HK1059808A1 - Setting structure for setting laying floor materials - Google Patents

Setting structure for setting laying floor materials

Info

Publication number
HK1059808A1
HK1059808A1 HK04100991A HK04100991A HK1059808A1 HK 1059808 A1 HK1059808 A1 HK 1059808A1 HK 04100991 A HK04100991 A HK 04100991A HK 04100991 A HK04100991 A HK 04100991A HK 1059808 A1 HK1059808 A1 HK 1059808A1
Authority
HK
Hong Kong
Prior art keywords
setting
floor materials
laying floor
setting structure
materials
Prior art date
Application number
HK04100991A
Inventor
Yusho Nakamoto
Katsunori Sako
Seiji Tamura
Makoto Mineoka
Tomoyuki Matsumae
Original Assignee
Juken Sangyo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP9040006A external-priority patent/JPH10219975A/en
Priority claimed from JP27376297A external-priority patent/JP3406203B2/en
Application filed by Juken Sangyo filed Critical Juken Sangyo
Publication of HK1059808A1 publication Critical patent/HK1059808A1/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/02038—Flooring or floor layers composed of a number of similar elements characterised by tongue and groove connections between neighbouring flooring elements
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2201/00—Joining sheets or plates or panels
    • E04F2201/02—Non-undercut connections, e.g. tongue and groove connections
    • E04F2201/023—Non-undercut connections, e.g. tongue and groove connections with a continuous tongue or groove
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F2201/00—Joining sheets or plates or panels
    • E04F2201/04—Other details of tongues or grooves

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Floor Finish (AREA)
HK04100991A 1997-02-07 2004-02-13 Setting structure for setting laying floor materials HK1059808A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9040006A JPH10219975A (en) 1997-02-07 1997-02-07 Setting structure of setting laying floor material
JP27376297A JP3406203B2 (en) 1997-09-19 1997-09-19 Floor structure for floor heating

Publications (1)

Publication Number Publication Date
HK1059808A1 true HK1059808A1 (en) 2004-07-16

Family

ID=26379426

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04100991A HK1059808A1 (en) 1997-02-07 2004-02-13 Setting structure for setting laying floor materials

Country Status (3)

Country Link
KR (1) KR100571293B1 (en)
CN (2) CN1110612C (en)
HK (1) HK1059808A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200361912Y1 (en) * 2004-06-30 2004-09-14 주식회사 엘지화학 Plate-shaped heating panel in which space elements are fasten by resin
CN100398765C (en) * 2005-02-25 2008-07-02 天津锐新科技开发有限公司 Air conditioning type floor capable of replacing surface layer
KR100762943B1 (en) * 2006-05-19 2007-10-02 주식회사 한솔홈데코 Sectional floorings with coupling member and assembling method thereof
KR100878141B1 (en) * 2008-04-11 2009-01-12 (주)그린아트산업 Wood deck for preventing modification
CN102373783A (en) * 2010-08-10 2012-03-14 吕锋滨 Connection component for electric heating floor
CN102226353A (en) * 2011-04-15 2011-10-26 李渊 Cold and hot decorative plate
KR101754194B1 (en) * 2016-02-22 2017-07-19 주식회사 한샘 An unbonded and floor-contact assembly floor plate wherein the installation, removal and maintenance are improved, and a contact installation method of floor plate using thereof
CN106906983B (en) * 2017-03-24 2022-12-02 扬州富铭新材料有限公司 Plastic floor with positioning substrate
KR102105082B1 (en) * 2019-05-20 2020-04-29 (주)스테이지프라임 Prefabricated panel for thrust stage
CN110409751B (en) * 2019-08-29 2024-05-24 南京林业大学 Electric heating system for solid wood floor and installation method thereof
CN110779068B (en) * 2019-10-26 2021-09-10 天一建设发展有限公司 House floor heating structure and construction method thereof
KR102196877B1 (en) * 2020-06-24 2020-12-30 (주)허그컴퍼니 Assembly mat
EP4298294A1 (en) 2021-02-23 2024-01-03 Dalla Riva Srl Coupling system for wooden panels for the construction of removable sports flooring
CN115233932A (en) * 2022-08-11 2022-10-25 厦门万里石建筑装饰工程有限公司 Novel marble stone paving method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4169688A (en) * 1976-03-15 1979-10-02 Sato Toshio Artificial skating-rink floor
AT378846B (en) * 1978-06-28 1985-10-10 Pvg Patentverwertung FLOOR HEATING
DE7921324U1 (en) * 1979-07-26 1981-01-29 Baufa-Werke Richard Rinker, 5750 Menden Ceiling heater for the air conditioning of rooms, gyms and the like
DE8022673U1 (en) * 1980-08-26 1981-01-08 Feist, Artus, 5060 Bergisch Gladbach Support rail for the heating pipes of an underfloor heating system
DE3116872A1 (en) * 1981-04-28 1982-11-11 Thermoval Fußbodenheizungen Entwicklungs- und Forschungsgesellschaft mbH, 1150 Wien Air-conditioning floor
US4461131A (en) * 1982-05-21 1984-07-24 Aar Corporation Panel interconnection system
US4819932A (en) * 1986-02-28 1989-04-11 Trotter Jr Phil Aerobic exercise floor system
JPS6414839U (en) * 1987-07-18 1989-01-25
CN2059216U (en) * 1989-12-06 1990-07-11 朴文奉 Multi-functional household boiler
DK207191D0 (en) * 1991-12-27 1991-12-27 Junckers As DEVICE FOR USE IN JOINING FLOORS
JP2900115B2 (en) * 1993-02-02 1999-06-02 未来工業 株式会社 Wiring / pipe floor structure and floor support used for it
DE4427147A1 (en) * 1994-07-30 1996-02-01 Hewing Gmbh Layable pipe arrangement
JP3563877B2 (en) * 1996-06-21 2004-09-08 三菱電機株式会社 Semiconductor device

Also Published As

Publication number Publication date
CN1110612C (en) 2003-06-04
CN1448602A (en) 2003-10-15
CN1191261A (en) 1998-08-26
KR19980071115A (en) 1998-10-26
CN1318712C (en) 2007-05-30
KR100571293B1 (en) 2006-10-11

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Legal Events

Date Code Title Description
PE Patent expired

Effective date: 20180205