HK1007015B - Card with at least one electronic element and process for manufacturing said card - Google Patents

Description

The present invention relates to a card containing at least one electronic component and a manufacturing process for such a card.

In particular, the present invention concerns a card with no external contact.

The card according to the invention may be used, for example, as a bank card, as an access card to a closed area, or in association with a merchandise dealer.

A map is any object with a substantially flat structure defining a general plan and having some outline in that general plan.

The skilled person is familiar with a card, which includes electronic elements, consisting of a shell containing housing for receiving these electronic elements and a protective outer layer that closes the housing.

A card is also known to have a symmetrical structure and to consist of two shells which are substantially similar, each of which has a structured surface to form housing, intended to receive electronic components when the two shells are assembled.

The manufacturing process for this latter card is generally as follows: First, each shell is manufactured using an injection technique, e.g. hot-molding; second, the electronic components are placed in one of the two shells and the other shell is then placed on top of the first, the whole being assembled by a hot-assembly technique.

The manufacturing process described above has several disadvantages.

In particular, after the hot assembly of the two shells, the electronic components only partially fill the housing. This results in the card having fragile areas in the places where the housing is located, especially when the electronic components incorporated in the card are of relatively large dimensions. For example, when a winding of the order of the card's diameter is planned, such a manufacturing process results in distorted (bombed or hollow) areas on the outer surfaces of the card, which is naturally detrimental to the flatness of the card and to the impressions that can be expected on the outer surfaces of this card.

The document EP-0 350 179 also describes a method of making a card in which two outer layers and an electronic assembly are placed in a mold and a liquid filler is injected into the mold, which, when cured, forms an intermediate layer between the two outer layers.

To increase the speed of production, two chains are planned, each comprising several half-molds connected to each other. These two chains are likely to have a vertical movement and form with two corresponding half-molds, belonging to the two chains respectively, a mold with at least an opening on the top of the mold to allow its filling. Above the place where the two corresponding half-molds are assembled to form a mold, a new nozzle is planned for injecting the filling material in liquid form into the mold to be formed.

The manufacturing process described above is complex and, for high production rates, requires large amounts of equipment, which makes it expensive.

It should be noted that the input of the electronic assembly and its position during injection are not described in the document under consideration and are not clear.

The board obtained by the above manufacturing process and as described in document EP-0 350 179 consists essentially of three layers, namely one intermediate layer and two outer layers.

A major drawback of this card is that the interconnection support and the coil-specific support increase the thickness of the card, making it difficult to obtain a thin card with a thickness of 0.76 mm as prescribed by the ISO standard commonly used for bank cards.

It should also be noted that the manufacturing process proposed for this board does not ensure that the interconnection support and the adjacent outer layer are separated by a layer of filling material, which is detrimental to the good adhesion of this outer layer to the middle layer.

A method for inserting an electronic circuit into a card is also known from FR 2 520 541.

The following steps are envisaged as a first implementation of the process described: In the case of a plate containing a preformed sheath,add in the sheath an electronic circuit assembled to a film-support,add in the sheath a polymerizable resin in order to fill the sheath,add in a coating sheet to close the sheath,polymerize the sheath until it solidifies,press the coating sheet against the sheath and heat to heat both the sheath and the PVC sheet.

The purpose of the present invention is to overcome the disadvantages described above by proposing a method of card manufacture, each containing at least one electronic component contained within a binding, at a low manufacturing cost, while ensuring very good quality cards.

The present invention is concerned with a method of manufacturing a card comprising at least one electronic component, characterized by the following steps: (i) the introduction of a second outer layer of solid material on the first outer layer of the electronic component; (IE) applying pressure to the first and second outer layers and to the binder, which is then at least partially in a non-solid state, until the first and second outer layers are placed at a predetermined distance from each other, the binder then forming, between the first and second outer layers, an intermediate layer in which the said electronic element is contained; (IX) hardening the binder so as to solidify the said intermediate layer, the latter having a predetermined thickness;IF) cutting the outline of the said board so as to form the side walls of the said board.

Another object of the present invention is defined in claim 2.

The above characteristics result in a manufacturing process for the board of the invention which requires neither machining of the outer layers nor injection-preformed shells. The various steps of the manufacturing process for the board of the invention are simple and it is possible to produce boards of the invention in large quantities at low cost.

The method according to the invention makes it possible to produce compact and full cards, i.e. with a very small internal residual air volume.

