GB9606428D0 - Clamping device - Google Patents

Clamping device

Info

Publication number
GB9606428D0
GB9606428D0 GBGB9606428.2A GB9606428A GB9606428D0 GB 9606428 D0 GB9606428 D0 GB 9606428D0 GB 9606428 A GB9606428 A GB 9606428A GB 9606428 D0 GB9606428 D0 GB 9606428D0
Authority
GB
United Kingdom
Prior art keywords
clamping device
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9606428.2A
Other versions
GB2311651A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Surface Technology Systems Ltd
Original Assignee
Surface Technology Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surface Technology Systems Ltd filed Critical Surface Technology Systems Ltd
Priority to GB9606428A priority Critical patent/GB2311651A/en
Publication of GB9606428D0 publication Critical patent/GB9606428D0/en
Priority to FR9703700A priority patent/FR2747236A1/en
Priority to JP7473697A priority patent/JPH104134A/en
Priority to DE1997113034 priority patent/DE19713034A1/en
Publication of GB2311651A publication Critical patent/GB2311651A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
GB9606428A 1996-03-27 1996-03-27 Clamping device Withdrawn GB2311651A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB9606428A GB2311651A (en) 1996-03-27 1996-03-27 Clamping device
FR9703700A FR2747236A1 (en) 1996-03-27 1997-03-26 LOCKING DEVICE FOR LOCKING SEMICONDUCTOR PELLET TYPE PARTS
JP7473697A JPH104134A (en) 1996-03-27 1997-03-27 Clamping device
DE1997113034 DE19713034A1 (en) 1996-03-27 1997-03-27 Clamping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9606428A GB2311651A (en) 1996-03-27 1996-03-27 Clamping device

Publications (2)

Publication Number Publication Date
GB9606428D0 true GB9606428D0 (en) 1996-06-05
GB2311651A GB2311651A (en) 1997-10-01

Family

ID=10791105

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9606428A Withdrawn GB2311651A (en) 1996-03-27 1996-03-27 Clamping device

Country Status (4)

Country Link
JP (1) JPH104134A (en)
DE (1) DE19713034A1 (en)
FR (1) FR2747236A1 (en)
GB (1) GB2311651A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6166898A (en) * 1998-10-30 2000-12-26 Promos Technologies, Inc. Plasma chamber wafer clamping ring with erosion resistive tips
US6174011B1 (en) * 1999-04-14 2001-01-16 Arthur Keigler Method of and apparatus for handling thin and flat workpieces and the like
DE10329976A1 (en) * 2003-06-26 2005-02-03 Sentech Instruments Gmbh Mechanical fixing device securing substrate to substrate electrode e.g. for plasma treatment of semiconductor wafer, using pneumatic adjustment of clamp relative to substrate support surface

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0231420A (en) * 1988-05-20 1990-02-01 Tegal Corp Wafer clamper for plasma reactor
JPH02268427A (en) * 1989-04-11 1990-11-02 Tokyo Electron Ltd Plasma processor
DE69130987T2 (en) * 1990-04-20 1999-09-30 Applied Materials, Inc. Device for treating semiconductor wafers
TW221318B (en) * 1990-07-31 1994-02-21 Tokyo Electron Co Ltd
KR100243784B1 (en) * 1990-12-05 2000-02-01 조셉 제이. 스위니 Passive shield for cvd wafer processing which provides front side edge exclusion and prevents backside depositions
US5316278A (en) * 1992-09-18 1994-05-31 Applied Materials, Inc. Clamping ring apparatus for processing semiconductor wafers
US5326725A (en) * 1993-03-11 1994-07-05 Applied Materials, Inc. Clamping ring and susceptor therefor
JPH0766125A (en) * 1993-08-30 1995-03-10 Sony Corp Reduced pressure processing system
AU3553795A (en) * 1994-09-15 1996-03-29 Materials Research Corporation Apparatus and method for clampling a substrate

Also Published As

Publication number Publication date
JPH104134A (en) 1998-01-06
FR2747236A1 (en) 1997-10-10
GB2311651A (en) 1997-10-01
DE19713034A1 (en) 1997-10-30

Similar Documents

Publication Publication Date Title
TW410703U (en) Rotary clamping device
ZA9710497B (en) Clamping device
IL121645A0 (en) Clamping device
GB2314070B (en) Clamping device
GB2331481B (en) Clamping device
GB9604244D0 (en) Clamp
EP0704932A3 (en) Clamping device
GB2316119B (en) Clamping devices
GB9606428D0 (en) Clamping device
GB9500618D0 (en) Clamping device
EP0692331A3 (en) Clamping device
SG54504A1 (en) Disc clamping device
GB2309736B (en) Clamp
GB9724648D0 (en) Clamping device
HU9700308V0 (en) Clamping device
IL134431A0 (en) Clamping device
GB9412662D0 (en) Clamping device
ZA952879B (en) Clamping device
GB9413638D0 (en) Clamping device
AU121444S (en) Clamping device
PL313718A1 (en) Clamp
GB9620927D0 (en) Clamp
PL104010U1 (en) Clamp
AU130730S (en) Clamp
GB9516097D0 (en) Clamping device

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)