US2409615A - Method of and apparatus for soldering - Google Patents
Method of and apparatus for soldering Download PDFInfo
- Publication number
- US2409615A US2409615A US502628A US50262843A US2409615A US 2409615 A US2409615 A US 2409615A US 502628 A US502628 A US 502628A US 50262843 A US50262843 A US 50262843A US 2409615 A US2409615 A US 2409615A
- Authority
- US
- United States
- Prior art keywords
- wire
- solder
- crystal
- arm
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005476 soldering Methods 0.000 title description 26
- 238000000034 method Methods 0.000 title description 11
- 239000013078 crystal Substances 0.000 description 62
- 229910000679 solder Inorganic materials 0.000 description 60
- 239000008188 pellet Substances 0.000 description 38
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 35
- 238000004080 punching Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 11
- 230000004907 flux Effects 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- 210000003813 thumb Anatomy 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 101100289061 Drosophila melanogaster lili gene Proteins 0.000 description 1
- 241000412626 Penetes Species 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S228/00—Metal fusion bonding
- Y10S228/904—Wire bonding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5116—Plural diverse manufacturing apparatus including means for metal shaping or assembling forging and bending, cutting or punching
- Y10T29/5121—Wire working
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
- Y10T29/5187—Wire working
Definitions
- the sides of the crystals may be provided with a thin plating of a metallic compound and conducting wires may then be attached to either side of the crystals.
- these lead wires serve also as supports for the crystals and because the crystals may be subjected to considerable rough usage and consequent mechanical shocks in use, the supporting wires must be securely attached to the crystals. Also, the wires must be attached to the crystals at a definite point on each side in order to permit the crystals to operate efficiently.
- An object of the present invention is to provide an efficient and effective method of and apparatus for soldering lead wires to quartz crystals.
- a soldering apparatus may be provided in which a pellet of solder is punched from a tape and impaledon a sharpened end of a lead ⁇ wire, the sharpening of the end of the Wire being performed at a soldering station where the end of the lead wire is cut off after the wire has been soldered to the crystal.
- a fluxing station is provided intermediate the punching and soldering station.
- Fig. 2 is a perspective View of a completed crystal
- Fig. 3 is a fragmentary plan View of the punch mechanism
- Fig. 12 is an enlarged sectional view along the line
- 2-l2 of Fig. 11; i Fig. 13 is a detail view showing the wire cutting blades as they engage the lead wire;
- Fig. 16 is a sectional view along the line lG -
- VA thumb actuated lever 32 is pivotally mounted on a stud shaft 33 positioned in the forward ⁇ portion of the block 24 and is provided with an-inwardly bent portion 34, which is movable in a recess 35 formed in the left side ofv the block, as viewed in 4, so as to bear against the wire positioned in the quill, which is also suitably recessed at this point.
- Aspring 3B mounted von a small handle 3l, which extends a short distance from the right of the block 2li, as viewed in Fig. l1, bears against- .they thumb actuated lever 32 and urges theportion 34 thereof against the wire.
- Afstop member 45 is integrally formed with the plate 42 and positioned between the Yposts 4l and -44 and limits the downward movement of the arm 20. While this stop member is shown as integrally formed, it will be apparent that an adjustable member could be substituted therefor, such as a threaded post.
- the drive roller 53 is actuated by a pawl 58, which is pivotally mounted on the upper end of a plunger 59, and engages the serrated periphery of the roller 53.
- Both the plunger and pawl assembly are positioned in an aperture S0 formed inthe lower side of the base block 43, as shown in Figs.k 4 and 6..
- the plunger is actuated by a pivotally mounted lever arm G2, against the upper surface of which bears one end of a spring 63, as shown in Figs 4 and 6. The other end of the spring 63 bears against the lower side of the plunger 59.
- the vertical movement of the plunger 59 is V limited by a pin 1l, which is threaded into the left side of the block 43, as viewed in Fig. 6, and, extending across the aperture 5), extends through an elongated slot 'l2 formed'in the lower portion of the plunger59.
- This'pin also serves to prevent axial rotation of the plunger and thus maintains correct axial position ofthe pawl l58 with respect to the drive roller 53.
- a fiat spring 13 mounted in the lower side of the block 43, extends vinto a small recess 14 Iformed in the lower side of the-plunger159 and serves to return the plunger when the lever arm :56 is raised.
- vDownward movement of the piston 54 causes the left end of the lever arm 15 to engage a disc 1E fixed tothe lower end of a punch 19, the upper end of which is reduced sufficiently so as to t in the aperture 45 formed in the die plate 41 when the punch is raised.
- the punch is slidably movable in a suitably yshaped aperture 8l formed in the base block 43, which is also provided with a somewhat larger recess S2 to receive a helically coiled spring 83, the lower end of which bears against the upper side of the disc 11, while the upper end of the spring bears against the upper side of the recess B2.
- a helically coiled spring 83 the lower end of which bears against the upper side of the disc 11, while the upper end of the spring bears against the upper side of the recess B2.
- a flux is applied to the lower end of the wire and to the solder pellet attached thereto.
- the arm 20 is lifted out of the guide assembly, including the posts 4
- the reduced portion 4i? or" the arm 20 is then positioned in a rectangular notch 86 formed in the upper portion of a guide plate 81, which is mounted on the table 22.