According to another feature of the manufacturing process of a card according to the invention, it is intended to place, in front of the first outer layer, a positioning structure with an internal area within which the electronic element is positioned.

This additional feature allows the electronic component to be positioned in a predefined inner zone of the binder layer, this positioning structure preventing the electronic component from exiting the intermediate region, defined between the inner surfaces of the first and second outer layers, especially during the IE stage.

In one particular embodiment of the invention, a thin positioning structure is provided with a relief on each of the upper and lower sides, the points of which are located at the outermost points of the median plane defining a thickness approximately equal to the final thickness foreseen for the layer formed by the binding. This positioning structure thus allows the thickness of the binding layer to be defined at the IE stage during which the first and second outer layers are pressed towards each other. In this case, the positioning structure therefore has a positioning function and a function of defining the thickness of the layer formed by the binding and, consequently, the thickness of the board.

According to another feature of the manufacturing process of a board according to the invention, the said binder is formed by a viscous liquid, which curdles preferably at room temperature after the said IE step.

It follows from this that the binder can spread out in such a way as to uniformly fill the intermediate region by enveloping the elements it contains to form the binder layer.

If the positioning structure is either formed by a foam-like honeycomb or by a thin structure with relief on its upper and lower sides, the diffusion of the binder is facilitated and any excess of the binder supplied can be easily removed, thus preventing any harmful overpressure when pressing the two outer layers.

In particular, where the positioning structure is formed by a full frame or where the electronic component is arranged with other electronic components on a substrate, it is envisaged, according to a particular implementation of the process of the invention, that the insertion of the binding material shall be carried out in two phases. The first phase consists of the application of a first part of the binding material to the first outer layer before the insertion of the electronic component and the positioning structure if the latter is envisaged. The second phase consists of an insertion of the second part of the binding material once the electronic component, the inserter and the positioning material have been introduced and placed on the first part of the binding material.

This two-phase binder supply ensures that the various elements contained in the binder layer are completely enveloped by the binder, the inner surfaces of the two outer layers being completely covered by the binder, which ensures a very good cohesion between the binder layer and the two outer layers and therefore a very good cohesion of the board as a whole.

In another implementation of the method of manufacture of a board according to the invention, it is envisaged to use a technique requiring an energy input; in this case, the input binder is formed at least by a solid sheet, which is then melted at least partially by an energy input before the IE step so as to form the intermediate layer after cooling of the binder.

The energy input for melting the sheet may be partially simultaneous with the IE stage during which the two outer layers are pressed towards each other.

Finally, another method of manufacturing a board without outer layers involves placing the electronic component, the positioning structure and the binding directly on a work surface which is not adherent to the binding material and then pressing the binding material with a press which has a surface which is also not adherent to the binding material.

The resulting board has a single layer formed by the binding agent, which can be used as a building block in the manufacture of another board with two outer layers or a shell with a preformed housing to receive this board.

Another object of the present invention is a card, obtained by the process of the present invention, comprising at least one electronic component, a coil and a layer formed by a binder, the characteristic of which is that the said coil has two electrical connection ends directly connected to the said electronic component, the latter forming with the said coil an assembly immersed in the said binder of said layer.

It follows from these characteristics that the board can be very thin, its thickness being barely greater than that of the assembly formed by the coil and the electronic element when formed by only one layer of binding material encompassing the board together. Secondly, the board according to the invention is inexpensive. Moreover, the board is properly protected by the binding material, which ensures a good longevity of the board.

Another object of the present invention is a card, obtained by the process of the present invention, comprising at least one electronic component and a binding layer in which the electronic component is embedded, the card being characterized by the fact that it includes a positioning structure located inside the said binding layer, this positioning structure having at least one main opening defining an internal area within which the said electronic component is located.

For example, the binder is a resin, in particular a copolyamide alloy or a two-component adhesive, polyurethane or polyvinyl chloride.

It follows from the above characteristics that the positioning structure defines an internal area within the bonding layer within which the electronic component is located, and that this positioning structure reduces the volume of bonding required and is advantageous for the manufacture of this board, as described below in the manufacturing process of the invention.

For example, the positioning structure is either a full frame or perforated, a wavy sheet or a thin structure with the upper and lower sides crushed or waffled, both sides having, for example, a relief composed of several pyramids.

