GB8918192D0 - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB8918192D0
GB8918192D0 GB898918192A GB8918192A GB8918192D0 GB 8918192 D0 GB8918192 D0 GB 8918192D0 GB 898918192 A GB898918192 A GB 898918192A GB 8918192 A GB8918192 A GB 8918192A GB 8918192 D0 GB8918192 D0 GB 8918192D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB898918192A
Other versions
GB2221792B (en
GB2221792A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marconi Electronic Devices Ltd
Original Assignee
Marconi Electronic Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Electronic Devices Ltd filed Critical Marconi Electronic Devices Ltd
Publication of GB8918192D0 publication Critical patent/GB8918192D0/en
Publication of GB2221792A publication Critical patent/GB2221792A/en
Application granted granted Critical
Publication of GB2221792B publication Critical patent/GB2221792B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
GB8918192A 1988-08-10 1989-08-09 Electrical connections for semiconductor devices Expired - Fee Related GB2221792B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888818957A GB8818957D0 (en) 1988-08-10 1988-08-10 Semiconductor devices

Publications (3)

Publication Number Publication Date
GB8918192D0 true GB8918192D0 (en) 1989-09-20
GB2221792A GB2221792A (en) 1990-02-14
GB2221792B GB2221792B (en) 1992-02-12

Family

ID=10641884

Family Applications (2)

Application Number Title Priority Date Filing Date
GB888818957A Pending GB8818957D0 (en) 1988-08-10 1988-08-10 Semiconductor devices
GB8918192A Expired - Fee Related GB2221792B (en) 1988-08-10 1989-08-09 Electrical connections for semiconductor devices

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB888818957A Pending GB8818957D0 (en) 1988-08-10 1988-08-10 Semiconductor devices

Country Status (2)

Country Link
DE (1) DE3926238C2 (en)
GB (2) GB8818957D0 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5049981A (en) * 1990-10-19 1991-09-17 At&T Bell Laboratories Heat sink for electronic circitry
GB9425725D0 (en) * 1994-12-20 1995-02-22 Brierley Garstang Ltd B Pre-cast concrete box culvert

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1153461B (en) * 1960-06-23 1963-08-29 Siemens Ag Semiconductor device
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
EP0086812A4 (en) * 1981-09-01 1985-06-10 Motorola Inc Improved glass bonding means and method.
JPS60100439A (en) * 1983-11-05 1985-06-04 Mitsubishi Electric Corp Resin sealed type semiconductor device

Also Published As

Publication number Publication date
DE3926238A1 (en) 1990-02-15
GB8818957D0 (en) 1988-09-14
GB2221792B (en) 1992-02-12
DE3926238C2 (en) 1998-12-24
GB2221792A (en) 1990-02-14

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20050809