HK1000521A1 - Conductive metal powders process for preparation thereof and use thereof - Google Patents

Conductive metal powders process for preparation thereof and use thereof

Info

Publication number
HK1000521A1
HK1000521A1 HK97102129A HK97102129A HK1000521A1 HK 1000521 A1 HK1000521 A1 HK 1000521A1 HK 97102129 A HK97102129 A HK 97102129A HK 97102129 A HK97102129 A HK 97102129A HK 1000521 A1 HK1000521 A1 HK 1000521A1
Authority
HK
Hong Kong
Prior art keywords
preparation
conductive metal
metal powders
powders process
conductive
Prior art date
Application number
HK97102129A
Other languages
English (en)
Inventor
Nakajima Hitoshi
Yokoyama Akinori
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of HK1000521A1 publication Critical patent/HK1000521A1/xx

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/02Making metallic powder or suspensions thereof using physical processes
    • B22F9/14Making metallic powder or suspensions thereof using physical processes using electric discharge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00Making metallic powder or suspensions thereof
    • B22F9/02Making metallic powder or suspensions thereof using physical processes
    • B22F9/06Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B22F9/08Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
    • B22F9/082Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/04Making non-ferrous alloys by powder metallurgy
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00Contacts
    • H01H1/02Contacts characterised by the material thereof
    • H01H1/021Composite material
    • H01H1/023Composite material having a noble metal as the basic material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00Aspects linked to processes or compositions used in powder metallurgy
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12181Composite powder [e.g., coated, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)
HK97102129A 1988-08-23 1997-11-07 Conductive metal powders process for preparation thereof and use thereof HK1000521A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20743888 1988-08-23
JP1642589 1989-01-27

Publications (1)

Publication Number Publication Date
HK1000521A1 true HK1000521A1 (en) 1998-04-03

Family

ID=26352772

Family Applications (1)

Application Number Title Priority Date Filing Date
HK97102129A HK1000521A1 (en) 1988-08-23 1997-11-07 Conductive metal powders process for preparation thereof and use thereof

Country Status (5)

Country Link
US (1) US5091114A (de)
EP (1) EP0356867B1 (de)
KR (1) KR920008674B1 (de)
DE (1) DE68904267T2 (de)
HK (1) HK1000521A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2702796B2 (ja) * 1990-02-23 1998-01-26 旭化成工業株式会社 銀合金導電性ペースト
CA2058414C (en) * 1990-03-19 1995-11-14 Akinori Yokoyama High temperature baking paste
US5453297A (en) * 1990-05-11 1995-09-26 Board Of Trustees Operating Michigan State University Process for producing finely divided metals deposited on oxidized metals
JPH0791608B2 (ja) * 1990-06-21 1995-10-04 松下電工株式会社 接点材料およびその製造方法
JP2767729B2 (ja) * 1992-06-30 1998-06-18 アルプス電気株式会社 合金粉末、該合金粉末を用いた分散型導電体および合金粉末の製造方法
TW301843B (en) * 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
US6010646A (en) * 1997-04-11 2000-01-04 Potters Industries, Inc. Electroconductive composition and methods for producing such composition
JPH1145616A (ja) * 1997-05-28 1999-02-16 Yazaki Corp 導電性フィラー、導電性ペーストおよび回路体の形成方法
US6533963B1 (en) 1999-02-12 2003-03-18 Robert A. Schleifstein Electrically conductive flexible compositions, and materials and methods for making same
JP4978844B2 (ja) 2005-07-25 2012-07-18 住友金属鉱山株式会社 銅微粒子分散液及びその製造方法
ITMI20120331A1 (it) * 2012-03-02 2013-09-03 Legor Group S P A Silver-based alloy powder for manufacturing of 3-dimensional metal objects

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305356A (en) * 1963-08-30 1967-02-21 William V Youdelis Dental amalgam
US3253783A (en) * 1964-03-02 1966-05-31 Federal Mogul Bower Bearings Atomizing nozzle
US3202488A (en) * 1964-03-04 1965-08-24 Chomerics Inc Silver-plated copper powder
US3583930A (en) * 1968-04-16 1971-06-08 Chomerics Inc Plastics made conductive with coarse metal fillers
US3871876A (en) * 1974-03-18 1975-03-18 Kamal Asgar Dental Amalgam
US4235631A (en) * 1978-08-24 1980-11-25 Engelhard Minerals & Chemicals Corporation Corrosion-resistant dental alloy having improved handling characteristics
US4450188A (en) * 1980-04-18 1984-05-22 Shinroku Kawasumi Process for the preparation of precious metal-coated particles
US4652465A (en) * 1984-05-14 1987-03-24 Nissan Chemical Industries Ltd. Process for the production of a silver coated copper powder and conductive coating composition
US4600604A (en) * 1984-09-17 1986-07-15 E. I. Du Pont De Nemours And Company Metal oxide-coated copper powder
US4683082A (en) * 1985-03-27 1987-07-28 Ercon, Inc. One-component, particle-filled compositions
US4716081A (en) * 1985-07-19 1987-12-29 Ercon, Inc. Conductive compositions and conductive powders for use therein
US4664855A (en) * 1985-11-12 1987-05-12 Special Metals Corporation Method for producing amalgamable alloy
US4859241A (en) * 1986-04-16 1989-08-22 Johnson Matthey Inc. Metal flake and use thereof

Also Published As

Publication number Publication date
KR920008674B1 (ko) 1992-10-08
EP0356867B1 (de) 1993-01-07
DE68904267D1 (de) 1993-02-18
US5091114A (en) 1992-02-25
KR900002878A (ko) 1990-03-23
DE68904267T2 (de) 1993-06-24
EP0356867A1 (de) 1990-03-07

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Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20090820