According to particular features of the invention, the card consists of the first and second outer layers firmly adhering to the binding, the latter layer being formed by the said binding and constituting an intermediate layer between the said first and second outer layers, at least the major part of the inner surface of each of these first and second outer layers being covered by said binding, the latter ensuring the cohesion of these first and second outer layers with said intermediate layer.

Manufacture according to the invention.

In another embodiment, the card of the invention comprises at least one electronic component embedded in a binding which partially forms the card, the latter being characterised by the fact that it also comprises a support consisting of a base defining a first outer layer and a positioning structure extending from that base, the said binding structure overlapping at least the major part of that base, the said positioning structure defining an internal area within which the said electronic component is located.

In a variant of the latter embodiment, the map shall also comprise a second outer layer facing the said base and having an inner surface at least the greater part of which is covered by the said binder, this outer layer and the said base defining an intermediate region in which the said positioning structure and said electronic element are located.

It should be noted that the outline of the map as shown above may be any shape, for example circular or rectangular.

Other purposes, characteristics and advantages of the invention will be further described by reference to the following description, which is given for example only and which: Figure 1 is a perspective view of a map, according to a first embodiment of the invention;Figure 2 is a cut-out view of the map of Figure 1 made according to lines II - II of this Figure 1;Figure 3 is a schematically and perspective view of an assembly consisting of an electronic element and a coil;Figure 4 is a schematic top view of a positioning structure and an assembly,consisting of an electronic component and a coil, contained in the card connecting layer shown in Figure 5;Figure 5 is a view similar to Figure 2, but representing a card, according to a second embodiment of the invention, comprising the positioning structure and the assembly of Figure 4, which are shown here in a cut-out view according to line V - V of that Figure 4;Figure 6 is a schematic top view of a positioning structure and an assembly, consisting of an electronic component and a coil, contained in the card connecting layer shown in Figure 7;Figure 7 is a view similar to Figure 5,but representing a map, according to a third embodiment of the invention, containing the elements of Figure 6 represented here according to a cut-out view made according to lines VII - VII of this Figure 6;Figure 8 is a similar view to Figure 7, but representing a map according to a fourth embodiment of the invention;Figure 9 is a map according to a fifth embodiment of the invention;Figure 10 is a schematic view in plan of a sixth embodiment of an invented map made according to lines X - X of Figure 11;Figure 11 is a cut-out view of the map in Figure 10 according to lines XI - XI of this Figure 10.

A first method of making a card of the invention with at least one electronic component is described below, by reference to Figures 1 to 3.

Board 1 has three layers, namely a first outer layer 4, a second outer layer 6 and an intermediate layer 8. The intermediate layer 8 is formed by a binder 10 covering the electronic element 2 and a coil 12. It will be noted that the coil 12 and the electronic element 2 are directly connected to each other and thus form a whole 14, the latter being submerged in the binder 10.

The connector 10 is selected so that it adheres properly and firmly to outer layers 4 and 6, thus ensuring the cohesion of all the elements of the board and in particular the two outer layers 4 and 6 with the middle layer 8.

Because coil 12 is directly welded onto electronic element 2 without the assembly being mounted on a support, it is possible to obtain boards with very low thickness.

The binder 10 which covers assembly 14 is made up of, for example, a resin or plastic material, these two examples being naturally non-limiting. The resin may be an alloy of copolyamides, or a two-component glue, or a glue hardening in contact with air. The outer layers 4 and 6 are made up of, for example, a variety of polyvinyl chloride or polyurethane, these examples being also non-limiting.

Note that this card is compact and that outer layers 4 and 6 are made up of entirely flat sheets, and that binding 10 and assembly 14 fill the entire middle region between outer layers 4 and 6 to form intermediate layer 8.

A second method of making a map according to the invention is described below, using Figures 4 and 5.

Map 31 according to this second embodiment consists of two outer layers 4 and 6, each containing an inner surface 59 and 60, and an intermediate layer 38 between outer layers 4 and 6.

An assembly 44, consisting of an electronic element 2 connected to a coil 42, and a positioning structure 46, consisting of a plate with a main opening 48 inside which the assembly 44 is located, are immersed in the binder 10 and form the intermediate layer 38 with the latter.

This structure 46 defines, through the main opening, an internal area for the set 44 in the intermediate layer 38.

It should be noted that the electronic element 2 is located, in Figure 4, outside the region bounded by coil 42. This configuration is also possible for each of the modes of realization of the map according to the invention.