- This member which is resilient s0 that.it may be readily moved into and out of position, is mounted in a slotted aperture I0 eX- tending through the upper portion of .a block positioned at the left of the soldering station, as shown in Fig. 11, and is provided with a knob
- the large recessed plate 1 which, as hereinbefore stated, is slidably mounted, is positioned in a rectangular frame
- 26 which is pivotally attached to one side of the frame
- 30 is connected to the right end of the arm
- 31 are moved into engagement with the lead wire to sever the lead wire from the wire supply.
- 31 are positioned with respect to the position of the end of the quill 26 and block 24 so as to sever the wire a predetermined distance from the lower end of the quill.
- the cutting surfaces of the jaws are selected also to form, as shown in Fig, 13, a point at the end of the wire as they sever the lead wire therefrom. This prepares the end of the wire to receive the solder pellet, as hereinbefore explained.
- 31 are mounted on pivots
- is trapezoidal in cross section and fits into a suitably formed recess
- the operator presses a button shaped end Idil of a plate
- 45 is retained on the plate
- the forward end of the plate M5 is wedge-shaped and iits between the rear arms of the jaws
- the jaws may be pivoted and closed.
- the plate I4 which carries the jaws
- 48 is provided in the rear end of the plate MI to receive a portion of the spring
- 56 is mounted on the lower side of the shoulder H29 at the rear end of the plate Mi and is engageable with the rear of the fixed block
- the plate may be moved forward a short distance to close the jaws and thereby to sever the lead wire, the stop member
- a. new portion of the jaws l?. may be used in cutting the wire, thus extending the useful life of these jaws.
- are mounted on the upper side of the plate lili and attached t0 the rear of the jaws
- 52 are positioned in cylindrical recesses
- extends into an elongated slot
- the crystal After a lead wire has been soldered to one side of the crystal, the crystal is turned over, as shown in Figs. 16 and 1'1, and a second lead wire soldered to the opposite side thereof. This completes the soldering operation.
- the arm 23 may then be pivoted to the right, as viewed in Fig. l, and rested on a Y-shaped support
- An apparatus for soldering a lead wire to a crystal comprising a head for guiding and supplying a wire, means for carrying said head in a predetermined path, a punch and die assembly located in said path for punching a pellet of solder from a strip, means for positioning said head and lead wire in the path of the pellet being punched for impaling the solder on the end of said wire held in said head, a iluxing means located in said path for applying a predetermined amount of flux to the end of said wire extending from said head, means movable into said path for forming 9 the pellet impaled on the end of said wire and for causing it to fuse to said Wire, and means for heating said solder while in contact with said crysta1 in said predetermined path to fuse said Wire and to attach the Wire to said crystal.
- An apparatus for soldering a lead Wire to a crystal comprising a head for guiding and supplying a Wire, means for carrying said head in a predetermined path, a punch and die assembly located in said path for punching a pellet of solder from a strip, means for positioning said head and lead wire in the path of the pellet being punched for impaling the solder on the end of said Wire held in said head, a luxing means located in said path for applying a predetermined amount of uX to the end of said Wire extending from said head, means movable into said path for forming the pellet impaled on the end of said wire and for causing it to fuse to said Wire, means for heating said solder while in contact with said crystal in said predetermined path to fuse said wire and to attach the wire to said crystal, and means for severing said Wire a predetermined distance from said head to form a point on the severed end of said Wire remaining in said head, said last mentioned means being slidably mounted for movement into said path to operate
- an apparatus for attaching a lead Wire to a crystal means movable through a xed path for supporting the lead Wire, means positioned in said path for applying a quantity of solder to the end of the Wire, means in alignment With said path for supporting a crystal, means for heating said solder, means for forming said solder to a predetermined shape on the end of a wire supported by said supporting means prior to fusing said solder to said crystal including a solder forming element to Which the solder will not adhere, means for positioning said forming element in position to be engaged by the solder applied on the end of the Wire, means for heating the solder while in engagement with said forming element, and means for severing said lead Wire a predetermined distance from said crystal.
- An apparatus for soldering lead wires to crystals comprising a head movable through a predetermined path for guiding and supplying a wire, a punch and die assembly for punching a pellet of solder from a strip and impaling the solder on the end of said Wire While the wire is held by the head at a predetermined point in said path, means for aligning said head With said assembly, means associated with said assembly for advancing said strip in timed relationV to the punching operation, iluxing means lying in said path for applying a quantity of flux to the end of said wire during its movement by the head in moving through said path, means movable into alignment With said wire carried by the head for forming the pellet impaled on'the end of said wire for causing it to fuse to said wire, means adjacent said path for directing heat into said path for heating said solder While in contact With a crystal from a strip, impaling said pellet on the end of 1 said Wire, applying a lux to said solder pellet and the end of said Wire, heating and forming
- the method of attaching a lead wire to a crystal comprising punching a pellet of solder from a strip, impaling said pellet on the end of said Wire, applying a flux to said solder pellet and the end of said wire, heating and forming said solder to cause said solder to assume a substantially cone shape, heating said solder in contact with a crystal to attach said lead Wire to said crystal, and then severing the lead Wire a predetermined distance from said crystal, said severing operation being performed so as to form a point at the severed end of said lead wire.
- a head movable through a predetermined path for supporting a wire during the preparation thereof and attachment thereto of a crystal, means in alignment with said path for punching a pellet of solder from a strip and operable as lan incident to the punching operation for impaling said solder pellet on the end of said Wire, means in said path for applying flux at the to fuse said solder and to attach the wire t0 a crystal, and means movable into said path for severing said wire a predetermined distance from said head to form a point on the severed end of said Wire remaining in said head.
