HK1056390A1 - Electro-explosive device with laminate bridge and method of fabricating said bridge - Google Patents

Electro-explosive device with laminate bridge and method of fabricating said bridge

Info

Publication number
HK1056390A1
HK1056390A1 HK03108838A HK03108838A HK1056390A1 HK 1056390 A1 HK1056390 A1 HK 1056390A1 HK 03108838 A HK03108838 A HK 03108838A HK 03108838 A HK03108838 A HK 03108838A HK 1056390 A1 HK1056390 A1 HK 1056390A1
Authority
HK
Hong Kong
Prior art keywords
bridge
laminate layer
insulating material
laminate
scb
Prior art date
Application number
HK03108838A
Inventor
Thomas A Baginski
Todd S Parker
Wm David Fahey
Original Assignee
Nknm Ltd
Univ Auburn
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nknm Ltd, Univ Auburn filed Critical Nknm Ltd
Publication of HK1056390A1 publication Critical patent/HK1056390A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42—AMMUNITION; BLASTING
    • F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B3/00—Blasting cartridges, i.e. case and explosive
    • F42B3/10—Initiators therefor
    • F42B3/195—Manufacture
    • F42B3/198—Manufacture of electric initiator heads e.g., testing, machines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42—AMMUNITION; BLASTING
    • F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B3/00—Blasting cartridges, i.e. case and explosive
    • F42B3/10—Initiators therefor
    • F42B3/12—Bridge initiators
    • F42B3/13—Bridge initiators with semiconductive bridge

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Air Bags (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
  • Laminated Bodies (AREA)
  • Yarns And Mechanical Finishing Of Yarns Or Ropes (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Treatment Of Fiber Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

A semiconductor bridge (SCB) device. In one embodiment, the SCB device (10) includes a laminate layer on top of an insulating material, wherein the laminate layer comprises a series of layers (107, 108) of at least two reactive materials, and wherein the laminate layer comprises two relatively large sections that substantially cover the surface area of the insulating material, and a bridge section (106) joining the two relatively large sections. At least one conductive contact pad is coupled to at least one of the series of layers, wherein a predetermined current through the conductive contact pad causes the bridge section to initiate a reaction in which the laminate layer is involved. In one embodiment, the SCB device includes an integrated diode (102) formed by an interface of the insulating material with another material, such as a metal.
HK03108838A 2000-09-07 2003-12-04 Electro-explosive device with laminate bridge and method of fabricating said bridge HK1056390A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65652300A 2000-09-07 2000-09-07
PCT/US2001/028193 WO2002021067A2 (en) 2000-09-07 2001-09-07 Electro-explosive device with laminate bridge

Publications (1)

Publication Number Publication Date
HK1056390A1 true HK1056390A1 (en) 2004-02-13

Family

ID=24633395

Family Applications (1)

Application Number Title Priority Date Filing Date
HK03108838A HK1056390A1 (en) 2000-09-07 2003-12-04 Electro-explosive device with laminate bridge and method of fabricating said bridge

Country Status (8)

Country Link
EP (1) EP1315941B1 (en)
JP (1) JP4848118B2 (en)
KR (1) KR100722721B1 (en)
AT (1) ATE322664T1 (en)
AU (1) AU2001292596A1 (en)
DE (1) DE60118581T2 (en)
HK (1) HK1056390A1 (en)
WO (1) WO2002021067A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT410316B (en) * 2001-02-23 2003-03-25 Hirtenberger Automotive Safety PYROTECHNICAL IGNITER AND METHOD FOR THE PRODUCTION THEREOF
ATE520003T1 (en) 2004-10-04 2011-08-15 Nippon Kayaku Kk SEMICONDUCTOR BRIDGE CIRCUIT DEVICE AND IGNITION DEVICE CONTAINED THEREOF
JP2006138510A (en) * 2004-11-10 2006-06-01 Nippon Kayaku Co Ltd Non-initiating explosive electric detonator
JP4917801B2 (en) * 2005-12-16 2012-04-18 日油技研工業株式会社 Small thrust generator
CN113314470B (en) * 2021-05-12 2024-04-05 湘潭大学 Self-destructible chip device packaging structure and method for integrated energetic semiconductor bridge

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4977105A (en) 1988-03-15 1990-12-11 Mitsubishi Denki Kabushiki Kaisha Method for manufacturing interconnection structure in semiconductor device
US5370054A (en) * 1992-10-01 1994-12-06 The United States Of America As Represented By The Secretary Of The Army Semiconductor slapper
JP3447336B2 (en) * 1993-08-27 2003-09-16 進工業株式会社 Thin film firing element
US6133146A (en) * 1996-05-09 2000-10-17 Scb Technologies, Inc. Semiconductor bridge device and method of making the same
US5831203A (en) * 1997-03-07 1998-11-03 The Ensign-Bickford Company High impedance semiconductor bridge detonator
WO1998054535A1 (en) * 1997-05-26 1998-12-03 Temic Telefunken Microelectronic Gmbh Thin layer igniter element for active pyrotechnic materials and method for the production thereof

Also Published As

Publication number Publication date
ATE322664T1 (en) 2006-04-15
EP1315941B1 (en) 2006-04-05
DE60118581D1 (en) 2006-05-18
JP2004513319A (en) 2004-04-30
WO2002021067A2 (en) 2002-03-14
KR100722721B1 (en) 2007-05-29
AU2001292596A1 (en) 2002-03-22
KR20030034174A (en) 2003-05-01
EP1315941A2 (en) 2003-06-04
DE60118581T2 (en) 2007-06-21
WO2002021067A3 (en) 2002-06-13
JP4848118B2 (en) 2011-12-28
WO2002021067A9 (en) 2003-03-20

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180907