HK1061594A1 - Image acquisition apparatus - Google Patents

Image acquisition apparatus

Info

Publication number
HK1061594A1
HK1061594A1 HK04104384A HK04104384A HK1061594A1 HK 1061594 A1 HK1061594 A1 HK 1061594A1 HK 04104384 A HK04104384 A HK 04104384A HK 04104384 A HK04104384 A HK 04104384A HK 1061594 A1 HK1061594 A1 HK 1061594A1
Authority
HK
Hong Kong
Prior art keywords
image acquisition
acquisition apparatus
image
acquisition
Prior art date
Application number
HK04104384A
Other languages
English (en)
Inventor
Tsuyoshi Toyoshima
Shigeru Morikawa
Yasushi Mizutani
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001193275A external-priority patent/JP4059470B2/ja
Priority claimed from JP2001199134A external-priority patent/JP2003018356A/ja
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Publication of HK1061594A1 publication Critical patent/HK1061594A1/xx

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2605—Measuring capacitance

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Human Computer Interaction (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • Evolutionary Computation (AREA)
  • Data Mining & Analysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Artificial Intelligence (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Image Input (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Facsimile Heads (AREA)
HK04104384A 2001-06-26 2004-06-16 Image acquisition apparatus HK1061594A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001193275A JP4059470B2 (ja) 2001-06-26 2001-06-26 読取装置
JP2001199134A JP2003018356A (ja) 2001-06-29 2001-06-29 画像読取装置
PCT/JP2002/005654 WO2003001438A1 (en) 2001-06-26 2002-06-07 Image acquisition apparatus

Publications (1)

Publication Number Publication Date
HK1061594A1 true HK1061594A1 (en) 2004-09-24

Family

ID=26617577

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04104384A HK1061594A1 (en) 2001-06-26 2004-06-16 Image acquisition apparatus

Country Status (9)

Country Link
US (1) US6815657B2 (zh)
EP (1) EP1399876B1 (zh)
KR (1) KR20030038716A (zh)
CN (1) CN1282118C (zh)
AU (1) AU2002304241B2 (zh)
CA (1) CA2419678C (zh)
HK (1) HK1061594A1 (zh)
TW (1) TWI222604B (zh)
WO (1) WO2003001438A1 (zh)

