GB9605975D0 - Electronic device manufacture with a laser beam - Google Patents

Electronic device manufacture with a laser beam

Info

Publication number
GB9605975D0
GB9605975D0 GBGB9605975.3A GB9605975A GB9605975D0 GB 9605975 D0 GB9605975 D0 GB 9605975D0 GB 9605975 A GB9605975 A GB 9605975A GB 9605975 D0 GB9605975 D0 GB 9605975D0
Authority
GB
United Kingdom
Prior art keywords
electronic device
laser beam
device manufacture
manufacture
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GBGB9605975.3A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Publication of GB9605975D0 publication Critical patent/GB9605975D0/en
Priority to PCT/IB1996/001422 priority Critical patent/WO1997025739A1/en
Priority to JP52502997A priority patent/JP4230538B2/en
Priority to KR1019970706160A priority patent/KR100419696B1/en
Priority to EP96940072A priority patent/EP0813749A1/en
Priority to US08/772,077 priority patent/US5930606A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/034Observing the temperature of the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/1224Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
GBGB9605975.3A 1996-01-04 1996-03-21 Electronic device manufacture with a laser beam Pending GB9605975D0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/IB1996/001422 WO1997025739A1 (en) 1996-01-04 1996-12-12 Electronic device manufacture with a laser beam
JP52502997A JP4230538B2 (en) 1996-01-04 1996-12-12 Electronic device manufacturing method and laser apparatus using laser beam
KR1019970706160A KR100419696B1 (en) 1996-01-04 1996-12-12 Electronic device manufacture with a laser beam
EP96940072A EP0813749A1 (en) 1996-01-04 1996-12-12 Electronic device manufacture with a laser beam
US08/772,077 US5930606A (en) 1996-01-04 1996-12-20 Electronic device manufacture with a laser beam

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9600091.4A GB9600091D0 (en) 1996-01-04 1996-01-04 Manufacture of electronic devices

Publications (1)

Publication Number Publication Date
GB9605975D0 true GB9605975D0 (en) 1996-05-22

Family

ID=10786579

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9600091.4A Pending GB9600091D0 (en) 1996-01-04 1996-01-04 Manufacture of electronic devices
GBGB9605975.3A Pending GB9605975D0 (en) 1996-01-04 1996-03-21 Electronic device manufacture with a laser beam

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB9600091.4A Pending GB9600091D0 (en) 1996-01-04 1996-01-04 Manufacture of electronic devices

Country Status (2)

Country Link
KR (1) KR100419696B1 (en)
GB (2) GB9600091D0 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101528346B1 (en) * 2013-11-12 2015-06-11 한국기계연구원 Substrate crystallizing appratus using laser and substrate crystallizing method using thereof
KR101642130B1 (en) 2014-11-14 2016-07-22 한국기계연구원 Sputtering crystallizing appratus using laser and sputtering crystallizing method using thereof

Also Published As

Publication number Publication date
KR19980702753A (en) 1998-08-05
GB9600091D0 (en) 1996-03-06
KR100419696B1 (en) 2004-04-21

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