GB9417926D0 - Interconnection structure - Google Patents

Interconnection structure

Info

Publication number
GB9417926D0
GB9417926D0 GB9417926A GB9417926A GB9417926D0 GB 9417926 D0 GB9417926 D0 GB 9417926D0 GB 9417926 A GB9417926 A GB 9417926A GB 9417926 A GB9417926 A GB 9417926A GB 9417926 D0 GB9417926 D0 GB 9417926D0
Authority
GB
United Kingdom
Prior art keywords
interconnection
polymer film
via openings
connects
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9417926A
Other versions
GB2281814A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of GB9417926D0 publication Critical patent/GB9417926D0/en
Publication of GB2281814A publication Critical patent/GB2281814A/en
Withdrawn legal-status Critical Current

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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/1579—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy

Abstract

A plurality of integrated circuit chips 1 each has one or more interconnection pads 2 disposed thereon. A polymer film 4 overlies the integrated circuits 1 and has a plurality of via openings 7 therein. Some of the via openings 7 are aligned with at least some of the interconnection pads 2. A pattern of interconnection conductors 5 disposed on one side of the polymer film 4 connects at least some of the via openings 7, and a conducting substance 8 connects at least some the interconnection conductors 5 to at least some of the interconnection pads 2. The polymer film acts as the sole mounting substrate for the chips. <IMAGE>
GB9417926A 1993-09-08 1994-09-06 Film carrier with interconnections for I.C. chips Withdrawn GB2281814A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB939318573A GB9318573D0 (en) 1993-09-08 1993-09-08 Bonding process for producing multiple simultaneous connections between silicon di and a substrate

Publications (2)

Publication Number Publication Date
GB9417926D0 true GB9417926D0 (en) 1994-10-26
GB2281814A GB2281814A (en) 1995-03-15

Family

ID=10741667

Family Applications (2)

Application Number Title Priority Date Filing Date
GB939318573A Pending GB9318573D0 (en) 1993-09-08 1993-09-08 Bonding process for producing multiple simultaneous connections between silicon di and a substrate
GB9417926A Withdrawn GB2281814A (en) 1993-09-08 1994-09-06 Film carrier with interconnections for I.C. chips

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB939318573A Pending GB9318573D0 (en) 1993-09-08 1993-09-08 Bonding process for producing multiple simultaneous connections between silicon di and a substrate

Country Status (1)

Country Link
GB (2) GB9318573D0 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
US10141251B2 (en) * 2014-12-23 2018-11-27 General Electric Company Electronic packages with pre-defined via patterns and methods of making and using the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2137805B (en) * 1982-11-19 1987-01-28 Stanley Bracey Chip carrier
US4937707A (en) * 1988-05-26 1990-06-26 International Business Machines Corporation Flexible carrier for an electronic device
SG49842A1 (en) * 1988-11-09 1998-06-15 Nitto Denko Corp Wiring substrate film carrier semiconductor device made by using the film carrier and mounting structure comprising the semiconductor
EP0482940B1 (en) * 1990-10-24 1996-03-27 Nec Corporation Method of forming an electrical connection for an integrated circuit
US5252857A (en) * 1991-08-05 1993-10-12 International Business Machines Corporation Stacked DCA memory chips

Also Published As

Publication number Publication date
GB2281814A (en) 1995-03-15
GB9318573D0 (en) 1993-10-27

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