GB9319730D0 - Manufacturing method of a semiconductor device - Google Patents

Manufacturing method of a semiconductor device

Info

Publication number
GB9319730D0
GB9319730D0 GB939319730A GB9319730A GB9319730D0 GB 9319730 D0 GB9319730 D0 GB 9319730D0 GB 939319730 A GB939319730 A GB 939319730A GB 9319730 A GB9319730 A GB 9319730A GB 9319730 D0 GB9319730 D0 GB 9319730D0
Authority
GB
United Kingdom
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB939319730A
Other versions
GB2271467A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of GB9319730D0 publication Critical patent/GB9319730D0/en
Publication of GB2271467A publication Critical patent/GB2271467A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76829Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
    • H01L21/76834Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers formation of thin insulating films on the sidewalls or on top of conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
GB9319730A 1992-09-26 1993-09-24 Manufacturing method of a semiconductor device Withdrawn GB2271467A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR920017608 1992-09-26

Publications (2)

Publication Number Publication Date
GB9319730D0 true GB9319730D0 (en) 1993-11-10
GB2271467A GB2271467A (en) 1994-04-13

Family

ID=19340175

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9319730A Withdrawn GB2271467A (en) 1992-09-26 1993-09-24 Manufacturing method of a semiconductor device

Country Status (5)

Country Link
JP (1) JPH06209049A (en)
CN (1) CN1087446A (en)
DE (1) DE4332605A1 (en)
GB (1) GB2271467A (en)
IT (1) IT1272674B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004172259A (en) 2002-11-19 2004-06-17 Oki Electric Ind Co Ltd Method for manufacturing semiconductor element
KR100650858B1 (en) 2005-12-23 2006-11-28 주식회사 하이닉스반도체 Method of manufacturing a flash memory device
JP5029257B2 (en) * 2007-01-17 2012-09-19 東京エレクトロン株式会社 Mounting table structure and processing device
CN104810263B (en) * 2014-01-24 2018-11-20 北大方正集团有限公司 The manufacturing method of gate oxide

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139658A (en) * 1976-06-23 1979-02-13 Rca Corp. Process for manufacturing a radiation hardened oxide
DE3206376A1 (en) * 1982-02-22 1983-09-01 Siemens AG, 1000 Berlin und 8000 München METHOD FOR PRODUCING SILICON OXIDE LAYERS

Also Published As

Publication number Publication date
JPH06209049A (en) 1994-07-26
DE4332605A1 (en) 1994-03-31
ITMI932044A1 (en) 1995-03-24
GB2271467A (en) 1994-04-13
CN1087446A (en) 1994-06-01
ITMI932044A0 (en) 1993-09-24
IT1272674B (en) 1997-06-26

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)