GB881571A - Improvements relating to the cooling of semi-conductor devices - Google Patents

Improvements relating to the cooling of semi-conductor devices

Info

Publication number
GB881571A
GB881571A GB30742/58A GB3074258A GB881571A GB 881571 A GB881571 A GB 881571A GB 30742/58 A GB30742/58 A GB 30742/58A GB 3074258 A GB3074258 A GB 3074258A GB 881571 A GB881571 A GB 881571A
Authority
GB
United Kingdom
Prior art keywords
box
mica
copper
disc
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB30742/58A
Other languages
English (en)
Inventor
John Jarrett Davis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stone J and Co Ltd
Original Assignee
Stone J and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL243350D priority Critical patent/NL243350A/xx
Priority to NL293350D priority patent/NL293350A/xx
Application filed by Stone J and Co Ltd filed Critical Stone J and Co Ltd
Priority to GB30742/58A priority patent/GB881571A/en
Priority to ES0251880A priority patent/ES251880A1/es
Priority to FR805644A priority patent/FR1236322A/fr
Priority to BE583030A priority patent/BE583030A/fr
Priority to DEST15616A priority patent/DE1205196B/de
Publication of GB881571A publication Critical patent/GB881571A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
GB30742/58A 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices Expired GB881571A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL243350D NL243350A (enExample) 1958-09-25
NL293350D NL293350A (enExample) 1958-09-25
GB30742/58A GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices
ES0251880A ES251880A1 (es) 1958-09-25 1959-09-03 Una disposiciën en semiconductores
FR805644A FR1236322A (fr) 1958-09-25 1959-09-21 Perfectionnements au refroidissement des dispositifs semi-conducteurs
BE583030A BE583030A (fr) 1958-09-25 1959-09-25 Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs
DEST15616A DE1205196B (de) 1958-09-25 1959-09-25 Halbleiteranordnung mit mindestens einem Halbleiterbauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB30742/58A GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices

Publications (1)

Publication Number Publication Date
GB881571A true GB881571A (en) 1961-11-08

Family

ID=10312426

Family Applications (1)

Application Number Title Priority Date Filing Date
GB30742/58A Expired GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices

Country Status (6)

Country Link
BE (1) BE583030A (enExample)
DE (1) DE1205196B (enExample)
ES (1) ES251880A1 (enExample)
FR (1) FR1236322A (enExample)
GB (1) GB881571A (enExample)
NL (2) NL293350A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
US4445735A (en) * 1980-12-05 1984-05-01 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Electrical connection device for high density contacts
EP0198378A3 (en) * 1985-04-08 1986-12-30 Otis Elevator Company Apparatus for removing heat from electrical components, and method of manufacturing such apparatus
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
EP1691595A3 (de) * 2005-02-10 2012-01-18 Behr-Hella Thermocontrol GmbH Gebläseregler für ein Fahrzeug

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2423070A1 (de) * 1973-07-06 1975-01-23 Siemens Ag Anordnung eines leistungshalbleiters

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB321299A (en) * 1952-01-22 1929-11-07 William Charles King Improvements in or relating to heating buildings by electricity
BE565471A (enExample) * 1957-03-08
DE1751741U (de) * 1957-05-17 1957-09-05 Telefunken Gmbh Gehaeuseanordnung zur kuehlung von leistungskristalloden.
DE1768720U (de) * 1957-12-16 1958-06-19 Licentia Gmbh Einrichtung zur kuehlung von transistoren.

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
EP0053967A1 (fr) * 1980-12-05 1982-06-16 COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) Dispositif de refroidissement amovible pour supports de circuits intégrés
US4445735A (en) * 1980-12-05 1984-05-01 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Electrical connection device for high density contacts
EP0198378A3 (en) * 1985-04-08 1986-12-30 Otis Elevator Company Apparatus for removing heat from electrical components, and method of manufacturing such apparatus
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
EP1691595A3 (de) * 2005-02-10 2012-01-18 Behr-Hella Thermocontrol GmbH Gebläseregler für ein Fahrzeug

Also Published As

Publication number Publication date
DE1205196B (de) 1965-11-18
FR1236322A (fr) 1960-07-15
ES251880A1 (es) 1960-03-16
NL293350A (enExample)
NL243350A (enExample)
BE583030A (fr) 1960-01-18

Similar Documents

Publication Publication Date Title
US2751528A (en) Rectifier cell mounting
GB1029171A (en) A semiconductor arrangement
US3611046A (en) Apparatus for mounting and-or cooling electrical devices
GB921251A (en) Semiconductor mounting
GB800297A (en) Improvements relating to rectifier units
GB881571A (en) Improvements relating to the cooling of semi-conductor devices
GB965723A (en) A combined transformer and semi-conductor rectifier installation
US3173061A (en) Cooled semi-conductor rectifier assembly
US3196317A (en) Heatsinks and rectifier assembly for a dynamoelectric machine
GB1076237A (en) Rectifier arrangements
GB1273175A (en) Semi-conductor devices
US4506320A (en) Power rectifier arrangement
US3280390A (en) Electrical semiconductor device
US3738422A (en) Heat dissipating insulating mounting
JP2771240B2 (ja) 船外機用充電装置の取付け構造
US3054032A (en) Heat sink for a. c.-d. c. rectifier
GB906559A (en) Improvements in or relating to semi-conductor rectifier installations
GB971703A (en) A semiconductor device
GB886456A (en) Semiconductor rectifiers
GB936886A (en) Sealed semiconductor devices
CN211481787U (zh) 一种伺服变压器散热模块
US3210636A (en) Electrical converters
US3328644A (en) Device for cooling rectifiers
GB902832A (en) Improvements relating to electric arc welding supply circuits
GB1081652A (en) Improvements relating to liquid cooled electric transformer/rectifier equipment