GB9314080D0 - Dual-layer etch process - Google Patents

Dual-layer etch process

Info

Publication number
GB9314080D0
GB9314080D0 GB939314080A GB9314080A GB9314080D0 GB 9314080 D0 GB9314080 D0 GB 9314080D0 GB 939314080 A GB939314080 A GB 939314080A GB 9314080 A GB9314080 A GB 9314080A GB 9314080 D0 GB9314080 D0 GB 9314080D0
Authority
GB
United Kingdom
Prior art keywords
dual
etch process
layer etch
layer
etch
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB939314080A
Other versions
GB2267256A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Digital Equipment Corp
Original Assignee
Digital Equipment Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Digital Equipment Corp filed Critical Digital Equipment Corp
Publication of GB9314080D0 publication Critical patent/GB9314080D0/en
Publication of GB2267256A publication Critical patent/GB2267256A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127—Structure or manufacture of heads, e.g. inductive
    • G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
    • G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
GB9314080A 1991-11-25 1993-07-08 Dual-layer etch process Withdrawn GB2267256A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US79753991A 1991-11-25 1991-11-25
PCT/US1992/010306 WO1993011532A1 (en) 1991-11-25 1992-11-24 Dual-layer etch process

Publications (2)

Publication Number Publication Date
GB9314080D0 true GB9314080D0 (en) 1993-09-01
GB2267256A GB2267256A (en) 1993-12-01

Family

ID=25171128

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9314080A Withdrawn GB2267256A (en) 1991-11-25 1993-07-08 Dual-layer etch process

Country Status (3)

Country Link
DE (1) DE4294247T1 (en)
GB (1) GB2267256A (en)
WO (1) WO1993011532A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000004534A1 (en) * 1998-07-13 2000-01-27 Koninklijke Philips Electronics N.V. Method of manufacturing a thin-film magnetic head
US20040112868A1 (en) 2002-12-13 2004-06-17 Phipps Peter Beverley Powell Etchant solution for removing a thin metallic layer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4481071A (en) * 1983-12-29 1984-11-06 International Business Machines Corporation Process of lift off of material
US5059278A (en) * 1990-09-28 1991-10-22 Seagate Technology Selective chemical removal of coil seed-layer in thin film head magnetic transducer

Also Published As

Publication number Publication date
DE4294247T1 (en) 1994-01-13
WO1993011532A1 (en) 1993-06-10
GB2267256A (en) 1993-12-01

Similar Documents

Publication Publication Date Title
GB9107858D0 (en) Process
IL102220A0 (en) Improved process
AU1500492A (en) Washing process
GB9100216D0 (en) Process
GB9111628D0 (en) Process for manufacture
GB9116297D0 (en) Co-oligomerisation process
GB9111974D0 (en) Novel process
GB9314080D0 (en) Dual-layer etch process
GB9118304D0 (en) Process
GB9123641D0 (en) Process
GB2262654B (en) Fabrication process
GB9108044D0 (en) Process
GB9101690D0 (en) Process
GB9104015D0 (en) Process
GB9121726D0 (en) Process
GB9122643D0 (en) Process
GB9100040D0 (en) Process
HU911733D0 (en) Ethinylating process
GB9100987D0 (en) Process
HU913012D0 (en) Unstopping process
GB9102751D0 (en) Process
GB9103900D0 (en) Process
HU913534D0 (en) Halogenization process
GB9104016D0 (en) Process
GB9117525D0 (en) Process

Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)