- An apparatus for attaching a solder pellet to a wire comprising means for supporting a Wire in a predetermined position, means for advancing a strip of solder, means for punching a pellet from said strip and impaling on said wire, and common means for actuating said advancing and punching means comprising a common actuator, a punch actuating lever positioned to be actuated by said common actuator, a pavvl and ratchet for actuating said advancing means, a plunger for actuating the pawl, and a lever positioned to be actuated by said common actuator and to operate said plunger.
- a head for guiding and supplying a Wire means for carrying said head in a predetermined path, and means in said path for impaling a pellet of solder on said Wire
- a reciprocatory punch means for positioning said head to align the Wire carried by it in alignment with said punch, a die for cooperating with said punch, means for feeding a strip of solder between the punch and die, and means for actuating said punch to punch a pellet of solder from the strip and force it through the die and onto the Wire.
- an .apparatus for attaching a lead wire to a crystal means for supporting a Wire in a predetermined position to receive a pellet of solder, means for applying said pellet of solder to the end of said Wire including a punch and die assembly operable in a single stroke to punch said pellet of solder from a strip thereof and to impale it on said wire, said punch being movable coaxially of the wire in said predetermined position to carry the pellet through the die to the Wire, a lever arm for moving said punch relative to said die, a pair of rollers for advancing said strip to position between the punch and die, and common means for operating said lever arm and actuating said rollers.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
Oct. 22, 1946. Y T. A. DANxEL 2,409,615
v METHOD OF AND APPARATUS FOR SOLDERING Filed sept. '16, 1943v 5 sheets-Sheet 1 f2.5.. IE6
' /A/vfA/m? 234. DAN/Z 0ct.`22, 1946. T. A. DANIEL 2,409,615
METHOD OF AND APPARATUS FOR- SOLDERING h l Filed sept. 16, 194s 5 sheets-sheet 2 @Uff-72M Oct; 22,1946. T. A. DANIEL 1 l '2,409,615
` METHQD oF AND APPARATUS Fon SOLDERIN'G Filed Sept. 16, 1943 `5 Sheetsl-Sheetv Arran/fr.
ou. 22, 1946, T, g, AMEL 2,409,615
.- METHOD OF AND APPARATUS FOR SOLDERING A 'Z'AA/v/a V///// A m47 M ,47m/wir T. A. DANIEL METHOD oF AND APPARATUS FOR soLDERING Filed Sept. 16, 1945 Patented Oct. 22, 1946 METHOD OF AND APPARATUS FOR SOLDERING Thomas A. Daniel, Downers Grove, Ill., assignor to Western Electric Company, Incorporated, New York, N. Y., a corporation of New York Application September 16, 1943, Serial No. 502,628
10 Claims.
This invention relates to a method of and an apparatus for soldering and more particularly to a method of and an apparatus for soldering lead 'wires to quartz crystals.
the manufacture of electronic communicati'o'n equipment, it is sometimes desirable to emlpl'oy piezoelectric crystals as frequency control idevices. Where it is necessary to establish direct lcontact with these crystals, the sides of the crystals may be provided with a thin plating of a metallic compound and conducting wires may then be attached to either side of the crystals. In some types of crystal assemblies, these lead wires serve also as supports for the crystals and because the crystals may be subjected to considerable rough usage and consequent mechanical shocks in use, the supporting wires must be securely attached to the crystals. Also, the wires must be attached to the crystals at a definite point on each side in order to permit the crystals to operate efficiently.
An object of the present invention is to provide an efficient and effective method of and apparatus for soldering lead wires to quartz crystals.
In accordance with one embodiment of this invention, a soldering apparatus may be provided in which a pellet of solder is punched from a tape and impaledon a sharpened end of a lead` wire, the sharpening of the end of the Wire being performed at a soldering station where the end of the lead wire is cut off after the wire has been soldered to the crystal. A fluxing station is provided intermediate the punching and soldering station.
Other objects and advantages of the present invention will be apparent from the following detailed description taken in conjunction with the drawings, wherein Fig. 1 is a plan view of a soldering apparatus constructed in accordance with this invention;
Fig. 2 is a perspective View of a completed crystal;
Fig. 3 is a fragmentary plan View of the punch mechanism;
Fig. 4 is a sectional view along the line 4--4 of Fig. 3;
Fig. 5 is a sectional view along the line 5 5 of Fig. 3;
Fig. 6 is an irregular sectional View taken substantially along the line 6-6 of Fig. 3;
Fig. '7 is a detail sectional view showing the punch as it impales a pellet on the end of the lead wire; l
Fig. 8 is a side elevation, partly in section, along the line 8 3 of Fig. 1, showing the lead wire arm in position over the iiuxing station;
Fig. 9 is an enlarged sectional View along the line 9-9 of Fig. 8;
Fig. 10 is a sectional View similar to Fig. 9, eX-
cept that it shows the position of the flux cup in normal position when the lead wire arm is not positioned at that station;
Fig. 11 is an enlarged plan View showing particularly the soldering station;
Fig. 12 is an enlarged sectional view along the line |2-l2 of Fig. 11; i Fig. 13 is a detail view showing the wire cutting blades as they engage the lead wire;
Fig. 14 is asectional View along the line I4I4 of Fig. 12;
Fig. 15 is a sectional view along the line I5`I 5 of Fig. 11; Y
Fig. 16 is a sectional view along the line lG -|6 of Fig. 11; and l Fig. 17 is an enlarged fragmentary detail view, along the line |5l 5 of Fig. 11, showing the solder pellet forming plate in advanced position.
