GB8821920D0 - Sputter coating - Google Patents

Sputter coating

Info

Publication number
GB8821920D0
GB8821920D0 GB888821920A GB8821920A GB8821920D0 GB 8821920 D0 GB8821920 D0 GB 8821920D0 GB 888821920 A GB888821920 A GB 888821920A GB 8821920 A GB8821920 A GB 8821920A GB 8821920 D0 GB8821920 D0 GB 8821920D0
Authority
GB
United Kingdom
Prior art keywords
sputter coating
sputter
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB888821920A
Other versions
GB2209769A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ion Tech Ltd
Original Assignee
Ion Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB878721766A external-priority patent/GB8721766D0/en
Application filed by Ion Tech Ltd filed Critical Ion Tech Ltd
Priority to GB8821920A priority Critical patent/GB2209769A/en
Publication of GB8821920D0 publication Critical patent/GB8821920D0/en
Publication of GB2209769A publication Critical patent/GB2209769A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
GB8821920A 1987-09-16 1988-09-19 Sputter coating Withdrawn GB2209769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8821920A GB2209769A (en) 1987-09-16 1988-09-19 Sputter coating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB878721766A GB8721766D0 (en) 1987-09-16 1987-09-16 Sputter coating
GB8821920A GB2209769A (en) 1987-09-16 1988-09-19 Sputter coating

Publications (2)

Publication Number Publication Date
GB8821920D0 true GB8821920D0 (en) 1988-10-19
GB2209769A GB2209769A (en) 1989-05-24

Family

ID=26292740

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8821920A Withdrawn GB2209769A (en) 1987-09-16 1988-09-19 Sputter coating

Country Status (1)

Country Link
GB (1) GB2209769A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1004442A3 (en) * 1990-06-08 1992-11-24 Saint Roch Glaceries Installation of a high rate sputtering.
GB2256084A (en) * 1991-05-13 1992-11-25 Integrated Plasma Ltd Plasma deposition and etching of substrates.
DE19508405A1 (en) * 1995-03-09 1996-09-12 Leybold Ag Cathode arrangement for a device for atomizing a target pair
RU2186151C2 (en) * 1999-12-29 2002-07-27 Закрытое акционерное общество "Патинор Коутингс Лимитед" Device for application of coatings in vacuum
CN102610470B (en) * 2011-01-25 2015-01-14 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetron and semiconductor equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2051877B (en) * 1979-04-09 1983-03-02 Vac Tec Syst Magnetically enhanced sputtering device and method
US4422896A (en) * 1982-01-26 1983-12-27 Materials Research Corporation Magnetically enhanced plasma process and apparatus
JPS5976875A (en) * 1982-10-22 1984-05-02 Hitachi Ltd Magnetron type sputtering device
US4414086A (en) * 1982-11-05 1983-11-08 Varian Associates, Inc. Magnetic targets for use in sputter coating apparatus
US4581118A (en) * 1983-01-26 1986-04-08 Materials Research Corporation Shaped field magnetron electrode
DE163445T1 (en) * 1984-05-17 1986-05-22 Varian Associates, Inc., Palo Alto, Calif. MAGNETRONIC SPRAYING DEVICE WITH PLANES AND CONCAVE ROLLING PLATES.

Also Published As

Publication number Publication date
GB2209769A (en) 1989-05-24

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)