GB911415A - Improvements in solder wire - Google Patents
Improvements in solder wireInfo
- Publication number
- GB911415A GB911415A GB1516260A GB1516260A GB911415A GB 911415 A GB911415 A GB 911415A GB 1516260 A GB1516260 A GB 1516260A GB 1516260 A GB1516260 A GB 1516260A GB 911415 A GB911415 A GB 911415A
- Authority
- GB
- United Kingdom
- Prior art keywords
- polyamide resin
- solder wire
- hydrobromide
- resin
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A flux for forming an adherent, flexible, non-tacky coating on a solder wire consists of an activated polyamide resin or a mixture of a polyamide resin and natural gum or wood rosin in a weight ratio of 1 : 1 to 10 : 1. The polyamide resin is the condensation product of a polyamine e.g. hexamethylene diamine, and a long chain dicarboxylic acid containing 14 to 22 carbon atoms. The activator such as cyclohexylamine hydrobromide, diethyl hydrobromide or cetyl pyridinium bromide is present in an amount of 1%-4% by weight of the resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1516260A GB911415A (en) | 1962-04-29 | 1962-04-29 | Improvements in solder wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1516260A GB911415A (en) | 1962-04-29 | 1962-04-29 | Improvements in solder wire |
Publications (1)
Publication Number | Publication Date |
---|---|
GB911415A true GB911415A (en) | 1962-11-28 |
Family
ID=10054121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1516260A Expired GB911415A (en) | 1962-04-29 | 1962-04-29 | Improvements in solder wire |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB911415A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0488398A2 (en) * | 1990-11-30 | 1992-06-03 | Nippondenso Co., Ltd. | Soldering flux composition |
-
1962
- 1962-04-29 GB GB1516260A patent/GB911415A/en not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0488398A2 (en) * | 1990-11-30 | 1992-06-03 | Nippondenso Co., Ltd. | Soldering flux composition |
EP0488398A3 (en) * | 1990-11-30 | 1992-10-21 | Nippondenso Co., Ltd. | Soldering flux composition |
US5211763A (en) * | 1990-11-30 | 1993-05-18 | Nippondenso Co., Ltd. | Soldering flux composition |
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