GB995853A - Apparatus for bonding wire-like elements to articles - Google Patents

Apparatus for bonding wire-like elements to articles

Info

Publication number
GB995853A
GB995853A GB34662/61A GB3466261A GB995853A GB 995853 A GB995853 A GB 995853A GB 34662/61 A GB34662/61 A GB 34662/61A GB 3466261 A GB3466261 A GB 3466261A GB 995853 A GB995853 A GB 995853A
Authority
GB
United Kingdom
Prior art keywords
bonding
tool
unit
header
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB34662/61A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of GB995853A publication Critical patent/GB995853A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05G—CONTROL DEVICES OR SYSTEMS INSOFAR AS CHARACTERISED BY MECHANICAL FEATURES ONLY
    • G05G5/00—Means for preventing, limiting or returning the movements of parts of a control mechanism, e.g. locking controlling member
    • G05G5/04—Stops for limiting movement of members, e.g. adjustable stop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5116—Plural diverse manufacturing apparatus including means for metal shaping or assembling forging and bending, cutting or punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Wire Bonding (AREA)
  • Wire Processing (AREA)
GB34662/61A 1960-10-06 1961-09-27 Apparatus for bonding wire-like elements to articles Expired GB995853A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60964A US3083595A (en) 1960-10-06 1960-10-06 Thermo-compression bonding apparatus

Publications (1)

Publication Number Publication Date
GB995853A true GB995853A (en) 1965-06-23

Family

ID=22032841

Family Applications (1)

Application Number Title Priority Date Filing Date
GB34662/61A Expired GB995853A (en) 1960-10-06 1961-09-27 Apparatus for bonding wire-like elements to articles

Country Status (5)

Country Link
US (1) US3083595A (https=)
BE (1) BE608864A (https=)
DE (1) DE1274241B (https=)
GB (1) GB995853A (https=)
NL (1) NL269297A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2048054A1 (https=) * 1969-06-30 1971-03-19 Texas Instruments Inc
CN102130228A (zh) * 2010-12-23 2011-07-20 陕西科技大学 一种led焊线加热模具

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3125906A (en) * 1964-03-24 Lead bonding machine
NL254821A (https=) * 1959-08-14 1900-01-01
US3218702A (en) * 1961-06-09 1965-11-23 Frederick W Steudler Method and apparatus for bonding wires to metal surfaces
NL282318A (https=) * 1961-08-30 1900-01-01
US3116655A (en) * 1962-09-12 1964-01-07 Aldo J Esopi Tool for welding minute wire connections
US3250452A (en) * 1963-01-29 1966-05-10 Kulicke And Soffa Mfg Company Nail head bonding apparatus for thermocompressively securing lead wire to semi-conductor devices
US3216640A (en) * 1963-03-08 1965-11-09 Kulicke And Soffa Mfg Company "bird-beak" wire bonding instrument for thermocompressively securing leads to semi-conductor devices
US3358897A (en) * 1964-03-31 1967-12-19 Tempress Res Co Electric lead wire bonding tools
US3328875A (en) * 1965-12-20 1967-07-04 Matheus D Pennings Method of attaching conductors to terminals
US3400448A (en) * 1966-01-27 1968-09-10 Sylvania Electric Prod Method of bonding filamentary material
US3430835A (en) * 1966-06-07 1969-03-04 Westinghouse Electric Corp Wire bonding apparatus for microelectronic components
US3659770A (en) * 1968-12-13 1972-05-02 Miller Charles F Circuit bonding means
US3894671A (en) * 1971-01-06 1975-07-15 Kulicke & Soffa Ind Inc Semiconductor wire bonder
US3840169A (en) * 1971-01-27 1974-10-08 Inforex Automatic bonding apparatus with multiple bonding heads
DE2114496C3 (de) * 1971-03-25 1981-05-07 Texas Instruments Deutschland Gmbh, 8050 Freising Maschine zum Befestigen von Verbindungsdrähten an mehreren Anschlußstellen eines Halbleiterbauelements und an den zugehörigen Anschlußstellen eines das Halbleiterbauelement aufnehmenden Gehäuses
DE2528806C2 (de) * 1975-06-27 1983-09-15 Texas Instruments Deutschland Gmbh, 8050 Freising Schweißvorrichtung
JPS55154740A (en) 1979-05-23 1980-12-02 Hitachi Ltd Wire bonding device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2409615A (en) * 1943-09-16 1946-10-22 Western Electric Co Method of and apparatus for soldering
US2474463A (en) * 1944-01-13 1949-06-28 Burrell Ellis Wiring pencil
GB649614A (en) * 1948-06-28 1951-01-31 Gen Electric Co Ltd Improvements in or relating to the cold welding of metal
US2672838A (en) * 1950-04-06 1954-03-23 Victor Adding Machine Co Brazing machine
US2905400A (en) * 1953-12-31 1959-09-22 Bell Telephone Labor Inc Wire connecting machine
US2796511A (en) * 1954-03-22 1957-06-18 Rome Cable Corp Method and apparatus for joining wires by brazing
US2795687A (en) * 1954-10-07 1957-06-11 Western Electric Co Fusing machine
BE571509A (https=) * 1957-09-26 1900-01-01

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2048054A1 (https=) * 1969-06-30 1971-03-19 Texas Instruments Inc
CN102130228A (zh) * 2010-12-23 2011-07-20 陕西科技大学 一种led焊线加热模具

Also Published As

Publication number Publication date
BE608864A (fr) 1962-02-01
US3083595A (en) 1963-04-02
DE1274241B (de) 1968-08-01
NL269297A (https=) 1900-01-01

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