It should also be noted that the plate forming the positioning structure 46 has perforations 50 filled by the binder 10. These perforations allow in particular the binder 10 to flow from one side to the other of the positioning structure 46 when this board is manufactured by a process also covered by the invention, which will be described below.

The interlayer 38 forms a compact amalgam and the inner surfaces 59 and 60 of the outer layers 4 and 6 are completely covered by the interlayer 10, providing a maximum adhesion surface between the interlayer 38 and the outer layers 4 and 6.

A third method of making a map of the invention is described below, using Figures 6 and 7.

The card 61, according to this third embodiment, comprises an intermediate layer 58, located between two outer layers 4 and 6, into which a positioning structure 62 is incorporated.

The positioning structure 62 has the general shape of a frame defining within it an internal zone for the whole 14. This positioning structure 62 is formed by a thin structure with on its upper face 66 and on its lower face 64 a relief composed of several pyramids 68. The outer tips 70 of the positioning structure 62 are slightly crushed and are in contact with the inner surfaces 59 and 60 of the two outer layers 4 and 6.

This third embodiment has an additional advantage, since the positioning structure 62 serves not only to define a position of assembly 14 in an inner zone of the middle layer 58, but also to define the thickness of this middle layer 58. This additional advantage is particularly noticeable when such a board is manufactured by a process which is also the subject of the present invention.

It will be noted that the outer tips 70 of pyramid 68 serve as support points for outer layers 4 and 6, the region surrounding these tips 70 being filled by the ligand 10. This ensures the good adhesion of outer layers 4 and 6 to the middle layer 58 since most of the inner surfaces 59 and 60 are covered by the ligand 10, which ensures the good cohesion of middle layer 58 with outer layers 4 and 6.

It should be noted that the relief, provided for on the upper face 64 and on the lower face 66 of the positioning structure 62, can be formed by a variety of different patterns, each of these patterns being designed so that most of the inner surfaces 59 and 60 of the outer layers 4 and 6 are covered by the binder 10 of the middle layer 58.

In a variant of this embodiment, the intermediate structure is formed by a corrugated sheet, which can be flexible or rigid, and which may be perforated or porous at the binder 10.

It should also be noted that perforations (not represented) in the positioning structure 62 can be foreseen, as in the case of the second embodiment.

A fourth method of making a map of the invention is described below, by reference to Figure 8.

The card 81, according to this fourth embodiment, comprises two outer layers 4 and 6 and an intermediate layer 88 formed by a binder 10 covering at least one electronic element 2 and a positioning structure 90, this positioning structure 90 being formed in particular by a honeycombed structure inside which there is a main opening defining an internal area in which at least one electronic element is arranged.

The 10th binding element penetrates the positioning structure 90 to form a substantially full amalgam. As in previous embodiments, the intermediate layer 88 forms a homogeneous and compact medium. In addition, the 10th binding element defines a fixed and stable location for the electronic element 2 and, where appropriate, for all other elements incorporated in the intermediate layer 88.

Reference is made below to Figure 9 to describe a map according to a fifth embodiment of the invention.

This map 94 consists of a layer 95 similar to the intermediate layer 58 of map 61 in Figure 7. This map 94 is thus formed by a connector 10 comprising an electronic element 2, a coil 12, and a positioning structure 62 with a relief with several pyramids 68 on its lower face 64 and its upper face 66.

It should be noted that in other variants of this method of making a map of the invention, the latter consists of a single layer analogous to the intermediate layer of any of the methods of making a map of the invention described above.

The card 94 may be used as a component of a card in one of the other embodiments described above or incorporated into other devices or objects.

A sixth method of making a map according to the invention is described below, using Figures 10 and 11.

This card 101 comprises an outer layer 102 and a layer 104 formed by a support 106 and a binder 10.

The support 106 consists of a base 110 and a positioning structure 112 extending from base 110 into the intermediate region 116 of the map 101.

The positioning structure 112 is almost entirely covered by the connector 10 and defines an internal zone 118 within the intermediate region 116 for receiving a coil 108 and an electronic unit 122 composed of various electronic elements 124, 125 and 126. These electronic elements 124, 125 and 126 are arranged on a substrate 128. Substrate 128 also has two connecting terminals with both ends of the electrical connection of the coil 108.

