GB939762A - Method and apparatus for assembling a semi-conductor device - Google Patents
Method and apparatus for assembling a semi-conductor deviceInfo
- Publication number
- GB939762A GB939762A GB42633/60A GB4263360A GB939762A GB 939762 A GB939762 A GB 939762A GB 42633/60 A GB42633/60 A GB 42633/60A GB 4263360 A GB4263360 A GB 4263360A GB 939762 A GB939762 A GB 939762A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sub
- assembly
- whisker
- wafer
- semi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/20—Seals between parts of vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/20—Seals between parts of vessels
- H01J5/22—Vacuum-tight joints between parts of vessel
- H01J5/26—Vacuum-tight joints between parts of vessel between insulating and conductive parts of vessel
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0438—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/161—Containers comprising no base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
- H01J2893/0037—Solid sealing members other than lamp bases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2893/00—Discharge tubes and lamps
- H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
- H01J2893/0037—Solid sealing members other than lamp bases
- H01J2893/0041—Direct connection between insulating and metal elements, in particular via glass material
- H01J2893/0043—Glass-to-metal or quartz-to-metal, e.g. by soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/18—Mechanical movements
- Y10T74/18888—Reciprocating to or from oscillating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Specific Conveyance Elements (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US860528A US3025978A (en) | 1959-12-18 | 1959-12-18 | Turnover mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB939762A true GB939762A (en) | 1963-10-16 |
Family
ID=25333419
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB42633/60A Expired GB939762A (en) | 1959-12-18 | 1960-12-12 | Method and apparatus for assembling a semi-conductor device |
| GB42635/60A Expired GB939764A (en) | 1959-12-18 | 1960-12-12 | Article handling apparatus |
| GB42634/60A Expired GB939763A (en) | 1959-12-18 | 1960-12-12 | Method of assembling a semi-conductor device |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB42635/60A Expired GB939764A (en) | 1959-12-18 | 1960-12-12 | Article handling apparatus |
| GB42634/60A Expired GB939763A (en) | 1959-12-18 | 1960-12-12 | Method of assembling a semi-conductor device |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US3025978A (cg-RX-API-DMAC7.html) |
| DE (1) | DE1180848B (cg-RX-API-DMAC7.html) |
| GB (3) | GB939762A (cg-RX-API-DMAC7.html) |
| NL (3) | NL259157A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112106457A (zh) * | 2018-06-08 | 2020-12-18 | 株式会社富士 | 带式供料器 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3175386A (en) * | 1961-08-30 | 1965-03-30 | Saginaw Wire Products Inc | Wire bending machine |
| US3141558A (en) * | 1962-06-06 | 1964-07-21 | Western Electric Co | Transfer fixture |
| US3191280A (en) * | 1963-04-23 | 1965-06-29 | Nat Transistor Mfg Company | Apparatus for assembling semiconductor devices |
| US3235057A (en) * | 1963-08-15 | 1966-02-15 | Champion Spark Plug Co | Conveyor unloader |
| US3524555A (en) * | 1967-01-31 | 1970-08-18 | Western Electric Co | Apparatus for assembling sheets of magnetic material onto an assembly |
| FR1556941A (cg-RX-API-DMAC7.html) * | 1967-04-07 | 1969-02-07 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1627989A (en) * | 1923-02-10 | 1927-05-10 | John L Nilson | Automatic windshield cleaner |
| US2779134A (en) * | 1952-01-03 | 1957-01-29 | Sylvania Electric Prod | Semiconductor assembling apparatus |
| US2832478A (en) * | 1954-10-05 | 1958-04-29 | Gen Electric | Automatic transfer device |
| US2940584A (en) * | 1956-05-08 | 1960-06-14 | Eastman Kodak Co | Roll film processing apparatus |
| US2868240A (en) * | 1956-08-09 | 1959-01-13 | Sylvania Electric Prod | Tube transfer mechanism |
| US2913130A (en) * | 1958-07-11 | 1959-11-17 | Western Electric Co | Article loading and unloading apparatus |
-
0
- NL NL259156D patent/NL259156A/xx unknown
- NL NL259155D patent/NL259155A/xx unknown
- NL NL259157D patent/NL259157A/xx unknown
-
1959
- 1959-12-18 US US860528A patent/US3025978A/en not_active Expired - Lifetime
-
1960
- 1960-12-12 GB GB42633/60A patent/GB939762A/en not_active Expired
- 1960-12-12 GB GB42635/60A patent/GB939764A/en not_active Expired
- 1960-12-12 GB GB42634/60A patent/GB939763A/en not_active Expired
- 1960-12-15 DE DEJ19159A patent/DE1180848B/de active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112106457A (zh) * | 2018-06-08 | 2020-12-18 | 株式会社富士 | 带式供料器 |
| CN112106457B (zh) * | 2018-06-08 | 2022-04-26 | 株式会社富士 | 带式供料器 |
Also Published As
| Publication number | Publication date |
|---|---|
| NL259155A (cg-RX-API-DMAC7.html) | 1900-01-01 |
| DE1180848B (de) | 1964-11-05 |
| US3025978A (en) | 1962-03-20 |
| GB939763A (en) | 1963-10-16 |
| NL259156A (cg-RX-API-DMAC7.html) | 1900-01-01 |
| GB939764A (en) | 1963-10-16 |
| NL259157A (cg-RX-API-DMAC7.html) | 1900-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1039790A (en) | Improved heating apparatus | |
| US3813022A (en) | Wire bonder apparatus | |
| GB1308271A (en) | Pick-up-and-transport means | |
| US3051026A (en) | Micromanipulator | |
| GB902530A (en) | Improvements in and relating to methods of and apparatus for attaching minute members to bodies | |
| US3458102A (en) | Semiconductor wafer pickup and bonding tool | |
| GB844311A (en) | Assembly apparatus | |
| GB1262148A (en) | Soldering apparatus | |
| GB1049655A (en) | Loading device for machine working on tubular workpieces | |
| US3294950A (en) | Apparatus for attaching leads to electrical components | |
| US2683205A (en) | Machine for making crystal rectifiers and the like | |
| US3025978A (en) | Turnover mechanism | |
| US3395845A (en) | Chip bonding machine | |
| US2464839A (en) | Article processing apparatus | |
| US3477630A (en) | Apparatus for assembling articles | |
| GB991872A (en) | Table structure for an electro-erosion apparatus | |
| US3103137A (en) | Means for securing conductive leads to semiconductive devices | |
| US3491425A (en) | Apparatus for assembling components of a sealed contact switch | |
| US3069531A (en) | Method and apparatus for assembling a semi-conductor | |
| JPS56139835A (en) | Electrospark machining apparatus | |
| US2951932A (en) | Welding apparatus | |
| US3178553A (en) | Automatic seamwelder | |
| JPS5736836A (en) | Pellet bonder | |
| US3094766A (en) | Method of assembling a semi-conductor | |
| GB1430666A (en) | Connections for semiconductor components |