Referring now to the drawings and particularly to Fig. l, wherein the entire apparatus is illustrated in plan View, and to Fig. 8, wherein a sectional view is shown of the apparatus, it Willbe seen that this apparatus includes a long arm 2D,` of rod-like appearance, which is secured at one end, and pivotally supported by a universally pivotable supporting assembly, designated `generally as 2l, mounted on a table 22. The arm 20 `extends beyond the supporting assembly 2l to the right, `as viewed in Fig. 8, andthe extended portion, which is threaded, is provided with a weight 23, which `threadedly engages this threaded portion of the arm and which is selected to be suilicient to counterbalance the arm so that the'left end of the arm may be easily moved `and isad-` justable to provide the required pressure at the left end, as will be explained hereinafter.-
As may be seen in Figs. 4., l5 and 1,6, ahead.
24 is xed ,to the left end of the arm Zllgand i is providedwith a vertically extendingaperture 25, in which is positioned a quill 26, which serves as a guide for a wire 21. vAs may be seen rin Fig. 8, this wire is supplied from a spool 30 Arotatably mounted on the upper end of a vertical arm 3l, which is mounted on the table 2,2. VA thumb actuated lever 32 is pivotally mounted on a stud shaft 33 positioned in the forward` portion of the block 24 and is provided with an-inwardly bent portion 34, which is movable in a recess 35 formed in the left side ofv the block, as viewed in 4, so as to bear against the wire positioned in the quill, which is also suitably recessed at this point. Aspring 3B, mounted von a small handle 3l, which extends a short distance from the right of the block 2li, as viewed in Fig. l1, bears against- .they thumb actuated lever 32 and urges theportion 34 thereof against the wire. A pair of set screws til threaded in the block 24 holds the quill 25 in place.- i I Y The first station towhich "the arm is plvoted is the station where the Solder' penet is punched from a tape 39 and impaled on the end of the wire 21. This portion of the apparatus is illustrated particularlyinigs. 3 through ,'1. A portion 40 ofthe arm 2li-immediately adjacent the head 24 is somewhat reduced, as may be seen in Fig. 4, and is carefully machined to obtain a definite and precise dimension in this area. When the arm 20 is pivoted into position over the punching station, this reduced portion engages a vertically extending guidepostl, which is mounted on a plate 42, which is, inturmbolted to a base 43 of the punching apparatus. A second post 44, somewhat lower in `height than the post 4l, is also mounted on the plate t42 .and spaced a distance therefrom equivalent to the width of the reduced 'portion 40 of the arm 24. Thus, asthis reduced portion of the arm Zil engagesthe post 4I and is moved downward bythe operator, the opposite sideof-this reduced portion will be engagedby the post 44 and vthese posts then cooperate -to `position the arm with respect to the punching apparatus and in a denite relation thereto. Afstop member 45 is integrally formed with the plate 42 and positioned between the Yposts 4l and -44 and limits the downward movement of the arm 20. While this stop member is shown as integrally formed, it will be apparent that an adjustable member could be substituted therefor, such as a threaded post.
When the arm 20 is in position inthe guide assembly comprising the -posts 4l and 44 and the stop member 45, lthe end of the wire 21 in the quill 26 is positioned immediately above a die aperture 46- formed in a die plate 41, which is mounted on the punching assembly base-43. The solder -tape 39, which is supplied in strip form from any suitable source, is moved through a rectangular aperture 48 of relatively wider cross section than the tape andis formed in the lower side of the plate 42. The tape then passes through an aperture I formed inthe die plate 41 of slightly greater cross sectional size than the tape and `then between a pair of rollers 52 and 53, which engage, respectively, the upper and lowerfsides of lthe tape.
The upper roller 52 is provided with `a smooth periphery and serves primarily to urge the tape against the lower roller 53, the'periphery of which is serrated, since this roller acts as the driving roller. A shaft 54, which supports the upper roller, is mounted in a vertically slotted housing 55 tov permit vertical movement of the roll, while springs 55, having members 51 attached to the ends thereof, which bear against the'ends of the shaft 54, urge the roller 52 against the roller 53.
The drive roller 53 is actuated by a pawl 58, which is pivotally mounted on the upper end of a plunger 59, and engages the serrated periphery of the roller 53. Both the plunger and pawl assembly are positioned in an aperture S0 formed inthe lower side of the base block 43, as shown in Figs.k 4 and 6.. The plunger is actuated by a pivotally mounted lever arm G2, against the upper surface of which bears one end of a spring 63, as shown in Figs 4 and 6. The other end of the spring 63 bears against the lower side of the plunger 59. The lever arm 52 is actuated by a piston 64, which has a disc 65 fixed to the lower end thereof; The piston is moved up or down by a lever arm E6 piyotally mounted on a post 51 iixed tothe upper side of the base 43 and is connected to the piston 54 a short distance from the `post 61. A helically coiled spring 68 is positioned yabout the piston 64 and the upper end oi? the spring engages a collar member integrally formed with the upper end of the piston 68.
Thus, the piston 63 is `normally urged upward,
but may be moved downward by moving the lever 5 arm 56 downward and, when so moved, moves -the disc `55 against the right end of the lever arm 52, as viewed in Fig. 5, thereby pivoting the other end thereof upward and moving the plunger 59 and pawl upward, which rotates the roller 53 in :a counterclockwise direction, as viewed in Fig. .4. A spring detent 59 prevents reverse rotation of this roller.
