GB914808A - Improvements in or relating to semi-conductor devices - Google Patents

Improvements in or relating to semi-conductor devices

Info

Publication number
GB914808A
GB914808A GB878059A GB878059A GB914808A GB 914808 A GB914808 A GB 914808A GB 878059 A GB878059 A GB 878059A GB 878059 A GB878059 A GB 878059A GB 914808 A GB914808 A GB 914808A
Authority
GB
United Kingdom
Prior art keywords
semi
housing
arrangement
waisted
waisted portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB878059A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electrical Industries Ltd
Original Assignee
Philips Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electrical Industries Ltd filed Critical Philips Electrical Industries Ltd
Publication of GB914808A publication Critical patent/GB914808A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)

Abstract

914,808. Semi-conductor devices. PHILIPS ELECTRICAL INDUSTRIES Ltd. March 13, 1959 [March 17, 1958], No. 8780/59. Class 37. A semi-conductor device includes a semiconductor body in a sealed cylindrical casing mounted in and coaxial with a tubular cooling body longer than the casing. In the Fig. 1 arrangement a transistor is mounted in a housing located between waisted portion 13 and turned in flange 12 of a perforated copper or aluminium tube 11. The transistor is soldered through the intermediary of a molybdenum plate 7 to, a metal base 8, which is pressed into metal cylinder 1, preferably with the interposition of a soft indium, lead or tin layer. The base and emitter connections 6, 5, respectively, are led out through glass bead 9 and a tube 3 sealed into the glass top 2 of the housing. In the Fig. 3 arrangement, a diode housing comprises two parts welded together at flanges 31, the flanges being located between waisted portion 35 and the flange. A clip 33 provided with tags 36 bent over to fix it to chassis 32 has resilient locating tags 34 engaging the waisted portion 35. In the multiple arrangement shown in Fig. 4 diode housing 40 is mounted between two waisted portions of cooling cylinder 41. The cooling cylinders of several such devices are connected together as shown through ceramic insulators 48, adjacent diodes being connected electrically by members 45, the ends of which are formed as resilient clips. A number of diodes of the type shown in Fig. 4 may alternatively be mounted between a pair of insulating plates in an oil-filled trough, series connections being made by U-shaped connectors.
GB878059A 1958-03-17 1959-03-13 Improvements in or relating to semi-conductor devices Expired GB914808A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL225944 1958-03-17

Publications (1)

Publication Number Publication Date
GB914808A true GB914808A (en) 1963-01-02

Family

ID=19751155

Family Applications (1)

Application Number Title Priority Date Filing Date
GB878059A Expired GB914808A (en) 1958-03-17 1959-03-13 Improvements in or relating to semi-conductor devices

Country Status (4)

Country Link
DE (1) DE1106874B (en)
FR (1) FR1228364A (en)
GB (1) GB914808A (en)
NL (2) NL96742C (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1273072B (en) * 1961-05-10 1968-07-18 Siemens Ag Massive heat sink for a semiconductor component
DE1271835B (en) * 1961-09-20 1968-07-04 Telefunken Patent Semiconductor component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2763822A (en) * 1955-05-10 1956-09-18 Westinghouse Electric Corp Silicon semiconductor devices
US2806187A (en) * 1955-11-08 1957-09-10 Westinghouse Electric Corp Semiconductor rectifier device

Also Published As

Publication number Publication date
DE1106874B (en) 1961-05-18
NL225944A (en)
FR1228364A (en) 1960-08-29
NL96742C (en)

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