GB9806524D0 - Chip scale carrier - Google Patents

Chip scale carrier

Info

Publication number
GB9806524D0
GB9806524D0 GBGB9806524.6A GB9806524A GB9806524D0 GB 9806524 D0 GB9806524 D0 GB 9806524D0 GB 9806524 A GB9806524 A GB 9806524A GB 9806524 D0 GB9806524 D0 GB 9806524D0
Authority
GB
United Kingdom
Prior art keywords
chip scale
scale carrier
carrier
chip
scale
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9806524.6A
Other versions
GB2325355A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PFAFF WAYNE
Original Assignee
PFAFF WAYNE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PFAFF WAYNE filed Critical PFAFF WAYNE
Publication of GB9806524D0 publication Critical patent/GB9806524D0/en
Publication of GB2325355A publication Critical patent/GB2325355A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
GB9806524A 1997-03-28 1998-03-26 Socket for chip testing Withdrawn GB2325355A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4173697P 1997-03-28 1997-03-28
US709498A 1998-01-14 1998-01-14

Publications (2)

Publication Number Publication Date
GB9806524D0 true GB9806524D0 (en) 1998-05-27
GB2325355A GB2325355A (en) 1998-11-18

Family

ID=26676503

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9806524A Withdrawn GB2325355A (en) 1997-03-28 1998-03-26 Socket for chip testing

Country Status (3)

Country Link
DE (1) DE19814164A1 (en)
GB (1) GB2325355A (en)
IT (1) IT1299400B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113484554A (en) * 2021-07-15 2021-10-08 贵州电网有限责任公司 Experimental terminal box of electric energy meter

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10125905C1 (en) 2001-05-28 2002-11-28 Infineon Technologies Ag Releasable coupling between IC chip and carrier uses interlocking mechanical coupling elements provided by IC chip and carrier
US11723154B1 (en) * 2020-02-17 2023-08-08 Nicholas J. Chiolino Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3596228A (en) * 1969-05-29 1971-07-27 Ibm Fluid actuated contactor
US4981817A (en) * 1988-12-29 1991-01-01 International Business Machines Corporation Tab method for implementing dynamic chip burn-in

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113484554A (en) * 2021-07-15 2021-10-08 贵州电网有限责任公司 Experimental terminal box of electric energy meter

Also Published As

Publication number Publication date
DE19814164A1 (en) 1998-10-01
ITRM980201A0 (en) 1998-03-27
IT1299400B1 (en) 2000-03-16
GB2325355A (en) 1998-11-18
ITRM980201A1 (en) 1999-09-27

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)