GB9213091D0 - Esd-protected cover for electronic components and method of making the same - Google Patents
Esd-protected cover for electronic components and method of making the sameInfo
- Publication number
- GB9213091D0 GB9213091D0 GB929213091A GB9213091A GB9213091D0 GB 9213091 D0 GB9213091 D0 GB 9213091D0 GB 929213091 A GB929213091 A GB 929213091A GB 9213091 A GB9213091 A GB 9213091A GB 9213091 D0 GB9213091 D0 GB 9213091D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- esd
- making
- same
- electronic components
- protected cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0079—Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Elimination Of Static Electricity (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US72232491A | 1991-06-28 | 1991-06-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9213091D0 true GB9213091D0 (en) | 1992-08-05 |
GB2257305A GB2257305A (en) | 1993-01-06 |
Family
ID=24901382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9213091A Withdrawn GB2257305A (en) | 1991-06-28 | 1992-06-19 | Esd-protected cover for electronic components and method of making the same |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE4221115A1 (en) |
GB (1) | GB2257305A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014213903A1 (en) * | 2014-07-17 | 2016-01-21 | BSH Hausgeräte GmbH | Electronic user interface with a shielding device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0109505A3 (en) * | 1982-10-25 | 1985-01-09 | Allied Corporation | A stampable polymeric composite containing an emi/rfi shielding layer |
EP0110548B1 (en) * | 1982-10-29 | 1987-06-24 | Plessey Overseas Limited | Conductive gaskets |
JPS61249713A (en) * | 1985-04-30 | 1986-11-06 | Nippon Zeon Co Ltd | Manufacture of molding for electromagnetic wave shield |
SE462099B (en) * | 1985-11-15 | 1990-05-07 | Dow Chemical Co | EMI SHIELD COMPOSITION MATERIAL |
JPS62138234A (en) * | 1985-12-12 | 1987-06-22 | Aisin Seiki Co Ltd | Structure of assembling of conductive resin molded product |
DE3810597A1 (en) * | 1988-03-29 | 1989-10-12 | Bayer Ag | METALIZED FIBERS CONTAINING COMPOSITES AND THEIR USE FOR THE MANUFACTURE OF ELECTROMAGNETIC SHIELDED PARTS |
DK0440970T3 (en) * | 1990-01-23 | 1996-09-30 | Cytec Tech Corp | Form granules, their preparation and their use in the manufacture of shaped articles |
-
1992
- 1992-06-19 GB GB9213091A patent/GB2257305A/en not_active Withdrawn
- 1992-06-26 DE DE19924221115 patent/DE4221115A1/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
GB2257305A (en) | 1993-01-06 |
DE4221115A1 (en) | 1993-01-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |