publications (1)

Publication Number Publication Date
HK1097005A1 true HK1097005A1 (en) 2007-06-15

Family

ID=37029926

Family Applications (1)

Application Number Title Priority Date Filing Date
HK07101668.2A HK1097005A1 (en) 2005-03-31 2007-02-12 Refining method of copper chloride etching waste fluid and refined copper chloride

Country Status (5)

Country Link
JP (1) JP4664719B2 (en)
KR (1) KR101247941B1 (en)
CN (1) CN1840738B (en)
HK (1) HK1097005A1 (en)
TW (1) TW200640796A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101149984B1 (en) * 2009-08-21 2012-05-31 신오케미칼 주식회사 Method for preparing high purity copper sulfate pentahydrate containing a trace amount of impurity from waste copper etchant
CN105016373A (en) * 2015-08-03 2015-11-04 沈国强 Method for producing copper chloride through waste etching liquid containing copper
CN108914128A (en) * 2018-07-09 2018-11-30 南京舜业环保科技有限公司 A kind of the regeneration cycle system and method for recycling of sulfuric acid copper etchant solution
CN109133497A (en) * 2018-08-02 2019-01-04 深圳市华星光电技术有限公司 Liquid waste treating apparatus and method for treating waste liquid
CN112607762B (en) * 2020-12-29 2022-09-27 东江环保股份有限公司 Preparation method of electronic-grade copper chloride dihydrate
CN112939055A (en) * 2021-01-25 2021-06-11 湖北林泰环境科技有限公司 Method for producing copper chloride by using waste acidic etching solution
CN113023846B (en) * 2021-03-01 2023-04-07 哈尔滨工业大学 Small-sized electric adsorption system for drinking underground water treatment and use method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59157294A (en) * 1983-02-28 1984-09-06 Nippon Mining Co Ltd Method for removing bismuth from copper electrolytic solution
JP2784213B2 (en) * 1989-07-25 1998-08-06 三菱重工業株式会社 Treatment of wastewater containing high concentration iron
JPH05179465A (en) * 1991-12-27 1993-07-20 Tsurumi Soda Kk Method for removing halogen radical in copper halide solution
JPH05221655A (en) * 1992-02-15 1993-08-31 Mitsubishi Heavy Ind Ltd Recovery of iron chloride in aqueous hydrochloric acid
CN1035109C (en) * 1994-11-04 1997-06-11 深圳市工业废物处理站 Process for producing cuprous chloride using waste etching liquid of copper chloride plate
JP4323078B2 (en) * 2000-09-29 2009-09-02 ソニー株式会社 High purity iron and method for producing the same, and high purity iron target
MXPA02003701A (en) * 2001-04-17 2005-11-28 Sbr Ventures Llc Process to remove ferric iron impurities from an acidic aqueous solution used in the electro-winning of copper.
JP2003147452A (en) * 2001-11-12 2003-05-21 Sumitomo Metal Mining Co Ltd Method for refining nickel chloride solution
JP4294253B2 (en) * 2002-03-18 2009-07-08 オルガノ株式会社 Method for removing anionic metal complex

Also Published As

Publication number Publication date
JP2006283102A (en) 2006-10-19
KR101247941B1 (en) 2013-04-01
TW200640796A (en) 2006-12-01
KR20060105530A (en) 2006-10-11
CN1840738B (en) 2010-05-12
CN1840738A (en) 2006-10-04
TWI334853B (en) 2010-12-21
JP4664719B2 (en) 2011-04-06

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