The vertical movement of the plunger 59 is V limited by a pin 1l, which is threaded into the left side of the block 43, as viewed in Fig. 6, and, extending across the aperture 5), extends through an elongated slot 'l2 formed'in the lower portion of the plunger59. This'pin also serves to prevent axial rotation of the plunger and thus maintains correct axial position ofthe pawl l58 with respect to the drive roller 53. AWhen the plunger 59 has been raised to maximum height, continued downward movement of the piston 64 merely compresses the spring 53. A fiat spring 13, mounted in the lower side of the block 43, extends vinto a small recess 14 Iformed in the lower side of the-plunger159 and serves to return the plunger when the lever arm :56 is raised.
A second lever arm 15, which is pivotally mounted on a stud Shaft positioned between a pair of downwardly extending plates 11, is mounted on the lower side of the base 43. This shaft 15, it will benoted, serves also as a pivotal support for the lever arm t2, which is positioned adjacent the arm 15 so `that both are operated by the same piston t4. vDownward movement of the piston 54 causes the left end of the lever arm 15 to engage a disc 1E fixed tothe lower end of a punch 19, the upper end of which is reduced sufficiently so as to t in the aperture 45 formed in the die plate 41 when the punch is raised. The punch is slidably movable in a suitably yshaped aperture 8l formed in the base block 43, which is also provided with a somewhat larger recess S2 to receive a helically coiled spring 83, the lower end of which bears against the upper side of the disc 11, while the upper end of the spring bears against the upper side of the recess B2. When .the lever arm 55 is raised. at the completion of the punching operation, this spring returns the punch to the starting position.
It will be apparent, from the foregoing, that as the lever arm '66 .is moved downwardly, the strip 39 of solder is first advanced and .then as the plunger 59 becomes stationary because of the operation of the pin 1l, Vcontinued downward movement of .the lever arm 65 moves the punch 19 upward and punches a pellet of solder from the strip. The punch carries this pellet of sol- Go der into engagement with the lower end of the wire 21, which extends a predetermined distance from the lower end of the quill 25, the wire being held motionless by the spring-pressed inwardly bent portion 34 of the thumb operated lever 32. A flat spring member 84 is positioned adjacent the guide assembly, comprising the posts 4| and 44, to increase the frictional engagement between the reduced portion 40 of the arm 2i) and these posts so as to prevent the head 24, car- 70 rying the wire 21, from moving upwardly when the pellet of solder is pressed against the end of the wire. The counterbalance weight 23 is also adjusted to increase the downward pressure of the block 24 as necessary to prevent the wire 75 frommoving.
In effect, as shown in Fig. 7, the pellet is impaled on the end of the wire,'which is sharpened into a point. This sharpening operation is performed at the soldering station when the portion of the wire which is to be the lead wire of the crystal and which has been soldered to the crystal, is severed from the wire supply. This operation will be described in greater detail hereinafter.
In the next operation, a flux is applied to the lower end of the wire and to the solder pellet attached thereto. The arm 20 is lifted out of the guide assembly, including the posts 4| and 44, and moved to the left, as viewed in Fig. 1, to position the wire over a uxing assembly designated generally as B and shown in detail in Figs. 8, 9 and l0. The reduced portion 4i? or" the arm 20 is then positioned in a rectangular notch 86 formed in the upper portion of a guide plate 81, which is mounted on the table 22. As the head 24 which contains the quill 26 and wire Z'i is moved downwardly into the notch 80, the lower end of the head 2li engages a projecting pin 88, which is mounted on the upper side of a small tank 90. This tank, which contains fluxing fluid, is mounted on the upper end of a vertically disposed movable post 9|, being attached thereto by a set screw 92, threaded in a block t3 which is fixed to the lower side of the tank 90. This post 9| is movable vertically in an aperture 94 formed in the table 22 and is supported on the upper side of the left end of a flat spring S5, the other end of which is fixed to the'underside of the table 22, as sh-own in Fig. B. Thus, as the arm 20 moves down and the head 2li presses against the pin 83, the tank 90 is also moved downwardly. As the end of the wire 21 moves downwardly, it is immersed in fluxing fluid contained in a small cup 96 which is normally positioned beneath the surface of the fluid in the tank but which, being mounted on an upright stationary member 0l positioned adjacent the tank by a bracket arm 93, does not move downwardly as the tank moves downward. The depth of the notch 8E in the guide plate 8l is selected with reference to the position of the cup 95 so that when the arm 20 has been moved down-v wardly as far as possible, the desired amount of the wire 21, with a pellet of solder attached, projecting from the quill 2t, will be immersed in the cup 96, the tank 90 then being substantially beneath the cup B, as shown in Fig. 9. In this way, the level of the iiuxing uid, as applied to the end of the wire, is maintained uniform, the cup being relled as soon as the arm 20 is removed from the fluxing station and the amount of flux applied may be precisely controlled.
After the lower end of the wire has been provided' with the necessary fluxing mediurn,the arm 20 is again pivoted to the left and the 4wire is positioned over a soldering station designated generally at S9 and shown in Figs.` 1 and 1l to 17. As the arm moves to the left andis positioned over the soldering station, the reduced portion 40 of the arm Zd enters a C-shaped aperture |90 formed in a guideplate lill, which is mounted onl a base block |02 supported on the table 22, being separated therefrom by strips of insulating material |03. The C-shaped aperture |00 is 'so formedthat when the reduced portion of the arm 20 enters the lower portion thereof and rests on the upper portion of a vertically movable threaded stop member |04, it will be positioned so as to accurately align theend of the wire 21 with respect to a pair of right-angled notches large plate |05 formed in a pairof slidably mounted clamping plates |06 which engage a crystal |01 during the soldering operation.r The end 0f the wire 21 projecting from the quill 2G is then just above the surface of the crystal so that the end of the lead wire, when soldered t0 the crystal, does not vactually touch the crystal.