The positioning structure 112 is used to delimit the inner zone 118 within which the various electronic elements are positioned in map 101. This positioning structure 112 is composed of several pyramids 114. This embodiment of the positioning structure 112 is given only as a non-limiting example. Indeed, the relief of the positioning structure 112 can be any size provided that the volume filled by the connector 10, as in the other embodiments, is bounded by a surface whose continuous or quasi continuous zone, partially defining the lateral faces of the map according to the invention, expands laterally over the entire perimeter of the map. In other words, the connector 10, forming the total intermediate region 112 in part, must cover the entire inner or almost all outer surface of the inner layer of the map 101, and the peripheral region 102101 on the base of the map 102102 in part.

It should be noted that in a variant of this embodiment, the first outer layer 102 is omitted, the map being then formed only by layer 104 encompassing the entire positioning structure 112.

It will be noted that in other variants of this embodiment the electronic unit 122 is located outside the region defined by coil 108.

The sixth method of making a card according to the invention differs essentially from the other methods described above in that the positioning structure 112 forms with the base 110 a single part.

A method of manufacturing a card according to the invention is described below by reference to Figures 1 to 11.

In a first embodiment of the process of the invention, a first outer layer 4 is applied to a work surface and at least one electronic component 2 is placed on it. A binder 10, used to form an intermediate layer 8, 38, 58, 88 is applied to the first outer layer 4 in a liquid state. A second outer layer 6 is applied in such a way as to cover the binder and the various elements provided for in the intermediate layer. Binder 10 is preferably applied at a temperature lower than the melting temperature of the outer layers 4 and 6 and in particular at room temperature.

In this step of applying pressure, binder 10 is spread over the entire intermediate region between outer layers 4 and 6 in such a way as to fill it without leaving significant air pockets and to coat all the elements placed on the first outer layer 4.

The advantage is that the binder has a high enough viscosity to only expand significantly when pressure is applied. The consistency of the binder is chosen so that it does not damage the electronic element 2 on the first outer layer 4 or coil 12 if one is intended. As a non-limiting example, binder 10 is formed by a resin or a variety of polyvinyl chloride that can be supplied in liquid form at a temperature lower than the melting temperature of the two outer layers 4 and 6.

In a variant of this first implementation, a positioning structure 46, 62, 90 is first provided on the first outer layer 4 and the various elements other than this positioning structure provided in the intermediate layer are then placed inside at least one main opening 48, 63 provided in this positioning structure. Thus, during the pressing step during which the connector 10 spreads over the entire intermediate region, each element is held in a predefined internal zone of this intermediate region by means of the positioning structure so that the various elements are not carried away by the spread of the connector in the general map plane.

It will be noted that the positioning structure 46, 62, 90 allows lateral flow of the binder 10, i.e. flow in the general plane of the board according to the invention. Thus, each of the proposed intermediate structures allows, on the one hand, to keep the electronic elements in a predefined internal area of the intermediate region during the manufacture of the board according to the invention and, on the other hand, a flow of the binder 10 throughout this intermediate region to form the intermediate layer.

It should be noted that the perforations 50 provided for in positioning structure 46 allow binder 10 to flow from one side of this positioning structure to the other.

It should also be noted that the introduction of the binder may precede the introduction of the various elements and structures incorporated in the intermediate layer.

In another variant of this first embodiment of the process of the invention, it is planned to bring a first part of the binder 10 before the stages of placement of the various elements and the positioning structure on the first outer layer 4, and then a second part of the binder after these placement stages.

In the case of a positioning structure 62 as shown in Figures 6 and 7, the outer layers 4 and 6 are pressed in the direction of each other until they touch the tips 70 of the pyramids 68 which are on either side of this positioning structure 62.

It should be noted that it is also possible to obtain a card without a positioning structure incorporated in the middle layer, as shown in Figure 2, by providing, when such a card is manufactured, a work frame with an opening having the same dimensions as the card itself.

A second method of manufacturing a card according to the invention is described below.

In this second embodiment, a first outer layer 4 is introduced and at least one electronic element 2 and a positioning structure with a main opening inside which electronic element 2 is placed are placed on top of it. The binder 10 is introduced in a solid state, for example in sheet form, and is placed either on the positioning structure and the various elements placed on the first outer layer 4 or directly on this first outer layer. Then a second outer layer 6 is introduced. Finally, the energy needed to melt the binder at least partially is provided by heating pressure. The binder thus penetrates the positioning structure and incorporates the various elements incorporated in the intermediate layer. The energy supply and the binder layers can be supplied in such a way that the binder 10 can be pressurized in a synchronous manner.

In a variant of this second implementation, it is planned to bring the binder in the form of two thin sheets arranged on either side of the positioning structure and the various elements incorporated in the middle layer.

Again, the intermediate structure 46,62 or 90 allows the binder to have a lateral flow, an excess of binder can escape out of the intermediate region.

It should also be noted that, in the case of two sheets of solid binder being brought in from either side of the positioning structure, it is not necessary to melt the binder until it is liquid; it is sufficient to make it soft enough to fill the entire middle region so as to form, with the various elements and the positioning structure, the middle layer.

It is also possible, in another variant of this second embodiment of the process of the invention, to lay a solidified binding film, e.g. a copolyamide alloy or a polyvinyl chloride variety with a melting point lower than the melting point of the outer layers 4 and 6, on each of the inner surfaces 59 and 60 of the two outer layers 4 and 6 in advance, in which case the positioning structure and the various elements are laid out on the first outer layer 4 containing a solidified binding film on its surface, and then to heat the second outer layer 6 containing also a solidified binding film on its inner surface.

In the case of the card shown in Figures 10 and 11, it will be noted that the manufacturing process of this card is equivalent to the process described above.

In the latter case, the binder is introduced after the support 106 is introduced. When the binder is introduced as a solid sheet, this sheet is introduced onto the positioning structure 112. As before, the solid binder can be pre-assembled with the outer layer 102. For example, the solid binder is formed by a layer of polyvinyl chloride assembled with the outer layer 102 and having a melting point lower than the melting point of this outer layer 102.

It should be noted that in the case of the map shown in Figure 8 it is possible to bring the positioning structure 90 and the connector 10 together, the latter being able to be impregnated with the positioning structure 90 before it is brought in.

A third embodiment of the method of manufacturing a card 94 of the invention involves placing at least one electronic component 2 on a work surface and bringing a binder 10 directly onto that work surface. Pressure is then applied to the binder 10 towards the work surface by means of a press having a contact surface with the binder 10 until the binder forms a layer 95 of a predetermined thickness.

The working surface and contact surface of the press are non-adhesive to the binder. For example, they are coated with Teflon. It should be noted that the coil and, if necessary, the positioning structure are brought in before the pressure application step and are integrated into layer 95 forming the board 94.

Again, the positioning structure allows the electronic element 2 and coil 12 to be positioned in a predetermined inner zone of layer 95.

The test chemical is a liquid form with a viscosity preferably high enough to only spread significantly when pressure is applied to the binder.

It should be noted that at least part of the binder 10 can be supplied, in a variant of this third embodiment, as at least a solid sheet, this sheet being then melted at least partially to form layer 95 containing electronic element 2, coil 12 and positioning structure 62.

In this variant, it is possible to place the binding sheet directly on the working surface and the various elements intended on this binding sheet.

The above variant is particularly advantageous when no positioning structure is provided, because if the binding sheet is fused in a sensible manner to give it a soft, deformable but non-liquid consistency, then it is possible to press the electronic element and coil into the material without significant lateral displacement, so that the electronic element and coil retain approximately the position in which they were placed on the binding sheet.

It should be noted that the above is also true in the case of the second method of implementation of the invention, in which the binding sheet is then placed directly on the outer layer 4 and the heat supply to the binding sheet is carried out by the working surface through this outer layer 4.

In a fourth embodiment of the method of manufacturing a card 1, 31, 61, 81 according to the invention, it is planned to manufacture a card 95 in the first stage according to the third embodiment of the process described above.

In a first variant, energy is supplied to melt at least superficially the board 95 in such a way that the binder 10 forming the board 95 adheres firmly to the two outer layers after a cooling step.

Thus, the original card 94 is a constituent of a new card 1, 31, 61, 81 of which it forms the intermediate layer 8, 38, 58, 88.

In a second variant of this fourth embodiment of the invention, it is intended to apply a glue film to the inner surfaces 59 and 60 of the two outer layers 4 and 6 and/or to the two corresponding faces of board 95 forming intermediate layer 1, 31, 61, 81 of the board manufactured in this fourth embodiment, the whole being assembled at room temperature.

It should be noted that throughout this text, the bond 10 can be made of several materials, and the layer 8, 38, 58, 88, 95 of the bond 10 can be made of several sub-layers or films of different materials.

In a third variant of the fourth method of implementation of the invention, the board 95 originally manufactured is to be placed in a frame with an opening whose profile corresponds substantially to that of the board 95.

