GB8922177D0 - Two-pack curable epoxy resin composition - Google Patents

Two-pack curable epoxy resin composition

Info

Publication number
GB8922177D0
GB8922177D0 GB898922177A GB8922177A GB8922177D0 GB 8922177 D0 GB8922177 D0 GB 8922177D0 GB 898922177 A GB898922177 A GB 898922177A GB 8922177 A GB8922177 A GB 8922177A GB 8922177 D0 GB8922177 D0 GB 8922177D0
Authority
GB
United Kingdom
Prior art keywords
resin composition
epoxy resin
curable epoxy
pack curable
pack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB898922177A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vesuvius Holdings Ltd
Original Assignee
Cookson Group PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cookson Group PLC filed Critical Cookson Group PLC
Priority to GB898922177A priority Critical patent/GB8922177D0/en
Publication of GB8922177D0 publication Critical patent/GB8922177D0/en
Priority to PCT/GB1990/001500 priority patent/WO1991004999A1/fr
Pending legal-status Critical Current

Links

GB898922177A 1989-10-02 1989-10-02 Two-pack curable epoxy resin composition Pending GB8922177D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB898922177A GB8922177D0 (en) 1989-10-02 1989-10-02 Two-pack curable epoxy resin composition
PCT/GB1990/001500 WO1991004999A1 (fr) 1989-10-02 1990-10-01 Composition de resine epoxyde durcissable a deux composants

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB898922177A GB8922177D0 (en) 1989-10-02 1989-10-02 Two-pack curable epoxy resin composition

Publications (1)

Publication Number Publication Date
GB8922177D0 true GB8922177D0 (en) 1989-11-15

Family

ID=10663935

Family Applications (1)

Application Number Title Priority Date Filing Date
GB898922177A Pending GB8922177D0 (en) 1989-10-02 1989-10-02 Two-pack curable epoxy resin composition

Country Status (2)

Country Link
GB (1) GB8922177D0 (fr)
WO (1) WO1991004999A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050137357A1 (en) * 2003-12-18 2005-06-23 Skoglund Michael J. Epoxy adhesive composition method of preparing and using

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4581158A (en) * 1984-09-26 1986-04-08 W. R. Grace & Co. Conductive thermosetting compositions and process for using same
US4833226A (en) * 1987-08-26 1989-05-23 Asahi Kasei Kogyo Kabushiki Kaisha Hardener for curable one-package epoxy resin system

Also Published As

Publication number Publication date
WO1991004999A1 (fr) 1991-04-18

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