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JP2003148906A (ja) * 2001-11-13 2003-05-21 Toko Inc 静電容量型センサ装置
AT410844B (de) * 2002-03-25 2003-08-25 Christian Stockinger Messvorrichtung und methode zur ermittlung von ungenauem anlegen von sensoren und reduzierung von messfehlern für robuste messsysteme für z.b. physiologische messgrössen
US7760921B2 (en) * 2002-12-19 2010-07-20 Casio Computer Co., Ltd. Pressure activated fingerprint input apparatus
US20040188720A1 (en) * 2003-03-25 2004-09-30 Chew Kenneth S. Bit-cell and method for programming
US7684754B2 (en) 2003-06-03 2010-03-23 Microsoft Corporation Capacitive bonding of devices
US7822983B2 (en) * 2003-08-21 2010-10-26 Microsoft Corporation Physical device bonding
JP2005100197A (ja) * 2003-09-26 2005-04-14 Aruze Corp 識別センサ及び識別装置
KR100722570B1 (ko) * 2004-03-26 2007-05-28 가시오게산키 가부시키가이샤 화상판독장치, 화상판독장치를 구비한 화상판독시스템
FR2872318B1 (fr) * 2004-06-23 2006-09-22 Sagem Dispositif optique de capture biometrique par contact et installation mettant en oeuvre un tel dispositif
DE102005004108B4 (de) * 2005-01-28 2007-04-12 Infineon Technologies Ag Halbleiterschaltung sowie Anordnung und Verfahren zur Kontrolle von Schmelzelementen einer Halbleiterschaltung
AT502349B1 (de) * 2005-08-29 2008-07-15 Frequentis Gmbh Verfahren zur auswertung von touch-signalen und touch-einheit
JP2007117397A (ja) * 2005-10-27 2007-05-17 Nec Lcd Technologies Ltd 生体センサー
US7312625B1 (en) * 2006-06-08 2007-12-25 Xilinx, Inc. Test circuit and method of use thereof for the manufacture of integrated circuits
FI20085475A0 (fi) * 2008-05-19 2008-05-19 Senseg Oy Kosketuslaiteliitäntä
WO2009037379A1 (en) 2007-09-18 2009-03-26 Senseg Oy Method and apparatus for sensory stimulation
US7774070B2 (en) * 2008-01-10 2010-08-10 Hill Laboratories Company Medical electrode assembly for electrotherapy and phototherapy treatment
WO2010037894A1 (en) * 2008-10-03 2010-04-08 Senseg Oy Techniques for presenting vehicle-related information
US20110109584A1 (en) * 2009-11-12 2011-05-12 Jukka Linjama Tactile stimulation apparatus having a composite section comprising a semiconducting material
US8766933B2 (en) * 2009-11-12 2014-07-01 Senseg Ltd. Tactile stimulation apparatus having a composite section comprising a semiconducting material
JP5136544B2 (ja) * 2009-12-16 2013-02-06 三菱電機株式会社 半導体装置
EP2596478B1 (en) 2010-07-19 2019-09-04 Risst Ltd. Fingerprint sensors and systems incorporating fingerprint sensors
JP5458443B2 (ja) 2010-09-14 2014-04-02 株式会社ジャパンディスプレイ タッチ検出機能付き表示装置、および電子機器
US8564314B2 (en) 2010-11-02 2013-10-22 Atmel Corporation Capacitive touch sensor for identifying a fingerprint
FR2987959B1 (fr) * 2012-03-06 2014-03-14 Soitec Silicon On Insulator Multiplexeur, table de correspondance et fgpa
FR2988176B1 (fr) * 2012-03-13 2014-11-21 Nanotec Solution Procede de mesure capacitive entre un objet et un plan d’electrodes par demodulation synchrone partielle
US9740343B2 (en) 2012-04-13 2017-08-22 Apple Inc. Capacitive sensing array modulation
US9030440B2 (en) 2012-05-18 2015-05-12 Apple Inc. Capacitive sensor packaging
NL2012891B1 (en) 2013-06-05 2016-06-21 Apple Inc Biometric sensor chip having distributed sensor and control circuitry.
US9883822B2 (en) 2013-06-05 2018-02-06 Apple Inc. Biometric sensor chip having distributed sensor and control circuitry
US9984270B2 (en) 2013-08-05 2018-05-29 Apple Inc. Fingerprint sensor in an electronic device
US9460332B1 (en) 2013-09-09 2016-10-04 Apple Inc. Capacitive fingerprint sensor including an electrostatic lens
US10296773B2 (en) 2013-09-09 2019-05-21 Apple Inc. Capacitive sensing array having electrical isolation
US9697409B2 (en) 2013-09-10 2017-07-04 Apple Inc. Biometric sensor stack structure
USD776664S1 (en) * 2015-05-20 2017-01-17 Chaya Coleena Hendrick Smart card
CN105095883B (zh) * 2015-08-28 2019-08-06 京东方科技集团股份有限公司 一种显示面板及其指纹识别的控制方法
TWI591548B (zh) * 2016-04-12 2017-07-11 友達光電股份有限公司 指紋感測器
CN105975963B (zh) * 2016-06-30 2019-06-07 京东方科技集团股份有限公司 一种指纹识别基板及其制备方法、显示面板和显示装置
TWI636393B (zh) * 2017-07-31 2018-09-21 敦泰電子有限公司 內嵌式光學指紋辨識顯示裝置
CN108227993B (zh) * 2018-01-04 2021-01-26 京东方科技集团股份有限公司 压电检测电路、阵列、触摸面板和方法
TWI679431B (zh) * 2018-07-31 2019-12-11 友達光電股份有限公司 指紋感測裝置及其檢測方法
CN111126351B (zh) * 2020-01-21 2024-02-09 北京京东方光电科技有限公司 指纹识别模组

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US5708497A (en) * 1995-08-15 1998-01-13 Nec Corporation Fingerprint image input apparatus and method of producing the same
US5940526A (en) 1997-05-16 1999-08-17 Harris Corporation Electric field fingerprint sensor having enhanced features and related methods
JP3898330B2 (ja) * 1998-03-12 2007-03-28 カシオ計算機株式会社 読取装置
US6628812B1 (en) 1999-05-11 2003-09-30 Authentec, Inc. Fingerprint sensor package having enhanced electrostatic discharge protection and associated methods

Also Published As

Publication number Publication date
WO2003001438A1 (en) 2003-01-03
CN1463409A (zh) 2003-12-24
AU2002304241B2 (en) 2006-02-02
CA2419678C (en) 2008-04-01
US6815657B2 (en) 2004-11-09
CN1282118C (zh) 2006-10-25
US20020196036A1 (en) 2002-12-26
EP1399876A1 (en) 2004-03-24
EP1399876B1 (en) 2014-11-19
KR20030038716A (ko) 2003-05-16
TWI222604B (en) 2004-10-21
CA2419678A1 (en) 2003-01-03

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180607