It will be noted that the manufacturing process according to the invention allows, in each of its modes of implementation, to manufacture several cards at the same time. To this end, a plate corresponding to several cards is manufactured. This plate is manufactured according to the process of the invention described above, with a final cutting step for each card being provided after the plate is manufactured.

In this case, it is particularly advantageous to provide a positioning structure with plate dimensions and several main openings distributed with a certain repetition period.

Since the positioning structure has well-defined main openings for the positioning of the various intended elements, it is possible, when cutting the cards into the plate, to ensure that none of the various elements arranged in the main openings of the positioning structure are cut off or damaged.

It will be noted that the above is also true of the manufacture of a single card from a plate larger than that card.

It should be noted that, in the process of manufacturing a board according to the above-described invention, a work frame may be placed on the work surface, the various elements provided for in the binding layer and the binding itself being brought into the work frame.

It should be noted that any known means of heat supply in the process implementations requiring such a supply is possible, e.g. microwave heat supply.

Finally, it is quite possible to combine the first or second embodiment of the process of the invention with the third embodiment of the process of the invention to produce a card of the invention having a single outer layer and a layer formed by the binder.

Claims (27)

1. Method of manufacture of a card (1; 31; 61; 81; 101) comprising at least one electronic element (2; 125), characterized in that it includes the following steps :

   IA) bringing onto a work surface a first outer layer (4; 110) formed from a solid material;

   IB) placing said electronic element (2, 125) onto said first outer layer (4; 110);

   IC) bringing a binding material (10) onto said first outer layer;

   ID) bringing a second outer layer (6; 102) formed from a solid material onto said binding material and facing said first outer layer; such steps being succeeded by the following steps :

   IE) applying pressure on said first and second outer layers (4; 110 and 6; 102) and on said binding material, then being at least partially in a non-solid state, until such first and second outer layers are located at a predetermined distance relative to one another, said binding material then forming between such first and second outer layers an intermediate layer (8; 38; 58; 88) in which said electronic element is comprised;

   IX) hardening said binding material (10) in order to solidify said intermediate layer, the latter then having a predetermined thickness;

   IF) cutting out a contour of said card in order to form the lateral walls of such card.
2. Method of manufacture of a card (94) comprising at least one electronic element (2), characterized in that it includes the following steps :

   IB) placing said electronic element onto a work surface;

   IC) bringing a binding material (10) onto said work surface, such work surface being non-adhesive to said binding material; such steps being succeeded by the following steps :

   IE) applying pressure on said binding material, then being at least partially in a non-solid state, in the direction of said work surface with the help of a press exhibiting a contact surface with said binding material non-adhesive thereto until said binding material forms a layer (95) in which said electronic element is comprised;

   IX) hardening said binding material (10) in order to solidify said intermediate layer, the latter then having a predetermined thickness;

   IF) cutting out a contour of said card in order to form the lateral walls of such card.
3. Method according to claim 1 or 2, characterized in that it comprises the following step prior to step IE :

   IG) bringing a positioning structure (46; 62; 90; 112) defining an internal zone (48; 63; 118) in order to position said electronic element (2) in a manner such that said electronic element is located within said internal zone.
4. Method according to claim 3, characterized in that said internal zone is defined by a principal opening (48; 63) provided in said positioning structure (46; 62; 90).
5. Method according to claim 4, characterized in that said positioning structure (46) is planar and exhibits a thickness less that said predetermined thickness of said layer (38) formed by said binding material (10).
6. Method according to one of claims 3 to 5, characterized in that said positioning structure (62; 112), once brought, exhibits a relief on its lower face in a plane substantially parallel to said work surface.
7. Method according to one of claims 3 to 6, characterized in that said positioning structure (62; 112), once brought, exhibits a relief on its upper face in a plane substantially parallel to said work surface.
8. Method according to any one of the preceding claims, characterized in that said binding material (10) as brought is formed by a viscous liquid substance.
9. Method according to claim 8, characterized in that said binding material (10) as brought is formed by a resin, such resin being brought with a non-elevated temperature and hardening at ambiant temperature between said steps IE and IF.
10. Method according to any one of claims 3 to 7 and claim 8 or 9, characterized in that said bringing of said binding material (10) is carried out in two phases, the first phase consisting in an application of a first portion of said binding material prior to said steps IB and IG and the second phase consisting in an application of a second portion of said binding material (10) following said step IG.
11. Method according to any one of claims 3 to 7, characterized in that at least a part of said binding material (10) as brought is formed by a solid leaf, such leaf thereafter being at least partially melted by applying energy prior step IE, said step of hardening comprising a cooling of said binding material.
12. Method according to any one of claims 3 to 7, characterized in that said binding material (10) as brought is formed by two solid leaves arranged on either side of said positioning structure (46; 62; 90), such two leaves partially melted by applying energy prior step IE, said step of hardening comprising a cooling of said binding material.
13. Method of manufacture of a card according to claim 2, characterized in that it comprises the following subsequent and successive steps :

