GB9623706D0 - Automated soldering system - Google Patents
Automated soldering systemInfo
- Publication number
- GB9623706D0 GB9623706D0 GBGB9623706.0A GB9623706A GB9623706D0 GB 9623706 D0 GB9623706 D0 GB 9623706D0 GB 9623706 A GB9623706 A GB 9623706A GB 9623706 D0 GB9623706 D0 GB 9623706D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- soldering system
- automated soldering
- automated
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9623706A GB2319202A (en) | 1996-11-14 | 1996-11-14 | Hot gas soldering |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9623706A GB2319202A (en) | 1996-11-14 | 1996-11-14 | Hot gas soldering |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9623706D0 true GB9623706D0 (en) | 1997-01-08 |
GB2319202A GB2319202A (en) | 1998-05-20 |
Family
ID=10802934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9623706A Withdrawn GB2319202A (en) | 1996-11-14 | 1996-11-14 | Hot gas soldering |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2319202A (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4693408A (en) * | 1985-02-14 | 1987-09-15 | American Telephone And Telegraph, Company At&T Technologies, Inc. | Apparatus for bonding connector terminals to circuit boards |
US4787548A (en) * | 1987-07-27 | 1988-11-29 | Pace Incorporated | Nozzle structure for soldering and desoldering |
US5042571A (en) * | 1988-08-02 | 1991-08-27 | Sierra Research And Technology, Inc. | Variable perimeter heater |
US4971554A (en) * | 1988-08-30 | 1990-11-20 | Semiconductor Equipment Corporation | Multi-nozzle surface mount rework system |
US5467912A (en) * | 1992-11-27 | 1995-11-21 | Hitachi Techno Engineering Co., Ltd. | Reflow soldering apparatus for soldering electronic parts to circuit substrate |
-
1996
- 1996-11-14 GB GB9623706A patent/GB2319202A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB2319202A (en) | 1998-05-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |