GR1010629B - Συσκευη και μεθοδος κατεργασιας ενος αγωγιμου υλικου - Google Patents

Συσκευη και μεθοδος κατεργασιας ενος αγωγιμου υλικου Download PDF

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Publication number
GR1010629B
GR1010629B GR20230100871A GR20230100871A GR1010629B GR 1010629 B GR1010629 B GR 1010629B GR 20230100871 A GR20230100871 A GR 20230100871A GR 20230100871 A GR20230100871 A GR 20230100871A GR 1010629 B GR1010629 B GR 1010629B
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GR
Greece
Prior art keywords
conductive material
conductive
jet
conductive liquid
nozzle
Prior art date
Application number
GR20230100871A
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English (en)
Inventor
Στυλιανος Νικολαου Μορες
Original Assignee
Στυλιανος Νικολαου Μορες
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Στυλιανος Νικολαου Μορες filed Critical Στυλιανος Νικολαου Μορες
Priority to GR20230100871A priority Critical patent/GR1010629B/el
Publication of GR1010629B publication Critical patent/GR1010629B/el

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

Συσκευή για την κατεργασία ενός αγώγιμου υλικού (1), όπου η συσκευή περιλαμβάνει: μέσα αποθήκευσης (2) ενός αγώγιμου υγρού, μέσα εκτόξευσης του αγώγιμου υγρού που περιλαμβάνουν τουλάχιστον ένα ακροφύσιο (5) από το οποίο εκτοξεύεται υπό πίεση ένας πίδακας (3) αγώγιμου υγρού με κατεύθυνση προς τουλάχιστον μια ζώνη κατεργασίας του αγώγιμου υλικού (1), η συσκευή χαρακτηρίζεται από το ότι περιλαμβάνει περαιτέρω: μέσα εφαρμογής ηλεκτρικής τάσης (4) μεταξύ του τουλάχιστον ενός ακροφυσίου (5) και του αγώγιμου υλικού (1) για την παραγωγή ηλεκτρικού ρεύματος, έτσι ώστε κατά την διάρκεια της εκτόξευσης του τουλάχιστον ενός πίδακα (3) αγώγιμου υγρού προς την τουλάχιστον μια ζώνη κατεργασίας του αγώγιμου υλικού (1), το παραγόμενο ηλεκτρικό ρεύμα να οδηγείται μέσω του τουλάχιστον ενός πίδακα (3) αγώγιμου υγρού προς την τουλάχιστον μια ζώνη κατεργασίας του αγώγιμου υλικού (1) πραγματοποιώντας την τήξη του αγώγιμου υλικού (1) μέσω θέρμανσης Joule του αγώγιμου υλικού (1).
GR20230100871A 2023-10-20 2023-10-20 Συσκευη και μεθοδος κατεργασιας ενος αγωγιμου υλικου GR1010629B (el)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GR20230100871A GR1010629B (el) 2023-10-20 2023-10-20 Συσκευη και μεθοδος κατεργασιας ενος αγωγιμου υλικου

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GR20230100871A GR1010629B (el) 2023-10-20 2023-10-20 Συσκευη και μεθοδος κατεργασιας ενος αγωγιμου υλικου

Publications (1)

Publication Number Publication Date
GR1010629B true GR1010629B (el) 2024-02-07

Family

ID=90276004

Family Applications (1)

Application Number Title Priority Date Filing Date
GR20230100871A GR1010629B (el) 2023-10-20 2023-10-20 Συσκευη και μεθοδος κατεργασιας ενος αγωγιμου υλικου

Country Status (1)

Country Link
GR (1) GR1010629B (el)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040026382A1 (en) * 2000-04-04 2004-02-12 Bernold Richerzhagen Method for cutting an object and or futher processing the cut material an carrier for holding the object and the cut material
US20050160891A1 (en) * 2004-01-28 2005-07-28 Scimed Life Systems, Inc Method of cutting material with hybrid liquid-jet/laser system
EP2208568A1 (en) * 2009-01-20 2010-07-21 Synova S.A. Apparatus and method for processing material by means of laser
US20110240615A1 (en) * 2008-11-21 2011-10-06 Synova Sa Method and apparatus for improving reliability of a machining process

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040026382A1 (en) * 2000-04-04 2004-02-12 Bernold Richerzhagen Method for cutting an object and or futher processing the cut material an carrier for holding the object and the cut material
US20050160891A1 (en) * 2004-01-28 2005-07-28 Scimed Life Systems, Inc Method of cutting material with hybrid liquid-jet/laser system
US20110240615A1 (en) * 2008-11-21 2011-10-06 Synova Sa Method and apparatus for improving reliability of a machining process
EP2208568A1 (en) * 2009-01-20 2010-07-21 Synova S.A. Apparatus and method for processing material by means of laser

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Effective date: 20240312