GB9909042D0 - Semiconductor device and method of manufacture - Google Patents

Semiconductor device and method of manufacture

Info

Publication number
GB9909042D0
GB9909042D0 GBGB9909042.5A GB9909042A GB9909042D0 GB 9909042 D0 GB9909042 D0 GB 9909042D0 GB 9909042 A GB9909042 A GB 9909042A GB 9909042 D0 GB9909042 D0 GB 9909042D0
Authority
GB
United Kingdom
Prior art keywords
manufacture
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9909042.5A
Other versions
GB2336719A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of GB9909042D0 publication Critical patent/GB9909042D0/en
Publication of GB2336719A publication Critical patent/GB2336719A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • H01L29/4983Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET with a lateral structure, e.g. a Polysilicon gate with a lateral doping variation or with a lateral composition variation or characterised by the sidewalls being composed of conductive, resistive or dielectric material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568Lateral single gate silicon transistors
    • H01L29/66575Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
    • H01L29/6659Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Formation Of Insulating Films (AREA)
GB9909042A 1998-04-20 1999-04-20 Sidewall insulating films for field effect transistors Withdrawn GB2336719A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10109734A JP3107157B2 (en) 1998-04-20 1998-04-20 Semiconductor device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
GB9909042D0 true GB9909042D0 (en) 1999-06-16
GB2336719A GB2336719A (en) 1999-10-27

Family

ID=14517899

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9909042A Withdrawn GB2336719A (en) 1998-04-20 1999-04-20 Sidewall insulating films for field effect transistors

Country Status (5)

Country Link
JP (1) JP3107157B2 (en)
KR (1) KR19990083320A (en)
CN (1) CN1233857A (en)
GB (1) GB2336719A (en)
TW (1) TW410372B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4215787B2 (en) 2005-09-15 2009-01-28 エルピーダメモリ株式会社 Semiconductor integrated circuit device and manufacturing method thereof
CN102201341B (en) * 2010-03-22 2015-09-09 中芯国际集成电路制造(上海)有限公司 Manufacture the method for nmos pass transistor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW203148B (en) * 1991-03-27 1993-04-01 American Telephone & Telegraph
US5976939A (en) * 1995-07-03 1999-11-02 Intel Corporation Low damage doping technique for self-aligned source and drain regions
WO1997013273A1 (en) * 1995-10-04 1997-04-10 Intel Corporation Formation of source/drain from doped glass
KR970030891A (en) * 1995-11-21 1997-06-26 윌리엄 이. 힐러 Rapid thermal annealing in MOS technology

Also Published As

Publication number Publication date
TW410372B (en) 2000-11-01
KR19990083320A (en) 1999-11-25
JP3107157B2 (en) 2000-11-06
CN1233857A (en) 1999-11-03
JPH11307759A (en) 1999-11-05
GB2336719A (en) 1999-10-27

Similar Documents

Publication Publication Date Title
GB2369243B (en) Semiconductor device and method of manufacture
GB2329069B (en) Semiconductor device and method of manufacture
GB2359191B (en) Semiconductor device and method of manufacturing the same
SG74115A1 (en) Semiconductor device and its manufacturing method
GB2332777B (en) Semiconductor device and method of manufacture
EP1120822A4 (en) Method of manufacturing semiconductor device
GB2344464B (en) Semiconductor device and manufacturing method thereof
GB2336469B (en) Semiconductor device and manufacturing method of the same
EP1187183A4 (en) Method of manufacturing semiconductor device and manufacturing line thereof
GB2322005B (en) Semiconductor device and manufacturing method of the same
GB2334621B (en) Method of manufacturing semiconductor device
AU2692500A (en) Semiconductor device and method of manufacture thereof
SG84573A1 (en) Semiconductor device and method of fabricating the same
SG68032A1 (en) Semiconductor device and method of manufacturing the same
GB9924626D0 (en) Semiconductor device and method of forming the same
GB2336717B (en) Semiconductor device and method of making the same
EP1030375A4 (en) Semiconductor device and its manufacturing method
EP1111686A4 (en) Semiconductor device and method of manufacture thereof
SG73599A1 (en) Semiconductor device and method of manufacturing the same and electronic apparatus
AU2073599A (en) Semiconductor device and method of production thereof and semiconductor mountingstructure and method
GB2306780B (en) Semiconductor device and method of manufacture
EP1146573A4 (en) Semiconductor device and method of manufacture thereof
EP1065714A4 (en) Method of fabricating semiconductor device
GB9824430D0 (en) Method of manufacturing semiconductor device
EP1052313A4 (en) Silicon wafer and method of manufacture thereof

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)