However, prior to assembling a crystal between the clamping plates, in some instances it is desirable to heat and form the pellet of solder to cause it to flow a short distance up the wire and to fuse to the wire, and also `to flatten the base of the pellet, forming, in effect, a cone at the end of the Wire. This may be done by inserting the end of a flat elongated spring member |08 in the position normally occupied by the crystal prior `to lowering the wire guide block 2li. Then, as -the block 24 is lowered, the pellet of solder and the wire rest on the upper surface of the end o f the member |08. This member, which is resilient s0 that.it may be readily moved into and out of position, is mounted in a slotted aperture I0 eX- tending through the upper portion of .a block positioned at the left of the soldering station, as shown in Fig. 11, and is provided with a knob |2 by which is may be slid into position. With the solder pellet in position on the spring |08, heat is applied to the solder from a jet ||3 from which heated air may be projected to melt the solder. It has been found that the air may be sufficiently heated to cause the solder to fuse inv a very few seconds by passing the air through the jet at low pressure, the jet being provided with heating coils (not shown). The member |08 is provided with a surface such as stainless steel, to which solder does not adhere, and, thus, when the warm air supply is shut off, the end of the wire with the solder fusedthereto in the form lof a cone, may be easily removed therefrom. The member |08 is then withdrawn. i
A crystal |01 is then positioned between the notches |05 in the clamping plates |06 and the plates are moved together.` As may berseen in Figs. 11 and 15, the plates |06 are provided with raised upper portions H4, or shoulders, inthe areas adjacent the notches or jaws |05. The sides of these raised portions are bevelled inwardly from left to right, as viewed in Fig.' 11, so that cooperatively they form a truncated wedge. Normally, the plates |06 are pulled apart by springs H6, which are mounted on opposite sides of the soldering assembly base and are attached to the rear of the plates. However, when it is desired to clamp a crystal between the plates, a havingr a recess ||8 formed therein, as shown in Fig. 1l, is moved to the left, as viewed in Fig. 16. The sides of the recess ||8 are bevelled outwardly and engage the inwardly bevelled edges of the raisedportions ||4 of the plates It, and urge them together asthe plate is moved to the left. The plates |06 .are slidable in rectangular channels H9 formed in the upper surface of the block |02, as shown in Figs. 15 yand 16. Since the plates move along a common aXis, centering of the crystal is insured regardless of the size of the crystal, the apexes of the notches |05 being directly opposite each other.
When the crystal is positioned between the jaws |05, which serveY Vprimarily to align the crystal with respect .to the end of the wire 21, it is also supported on a` tubular member IZI, which is positioned in a recess |22 formed in the block |02. The purpose ofusing this .tubular type of support is to permit a lead wire to be attached to both sides of the crystal. It will be apparent that in this: way, after; a lead wire has been attached to one side of the crystal, it may be merely turned over and the lead wire positioned so as to extend along the inside of the tubular member 2| while the crystal is then supported on the upper edges of the tubular member Without interference.
The large recessed plate 1, which, as hereinbefore stated, is slidably mounted, is positioned in a rectangular frame |25, Ithe two opposite sides of which serve as a guide therefor. An arm |26, which is pivotally attached to one side of the frame |25, is connected to the upper surface of the plate ||1 by a bolt |21 mounted in the plate |1 and which extends through an elongated slot |28 formed in the arm |25. A link arm |30 is connected to the right end of the arm |26, as viewed. in Fig. 11, by a pin |'3|, which extends into an elongated slot |33, the link arm |39 being slidably movable along the side of the block |03 and supported thereon by a pair of bolts |34, which extend through elongated slots |35 formed in the link arm |30 and extending longitudinally therealong. Moving the link arm |30 to the left, as viewed in Fig. 8, moves the recessed plate |1 to the left and, consequently, clamps the plates |06 against the crystal |01 positioned between the notches |55 formed therein. Heat is then applied from the jet ||3 to fuse the solder to the crystal, the surface of which may be previously prepared, as by spotting, to provide a surface to which the solder will readily adhere. The heat is then shut 01T and the solder permitted to cool for a moment and then the operator presses the thumb actuated lever 32 to release the inwardly bent portion 34 of this lever from the wire 21 to permit the lead wire to move freely through the quill 26, and operator lifts the block 24 vertically until the upper surface of the block 24| engages the lower end of a threaded post |36. The wire remains stationary since its end is soldered to the crystal, which is held stationary. This post |35 is threaded through the upper horizontal portion of the plate IUI and is made vertically adjustable so that the lead wire length may be selected as desired.
While the block 25 is held against this adjustable member |36, a pair of cutting jaws |31 are moved into engagement with the lead wire to sever the lead wire from the wire supply. The jaws |31 are positioned with respect to the position of the end of the quill 26 and block 24 so as to sever the wire a predetermined distance from the lower end of the quill. The cutting surfaces of the jaws are selected also to form, as shown in Fig, 13, a point at the end of the wire as they sever the lead wire therefrom. This prepares the end of the wire to receive the solder pellet, as hereinbefore explained. These jaws |31 are mounted on pivots |43 set in the forward end of a plate IM, which is slidably mounted on a supporting block |42, the jaws extending a short distance beyond the plate MI. As may be seen in Fig. 14, the plate |4| is trapezoidal in cross section and fits into a suitably formed recess |43, which extends longitudinally along the upper surface of theblock |42, the sides of the recess thus serving as guides for the slidable plate I4 I.
