HK1016745A1 - An encapsulated optoelectrical component and method of manufacturing the same - Google Patents

An encapsulated optoelectrical component and method of manufacturing the same

Info

Publication number
HK1016745A1
HK1016745A1 HK98112127A HK98112127A HK1016745A1 HK 1016745 A1 HK1016745 A1 HK 1016745A1 HK 98112127 A HK98112127 A HK 98112127A HK 98112127 A HK98112127 A HK 98112127A HK 1016745 A1 HK1016745 A1 HK 1016745A1
Authority
HK
Hong Kong
Prior art keywords
encapsulated
manufacturing
same
optoelectrical component
optoelectrical
Prior art date
Application number
HK98112127A
Other languages
English (en)
Inventor
Odd Steijer
Josef Bakszt
Paul Eriksen
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of HK1016745A1 publication Critical patent/HK1016745A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G02B6/4253—Sealed packages by embedding housing components in an adhesive or a polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4262—Details of housings characterised by the shape of the housing
    • G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4283—Electrical aspects with electrical insulation means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
HK98112127A 1995-04-28 1998-11-19 An encapsulated optoelectrical component and method of manufacturing the same HK1016745A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9501593A SE516160C2 (sv) 1995-04-28 1995-04-28 Kapslad optoelektronisk komponent
PCT/SE1996/000554 WO1996034413A1 (en) 1995-04-28 1996-04-26 Encapsulation of transmitter and receiver modules

Publications (1)

Publication Number Publication Date
HK1016745A1 true HK1016745A1 (en) 1999-11-05

Family

ID=20398140

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98112127A HK1016745A1 (en) 1995-04-28 1998-11-19 An encapsulated optoelectrical component and method of manufacturing the same

Country Status (10)

Country Link
US (1) US6172425B1 (sv)
EP (1) EP0823130A1 (sv)
JP (1) JPH11504165A (sv)
KR (1) KR100372034B1 (sv)
CN (1) CN1123069C (sv)
AU (1) AU5521296A (sv)
CA (1) CA2216903A1 (sv)
HK (1) HK1016745A1 (sv)
SE (1) SE516160C2 (sv)
WO (1) WO1996034413A1 (sv)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9103262D0 (en) * 1991-02-15 1991-08-21 Marconi Gec Ltd Optical systems
US6542720B1 (en) * 1999-03-01 2003-04-01 Micron Technology, Inc. Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices
EP1447696B1 (de) * 2003-02-04 2008-07-30 Avago Technologies Fiber IP (Singapore) Pte. Ltd. Modulares optoelektronisches Bauelement
EP1455208A1 (en) * 2003-03-05 2004-09-08 Agilent Technologies, Inc. - a Delaware corporation - Electrical connection arrangement, component and method, for instance for high speed optical transceivers
CN102157630B (zh) * 2010-12-28 2012-06-20 哈尔滨工业大学 单基板多芯片组大功率led封装一次键合方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2582013B2 (ja) * 1991-02-08 1997-02-19 株式会社東芝 樹脂封止型半導体装置及びその製造方法
US5199093A (en) * 1990-05-22 1993-03-30 Bicc Plc. Multi-part optical fibre connectors
US5245216A (en) * 1990-09-11 1993-09-14 Kabushiki Kaisha Toshiba Plastic-molded type semiconductor device
JP2821262B2 (ja) * 1990-11-26 1998-11-05 株式会社日立製作所 電子装置
JPH06204566A (ja) * 1992-10-14 1994-07-22 Fujitsu Ltd 光ファイバ・光素子結合用パッケージ及び光ファイバ・光素子モジュール
US5337398A (en) 1992-11-30 1994-08-09 At&T Bell Laboratories Single in-line optical package
SE513183C2 (sv) * 1994-03-18 2000-07-24 Ericsson Telefon Ab L M Förfarande för framställning av en optokomponent samt kapslad optokomponent
SE514116C2 (sv) 1994-10-19 2001-01-08 Ericsson Telefon Ab L M Förfarande för framställning av en kapslad optokomponent, gjutform för kapsling av en optokomponent och tryckanordning för gjutform
SE9403574L (sv) 1994-10-19 1996-04-20 Ericsson Telefon Ab L M Optokomponentkapsel med optiskt gränssnitt

Also Published As

Publication number Publication date
WO1996034413A1 (en) 1996-10-31
SE516160C2 (sv) 2001-11-26
SE9501593D0 (sv) 1995-04-28
CA2216903A1 (en) 1996-10-31
KR19990008115A (ko) 1999-01-25
SE9501593L (sv) 1996-10-29
CN1183170A (zh) 1998-05-27
JPH11504165A (ja) 1999-04-06
KR100372034B1 (ko) 2003-07-18
AU5521296A (en) 1996-11-18
EP0823130A1 (en) 1998-02-11
CN1123069C (zh) 2003-10-01
US6172425B1 (en) 2001-01-09

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Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20080426