GB968230A - Method of producing semiconductor devices - Google Patents
Method of producing semiconductor devicesInfo
- Publication number
- GB968230A GB968230A GB120862A GB120862A GB968230A GB 968230 A GB968230 A GB 968230A GB 120862 A GB120862 A GB 120862A GB 120862 A GB120862 A GB 120862A GB 968230 A GB968230 A GB 968230A
- Authority
- GB
- United Kingdom
- Prior art keywords
- nickel
- layer
- junction
- lead
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000000034 method Methods 0.000 title abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 14
- 229910052759 nickel Inorganic materials 0.000 abstract 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 3
- 229910052737 gold Inorganic materials 0.000 abstract 3
- 239000010931 gold Substances 0.000 abstract 3
- 229910000978 Pb alloy Inorganic materials 0.000 abstract 2
- 239000010953 base metal Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 239000004332 silver Substances 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000000969 carrier Substances 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 230000007547 defect Effects 0.000 abstract 1
- 238000009792 diffusion process Methods 0.000 abstract 1
- 239000012535 impurity Substances 0.000 abstract 1
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- 239000011133 lead Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
- H01L29/0661—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body specially adapted for altering the breakdown voltage by removing semiconductor material at, or in the neighbourhood of, a reverse biased junction, e.g. by bevelling, moat etching, depletion etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Thyristors (AREA)
- Weting (AREA)
Abstract
968,230. Semi-conductor devices. BROWN, BOVERI & CO. Ltd. Jan. 12, 1962 [Jan. 13, 1961], No. 1208/62. Heading H1K. A method of producing semi-conductor elements with PN junctions comprises forming a layer of opposite conductivity type on a body of semi-conductor material of the other conductivity type and then coating the body with a layer of nickel, an element then being cut out of the body perpendicularly to the nickel layer and the adjacent PN junction of one face and being ground so that the element is bevelled to reduce the area of the nickel coating and to expose the edge of the PN junction within the area of the bevel. As compared with customary Mesa constructions the invention increases the distance between the edge of the PN junction and the nickel coat which constitutes an electrode. As shown in Fig. 5, the body 1 of silicon has an impurity layer 2 formed by diffusion, the layer having been removed from the bottom surface and replaced by a doped layer 4 for the injection of majority carriers. The whole of body 1 is coated with nickel 5 which may be protected against subsequent etching by a gold topcoat. The body is then cut, by a cutting tool or by a tool with the use of a grinding medium, to have the shape shown in Fig. 6, the plan view corresponding to which is circular. On one side of the element the nickel coat is reduced in area to the disc 7 and at the midpoint of the bevel 6 the PN junction 8 is exposed. Gold, silver, or base metal leads may be connected to the nickel layers 7 and 5 on opposite sides of the element by means of a lead or lead alloy solder. The element may be etched to remove lattice defects due to grinding, but this is not necessary if the grinding medium is fine enough. If etching is employed it may be done before or after the attachment of leads and if employed in the latter case when the leads are of base metal, such as copper, they must be protected with a coat of gold, silver or lead, and the lead or lead alloy solder is chlorinated. The resulting element has a P+PN structure.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEB60834A DE1154871B (en) | 1961-01-13 | 1961-01-13 | Method for producing semiconductor components with at least one pn junction |
Publications (1)
Publication Number | Publication Date |
---|---|
GB968230A true GB968230A (en) | 1964-09-02 |
Family
ID=6972991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB120862A Expired GB968230A (en) | 1961-01-13 | 1962-01-12 | Method of producing semiconductor devices |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH397878A (en) |
DE (1) | DE1154871B (en) |
GB (1) | GB968230A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3268309A (en) * | 1964-03-30 | 1966-08-23 | Gen Electric | Semiconductor contact means |
US3368120A (en) * | 1965-03-22 | 1968-02-06 | Gen Electric | Multilayer contact system for semiconductor devices |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL215949A (en) * | 1956-04-03 | |||
NL241982A (en) * | 1958-08-13 | 1900-01-01 | ||
FR1213751A (en) * | 1958-10-27 | 1960-04-04 | Telecommunications Sa | Process for manufacturing transistrons with n-p-n junctions obtained by double diffusion |
FR1228285A (en) * | 1959-03-11 | 1960-08-29 | Semiconductor structures for parametric microwave amplifier |
-
1961
- 1961-01-13 DE DEB60834A patent/DE1154871B/en active Pending
-
1962
- 1962-01-11 CH CH28962A patent/CH397878A/en unknown
- 1962-01-12 GB GB120862A patent/GB968230A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CH397878A (en) | 1965-08-31 |
DE1154871B (en) | 1963-09-26 |
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