GB9313778D0 - Material for a printed wiring board - Google Patents

Material for a printed wiring board

Info

Publication number
GB9313778D0
GB9313778D0 GB939313778A GB9313778A GB9313778D0 GB 9313778 D0 GB9313778 D0 GB 9313778D0 GB 939313778 A GB939313778 A GB 939313778A GB 9313778 A GB9313778 A GB 9313778A GB 9313778 D0 GB9313778 D0 GB 9313778D0
Authority
GB
United Kingdom
Prior art keywords
wiring board
printed wiring
printed
board
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB939313778A
Other versions
GB2268630A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Publication of GB9313778D0 publication Critical patent/GB9313778D0/en
Publication of GB2268630A publication Critical patent/GB2268630A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
GB9313778A 1992-07-03 1993-07-02 Printed wiring board Withdrawn GB2268630A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20044592A JPH0621595A (en) 1992-07-03 1992-07-03 Material for printed circuit board

Publications (2)

Publication Number Publication Date
GB9313778D0 true GB9313778D0 (en) 1993-08-18
GB2268630A GB2268630A (en) 1994-01-12

Family

ID=16424422

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9313778A Withdrawn GB2268630A (en) 1992-07-03 1993-07-02 Printed wiring board

Country Status (2)

Country Link
JP (1) JPH0621595A (en)
GB (1) GB2268630A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1079593A (en) * 1996-09-05 1998-03-24 Tokin Corp Magnetic prepreg, its manufacturing method and printed circuit board using it
DE19802243A1 (en) * 1998-01-22 1999-07-29 Bosch Gmbh Robert Multilayer substrate especially a multilayer circuit board with digital circuits
CN103517559B (en) * 2012-06-26 2016-08-03 深南电路有限公司 The method of processing printed circuit board and printed circuit board (PCB)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2739494B2 (en) * 1977-08-30 1980-10-16 Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen Process for manufacturing electrical circuit boards
FR2524247A1 (en) * 1982-03-23 1983-09-30 Thomson Csf METHOD FOR MANUFACTURING PRINTED CIRCUITS WITH INDIVIDUAL CONDUCTIVE RIGID METAL SUPPORT
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
GB2124035B (en) * 1982-07-15 1985-07-31 Standard Telephones Cables Ltd Printed circuit boards
SE437207B (en) * 1983-12-13 1985-02-11 Rolf Dahlberg SAMPLE CARD WITH BEARING STRAIGHT IN THE FORM OF THERMAL DERIVATIVE METAL PLATE
JPS60149196A (en) * 1984-01-17 1985-08-06 ソニー株式会社 Printed board and method of producing same
JPS60170287A (en) * 1984-02-14 1985-09-03 信越化学工業株式会社 Copper-lined laminated board
GB2162694A (en) * 1984-08-04 1986-02-05 British Aerospace Printed circuits
DE3641202A1 (en) * 1986-12-03 1988-06-16 Standard Elektrik Lorenz Ag METAL CORE BOARD AS A CARRIER FOR HF AND MICROWAVE CIRCUITS
GB2240663A (en) * 1990-01-12 1991-08-07 Mitsubishi Cable Ind Ltd Metal base wiring board

Also Published As

Publication number Publication date
JPH0621595A (en) 1994-01-28
GB2268630A (en) 1994-01-12

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)