HK1028158A1 - Via pad geometry supporting uniform transmission line structures. - Google Patents
Via pad geometry supporting uniform transmission line structures.Info
- Publication number
- HK1028158A1 HK1028158A1 HK00107474A HK00107474A HK1028158A1 HK 1028158 A1 HK1028158 A1 HK 1028158A1 HK 00107474 A HK00107474 A HK 00107474A HK 00107474 A HK00107474 A HK 00107474A HK 1028158 A1 HK1028158 A1 HK 1028158A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- transmission line
- line structures
- via pad
- uniform transmission
- pad geometry
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/959,244 US6111205A (en) | 1997-10-28 | 1997-10-28 | Via pad geometry supporting uniform transmission line structures |
PCT/US1998/017397 WO1999022552A1 (en) | 1997-10-28 | 1998-08-20 | Via pad geometry supporting uniform transmission line structures |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1028158A1 true HK1028158A1 (en) | 2001-02-02 |
Family
ID=25501830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK00107474A HK1028158A1 (en) | 1997-10-28 | 2000-11-22 | Via pad geometry supporting uniform transmission line structures. |
Country Status (7)
Country | Link |
---|---|
US (1) | US6111205A (xx) |
EP (1) | EP1029431B1 (xx) |
AU (1) | AU9113498A (xx) |
DE (1) | DE69828900T2 (xx) |
HK (1) | HK1028158A1 (xx) |
TW (1) | TW389008B (xx) |
WO (1) | WO1999022552A1 (xx) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6429528B1 (en) * | 1998-02-27 | 2002-08-06 | Micron Technology, Inc. | Multichip semiconductor package |
US6950891B1 (en) * | 1999-12-14 | 2005-09-27 | Intel Corporation | Signal routing between a memory control unit and a memory device |
US20030011390A1 (en) * | 2001-07-09 | 2003-01-16 | Smith Douglas W. | Interface apparatus for integrated circuit testing |
US6870276B1 (en) * | 2001-12-26 | 2005-03-22 | Micron Technology, Inc. | Apparatus for supporting microelectronic substrates |
TW550991B (en) * | 2002-02-06 | 2003-09-01 | Via Tech Inc | Multi-layered substrate having voltage reference signal circuit layout |
US6875930B2 (en) * | 2002-04-18 | 2005-04-05 | Hewlett-Packard Development Company, L.P. | Optimized conductor routing for multiple components on a printed circuit board |
US7084354B2 (en) * | 2002-06-14 | 2006-08-01 | Intel Corporation | PCB method and apparatus for producing landless interconnects |
US7034544B2 (en) * | 2003-06-30 | 2006-04-25 | Intel Corporation | Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby |
US20060220167A1 (en) * | 2005-03-31 | 2006-10-05 | Intel Corporation | IC package with prefabricated film capacitor |
EP2235750A1 (en) * | 2007-11-27 | 2010-10-06 | Nxp B.V. | Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structure |
US9553040B2 (en) | 2012-03-27 | 2017-01-24 | Mediatek Inc. | Semiconductor package |
US10398025B2 (en) * | 2017-11-09 | 2019-08-27 | International Business Machines Corporation | Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly |
US10321564B2 (en) | 2017-11-09 | 2019-06-11 | International Business Machines Corporation | Solder assembly of pins to the peripheral end face of a printed circuit board |
CN113079634B (zh) * | 2020-05-29 | 2022-11-18 | 新华三技术有限公司合肥分公司 | 一种电路板及其制备工艺 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3033914A (en) * | 1960-04-20 | 1962-05-08 | Gen Electric | Printed circuit boards |
US3398232A (en) * | 1965-10-19 | 1968-08-20 | Amp Inc | Circuit board with interconnected signal conductors and interconnected shielding conductors |
GB1589519A (en) * | 1976-11-19 | 1981-05-13 | Solartron Electronic Group | Printed circuits |
IT211826Z2 (it) * | 1987-09-15 | 1989-05-25 | Microset Srl | Scheda madre a circuito stampato per bus di microprocessori. |
US5272600A (en) * | 1992-09-02 | 1993-12-21 | Microelectronics And Computer Technology Corporation | Electrical interconnect device with interwoven power and ground lines and capacitive vias |
US5764489A (en) * | 1996-07-18 | 1998-06-09 | Compaq Computer Corporation | Apparatus for controlling the impedance of high speed signals on a printed circuit board |
-
1997
- 1997-10-28 US US08/959,244 patent/US6111205A/en not_active Expired - Lifetime
-
1998
- 1998-08-20 AU AU91134/98A patent/AU9113498A/en not_active Abandoned
- 1998-08-20 EP EP98943307A patent/EP1029431B1/en not_active Expired - Lifetime
- 1998-08-20 WO PCT/US1998/017397 patent/WO1999022552A1/en active IP Right Grant
- 1998-08-20 DE DE69828900T patent/DE69828900T2/de not_active Expired - Fee Related
- 1998-10-06 TW TW087116564A patent/TW389008B/zh not_active IP Right Cessation
-
2000
- 2000-11-22 HK HK00107474A patent/HK1028158A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US6111205A (en) | 2000-08-29 |
EP1029431B1 (en) | 2005-02-02 |
TW389008B (en) | 2000-05-01 |
EP1029431A4 (en) | 2002-07-24 |
DE69828900D1 (de) | 2005-03-10 |
AU9113498A (en) | 1999-05-17 |
WO1999022552A1 (en) | 1999-05-06 |
EP1029431A1 (en) | 2000-08-23 |
DE69828900T2 (de) | 2006-01-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20100820 |