    II) bringing first and second outer layers (4 and 6) each formed of a solid material;

    IJ) bringing said layer formed by said binding material (10) between said first and second outer layers;

    IK) applying energy serving to melt at least superficially said layer formed by said binding material in order to bring about adhesion of said layer to said first and second outer layers, such layer after cooling forming an intermediate layer (8; 38; 58; 88) between such first and second outer layers.
14. Method of manufacture of a card according to claim 2, characterized in that it comprises the following subsequent and successive steps :

    III) bringing first and second outer layers, each exhibiting a surface onto which a glue film is deposited;

    IIJ) bringing said layer formed by said binding material (10) between said first and second outer layers;

    IIK) hardening of each glue film assuring adhesion of said first and second outer layers with said layer formed by said binding material (10).
15. Method of manufacture of a card according to any one of the preceding claims, characterized in that a working frame is arranged on said work surface, said binding material (10) being brought to the interior of said working frame, such working frame being permeable to said binding material when such latter is subjected to an overpressure and enabling an excess of binding material to escape during said step IE.
16. Card (1) obtained by the method according to any one of claims 1 to 15, comprising at least one electronic element (2), a coil (12) and a layer (8) formed by a binding material (10), such card being characterized in that said coil has two ends for electrical coupling directly connected to said electronic element, such latter, together with said coil, forming an assembly (14) embedded in said binding material forming said layer.
17. Card according to claim 16, characterized in that it comprises a first outer layer (4) and a second outer layer (6), said layer (8) formed by said binding material constituting an intermediate layer between said first and second outer layers, said binding material assuring cohesion of such first and second outer layers with said intermediate layer.
18. Card (31; 61; 81; 94) obtained by the method according to any one of claims 3 to 7, comprising at least one electronic element (2), a layer (38; 58; 88; 95) formed by a binding material (10) in which said electronic element is embedded, such card being characterized in that it further comprises a positioning structure (46; 62; 90) located at the interior of said layer (38; 58; 88; 95) formed by said binding material (10), such positioning structure having at least one principal opening defining an internal zone withing which said electronic element (2) is located.
19. Card according to claim 18, characterized in that said internal zone is formed by a principal opening (48; 63) passing through said positioning structure (46; 62; 90).
20. Card according to claim 18 or 19, characterized in that it comprises a coil (12; 42), two ends of which being directly connected to said electronic element (2), such latter together with said coil forming an assembly (14) encased by said binding material (10).
21. Card (31; 61; 81) according to one of claims 18 to 20, characterized in that it comprises first and second outer layers (4 and 6), said layer (38; 58; 88) formed by said binding material constituting an intermediate layer between said first and second outer layers, at least the major portion of the internal surface (59, 60) of each of said first and second outer layers being covered over by said binding material, such latter assuring cohesion of such furst and second outer layers with said intermediate layer.
22. Card according to any one of claims 18 to 21, characterized in that said positioning structure (62) is formed by a thin structure exhibiting on its lower face (64) a relief (68).
23. Card according to any one of claims 18 to 22, characterized in that said positioning structure (62) exhibits on its upper face (66) a relief.
24. Card according to any one of claims 18 to 21, characterized in that said positioning structure (90) is formed by a cellular structure.
25. Card according to any one of claims 18 to 21, characterized in that said positioning structure (90) is formed by expanded material.
26. Card according to any one of claims 18 to 25, characterized in that said positioning structure (62) has the general form of a frame.
27. Card (101), obtained by the method of claim 1, comprising at least one electronic element (125) embedded in a binding material (10) partially forming said card, such latter being characterized in taht it further comprises a support (106) formed by a base (110) defining a first outer layer and by a positioning structure (112) extending from such base, said binding material covering over at least the major portion of said base in order to form a layer of the card, said positioning structure (112) defining an internal zone (118) within which is located said electronic element (125).