HK1021070A1 - Plasma processing apparatus and method - Google Patents

Plasma processing apparatus and method

Info

Publication number
HK1021070A1
HK1021070A1 HK00100026A HK00100026A HK1021070A1 HK 1021070 A1 HK1021070 A1 HK 1021070A1 HK 00100026 A HK00100026 A HK 00100026A HK 00100026 A HK00100026 A HK 00100026A HK 1021070 A1 HK1021070 A1 HK 1021070A1
Authority
HK
Hong Kong
Prior art keywords
processing apparatus
plasma processing
plasma
processing
Prior art date
Application number
HK00100026A
Other languages
English (en)
Inventor
Yasushi Sawada
Keiichi Yamazaki
Yoshitami Inoue
Sachiko Okazaki
Masuhiro Kogoma
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of HK1021070A1 publication Critical patent/HK1021070A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32366—Localised processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/26—Plasma torches
    • H05H1/28—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
    • H05H1/245—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube the plasma being activated using internal electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/4697—Generating plasma using glow discharges
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H2245/00—Applications of plasma devices
    • H05H2245/40—Surface treatments

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Fluid Mechanics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
HK00100026A 1997-12-03 2000-01-04 Plasma processing apparatus and method HK1021070A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33332597 1997-12-03

Publications (1)

Publication Number Publication Date
HK1021070A1 true HK1021070A1 (en) 2000-05-26

Family

ID=18264857

Family Applications (1)

Application Number Title Priority Date Filing Date
HK00100026A HK1021070A1 (en) 1997-12-03 2000-01-04 Plasma processing apparatus and method

Country Status (5)

Country Link
EP (1) EP0921713A3 (xx)
KR (1) KR100365898B1 (xx)
CN (1) CN1121810C (xx)
HK (1) HK1021070A1 (xx)
TW (1) TW503263B (xx)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1073091A3 (en) * 1999-07-27 2004-10-06 Matsushita Electric Works, Ltd. Electrode for plasma generation, plasma treatment apparatus using the electrode, and plasma treatment with the apparatus
GB0309932D0 (en) * 2003-04-30 2003-06-04 Boc Group Plc Apparatus and method for forming a plasma
JP5180585B2 (ja) * 2004-11-05 2013-04-10 ダウ・コーニング・アイルランド・リミテッド プラズマ処理装置及び方法
EP1689216A1 (en) * 2005-02-04 2006-08-09 Vlaamse Instelling Voor Technologisch Onderzoek (Vito) Atmospheric-pressure plasma jet
US7162317B2 (en) * 2005-02-25 2007-01-09 Lam Research Corporation Methods and apparatus for configuring plasma cluster tools
CN100482031C (zh) * 2006-03-14 2009-04-22 中国科学院物理研究所 一种大气压介质阻挡辉光放电等离子体发生方法及装置
TW200816880A (en) 2006-05-30 2008-04-01 Matsushita Electric Ind Co Ltd Atmospheric pressure plasma generating method, plasma processing method and component mounting method using same, and device using these methods
JP4682917B2 (ja) * 2006-05-30 2011-05-11 パナソニック株式会社 大気圧プラズマ発生方法及び装置
CN100405879C (zh) * 2006-06-07 2008-07-23 清华大学 基于双气体源的大气压放电冷等离子体发生器
US8367227B2 (en) * 2007-08-02 2013-02-05 Applied Materials, Inc. Plasma-resistant ceramics with controlled electrical resistivity
US9475710B2 (en) 2013-03-14 2016-10-25 North Carolina State University Very high frequency (VHF) driven atmospheric plasma sources and point of use fertigation of irrigation water utilizing plasma production of nitrogen bearing species
KR101603787B1 (ko) * 2013-09-10 2016-03-18 가천대학교 산학협력단 표면 처리 장치 및 표면 처리 방법
GB201413236D0 (en) 2014-07-25 2014-09-10 Smiths Detection Watford Ltd Method and apparatus
CN104607438A (zh) * 2014-12-12 2015-05-13 中山大学 一种非热电弧等离子体裂解废电路板装置
CN105755452B (zh) * 2016-04-18 2019-01-15 北京大学 一种用于在管腔内壁喷涂TiO2纳米涂层的装置
CN107509298B (zh) * 2017-09-28 2024-04-05 博奥生物集团有限公司 一种阵列式大面积冷等离子体发生器
CN107979907B (zh) * 2017-12-26 2024-04-05 中国科学院西安光学精密机械研究所 大气压介质阻挡放电增强型直流交替电极低温等离子体射流阵列
KR102245712B1 (ko) * 2019-06-24 2021-04-28 성균관대학교산학협력단 나노입자 코팅 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2657850B2 (ja) * 1990-10-23 1997-09-30 株式会社半導体エネルギー研究所 プラズマ発生装置およびそれを用いたエッチング方法
JP3104047B2 (ja) * 1992-08-07 2000-10-30 イーシー化学株式会社 大気圧グロ−放電プラズマ用電極
JPH0729892A (ja) * 1993-07-14 1995-01-31 Nissin Electric Co Ltd 電極温調機構
JPH09213685A (ja) * 1996-01-30 1997-08-15 Hitachi Electron Eng Co Ltd 半導体装置用プラズマ装置のプラズマ電極

Also Published As

Publication number Publication date
EP0921713A3 (en) 1999-08-11
KR19990062781A (ko) 1999-07-26
CN1121810C (zh) 2003-09-17
EP0921713A2 (en) 1999-06-09
CN1221967A (zh) 1999-07-07
KR100365898B1 (ko) 2003-02-19
TW503263B (en) 2002-09-21

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20101203