In operating the cutting jaws to sever the wire 21, the operator presses a button shaped end Idil of a plate |45, which is slidably positioned on the upper surface of the plate |41, to move this plate |45 forward. As may be seen in Figs. 11, 12 and 14, the plate |45 is retained on the plate |l| by a pair of cross plates |615y which extend transversely across the plate |45 and which are bolted at their ends to the plate The forward end of the plate M5 is wedge-shaped and iits between the rear arms of the jaws |31, as may be seen in Fig. 11. Thus, by moving the plate |65, the jaws may be pivoted and closed. However, during the first part of the forward movement of the plate |45, the plate I4 which carries the jaws |31, is also slid forward, being urged forward by a helically coiled spring |41 positioned between the -inner side of the button |114 and the rear end of the plate |4|. A recess |48 is provided in the rear end of the plate MI to receive a portion of the spring |41, the rear end cf the plate |l|| being provided with a downwardly extending shoulder |65. An adjustable stop member |56 is mounted on the lower side of the shoulder H29 at the rear end of the plate Mi and is engageable with the rear of the fixed block |52 to limit the forward movement of the plate |l| l. After the block |62 is contacted by the stop member |5il, however, the plate may be moved forward a short distance to close the jaws and thereby to sever the lead wire, the stop member |59 being adjusted to properly position the jaws with respect to the lead wire. By slightly changing the adjustment of the stop member |55, a. new portion of the jaws l?. may be used in cutting the wire, thus extending the useful life of these jaws.
A pair of springs |5| are mounted on the upper side of the plate lili and attached t0 the rear of the jaws |31, thus urging the jaws open. Two helically coiled springs |52 are positioned in cylindrical recesses |53 formed in the block |42 and two pins |54, mounted on the lower side of the plate |l|| and extending downwardly therefrom through elongated slots |55 in the block |52, are engaged by the rear ends of these springs |52, as may be seen in Figs. l2 and 14. These springs return the plate |l|| and associated parts after the operator releases the button IM. A pin |56, mounted in the upper surface of the plate |l|| extends into an elongated slot |51 and retains the plate |45 on the plate MI while permitting the necessary relative movement therebetween to operate the jaws |31.
After a lead wire has been soldered to one side of the crystal, the crystal is turned over, as shown in Figs. 16 and 1'1, and a second lead wire soldered to the opposite side thereof. This completes the soldering operation. The arm 23 may then be pivoted to the right, as viewed in Fig. l, and rested on a Y-shaped support |51, which is mounted on the table 22 and is positioned substantially midway between the soldering and fluxing stations. The operator then removes the completed crystal.
While but one embodiment of this invention has been shown and described, it will be understood that many modifications may be made therein without departing from the spirit or scope of the present invention, which is limited only by the appended claims.
What is claimed is:
l. An apparatus for soldering a lead wire to a crystal comprising a head for guiding and supplying a wire, means for carrying said head in a predetermined path, a punch and die assembly located in said path for punching a pellet of solder from a strip, means for positioning said head and lead wire in the path of the pellet being punched for impaling the solder on the end of said wire held in said head, a iluxing means located in said path for applying a predetermined amount of flux to the end of said wire extending from said head, means movable into said path for forming 9 the pellet impaled on the end of said wire and for causing it to fuse to said Wire, and means for heating said solder while in contact with said crysta1 in said predetermined path to fuse said Wire and to attach the Wire to said crystal.
2. An apparatus for soldering a lead Wire to a crystal comprising a head for guiding and supplying a Wire, means for carrying said head in a predetermined path, a punch and die assembly located in said path for punching a pellet of solder from a strip, means for positioning said head and lead wire in the path of the pellet being punched for impaling the solder on the end of said Wire held in said head, a luxing means located in said path for applying a predetermined amount of uX to the end of said Wire extending from said head, means movable into said path for forming the pellet impaled on the end of said wire and for causing it to fuse to said Wire, means for heating said solder while in contact with said crystal in said predetermined path to fuse said wire and to attach the wire to said crystal, and means for severing said Wire a predetermined distance from said head to form a point on the severed end of said Wire remaining in said head, said last mentioned means being slidably mounted for movement into said path to operate on the wire held in the head.
3. In an apparatus for attaching a lead Wire to a crystal, means movable through a xed path for supporting the lead Wire, means positioned in said path for applying a quantity of solder to the end of the Wire, means in alignment With said path for supporting a crystal, means for heating said solder, means for forming said solder to a predetermined shape on the end of a wire supported by said supporting means prior to fusing said solder to said crystal including a solder forming element to Which the solder will not adhere, means for positioning said forming element in position to be engaged by the solder applied on the end of the Wire, means for heating the solder while in engagement with said forming element, and means for severing said lead Wire a predetermined distance from said crystal.
4. The method of attaching a lead Wire to a crystal comprising punching a pellet of solder end of said Wire comprising a movable tank, a stationary cup positioned Within said tank, said tank being movable relatively to said head, means actuated by said head for moving said tank relatively to said clip, the end of said Wire then being immersed in said cup, and means positioned along said path and operable on the wire moving in said path for heating said solder While in contact With the crystal to attach said Wire to said crystal.
7. An apparatus for soldering lead wires to crystals comprising a head movable through a predetermined path for guiding and supplying a wire, a punch and die assembly for punching a pellet of solder from a strip and impaling the solder on the end of said Wire While the wire is held by the head at a predetermined point in said path, means for aligning said head With said assembly, means associated with said assembly for advancing said strip in timed relationV to the punching operation, iluxing means lying in said path for applying a quantity of flux to the end of said wire during its movement by the head in moving through said path, means movable into alignment With said wire carried by the head for forming the pellet impaled on'the end of said wire for causing it to fuse to said wire, means adjacent said path for directing heat into said path for heating said solder While in contact With a crystal from a strip, impaling said pellet on the end of 1 said Wire, applying a lux to said solder pellet and the end of said Wire, heating and forming said solder to cause said solder to assume a substantially cone shape, and then heating said solder in contact With a crystal to attach said lead Wire to said crystal.
5. The method of attaching a lead wire to a crystal comprising punching a pellet of solder from a strip, impaling said pellet on the end of said Wire, applying a flux to said solder pellet and the end of said wire, heating and forming said solder to cause said solder to assume a substantially cone shape, heating said solder in contact with a crystal to attach said lead Wire to said crystal, and then severing the lead Wire a predetermined distance from said crystal, said severing operation being performed so as to form a point at the severed end of said lead wire.
6. In an apparatus for attaching a lead Wire to a crystal, a head movable through a predetermined path for supporting a wire during the preparation thereof and attachment thereto of a crystal, means in alignment with said path for punching a pellet of solder from a strip and operable as lan incident to the punching operation for impaling said solder pellet on the end of said Wire, means in said path for applying flux at the to fuse said solder and to attach the wire t0 a crystal, and means movable into said path for severing said wire a predetermined distance from said head to form a point on the severed end of said Wire remaining in said head.
8. An apparatus for attaching a solder pellet to a wire comprising means for supporting a Wire in a predetermined position, means for advancing a strip of solder, means for punching a pellet from said strip and impaling on said wire, and common means for actuating said advancing and punching means comprising a common actuator, a punch actuating lever positioned to be actuated by said common actuator, a pavvl and ratchet for actuating said advancing means, a plunger for actuating the pawl, and a lever positioned to be actuated by said common actuator and to operate said plunger.
9. In an .apparatus for soldering a lead wire to a crystal, a head for guiding and supplying a Wire, means for carrying said head in a predetermined path, and means in said path for impaling a pellet of solder on said Wire comprising a reciprocatory punch, means for positioning said head to align the Wire carried by it in alignment with said punch, a die for cooperating with said punch, means for feeding a strip of solder between the punch and die, and means for actuating said punch to punch a pellet of solder from the strip and force it through the die and onto the Wire.
l0, In an .apparatus for attaching a lead wire to a crystal, means for supporting a Wire in a predetermined position to receive a pellet of solder, means for applying said pellet of solder to the end of said Wire including a punch and die assembly operable in a single stroke to punch said pellet of solder from a strip thereof and to impale it on said wire, said punch being movable coaxially of the wire in said predetermined position to carry the pellet through the die to the Wire, a lever arm for moving said punch relative to said die, a pair of rollers for advancing said strip to position between the punch and die, and common means for operating said lever arm and actuating said rollers.
THOMAS A. DANIEL.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US502628A US2409615A (en) | 1943-09-16 | 1943-09-16 | Method of and apparatus for soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US502628A US2409615A (en) | 1943-09-16 | 1943-09-16 | Method of and apparatus for soldering |
Publications (1)
Publication Number | Publication Date |
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US2409615A true US2409615A (en) | 1946-10-22 |
Family
ID=23998672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US502628A Expired - Lifetime US2409615A (en) | 1943-09-16 | 1943-09-16 | Method of and apparatus for soldering |
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US (1) | US2409615A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2584297A (en) * | 1948-12-09 | 1952-02-05 | Western Electric Co | Apparatus for guiding lead wires to be soldered to crystals |
US2842841A (en) * | 1955-06-13 | 1958-07-15 | Philco Corp | Method of soldering leads to semiconductor devices |
US3079482A (en) * | 1960-08-12 | 1963-02-26 | Western Electric Co | Method of soldering wiring assemblies |
US3083595A (en) * | 1960-10-06 | 1963-04-02 | Western Electric Co | Thermo-compression bonding apparatus |
US3089449A (en) * | 1960-06-20 | 1963-05-14 | Western Electric Co | Solder applying apparatus |
US3731368A (en) * | 1969-08-08 | 1973-05-08 | Erie Technological Prod Inc | Method of making lead and solder preform assembly |
-
1943
- 1943-09-16 US US502628A patent/US2409615A/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2584297A (en) * | 1948-12-09 | 1952-02-05 | Western Electric Co | Apparatus for guiding lead wires to be soldered to crystals |
US2842841A (en) * | 1955-06-13 | 1958-07-15 | Philco Corp | Method of soldering leads to semiconductor devices |
US3089449A (en) * | 1960-06-20 | 1963-05-14 | Western Electric Co | Solder applying apparatus |
US3079482A (en) * | 1960-08-12 | 1963-02-26 | Western Electric Co | Method of soldering wiring assemblies |
US3083595A (en) * | 1960-10-06 | 1963-04-02 | Western Electric Co | Thermo-compression bonding apparatus |
US3731368A (en) * | 1969-08-08 | 1973-05-08 | Erie Technological Prod Inc | Method of making lead and solder preform assembly |
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