GB8620275D0 - Hybrid circuit packages - Google Patents

Hybrid circuit packages

Info

Publication number
GB8620275D0
GB8620275D0 GB8620275A GB8620275A GB8620275D0 GB 8620275 D0 GB8620275 D0 GB 8620275D0 GB 8620275 A GB8620275 A GB 8620275A GB 8620275 A GB8620275 A GB 8620275A GB 8620275 D0 GB8620275 D0 GB 8620275D0
Authority
GB
United Kingdom
Prior art keywords
hybrid circuit
circuit packages
packages
hybrid
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8620275A
Other versions
GB2179791A (en
GB2179791B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MO Valve Co Ltd
Original Assignee
MO Valve Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MO Valve Co Ltd filed Critical MO Valve Co Ltd
Publication of GB8620275D0 publication Critical patent/GB8620275D0/en
Publication of GB2179791A publication Critical patent/GB2179791A/en
Application granted granted Critical
Publication of GB2179791B publication Critical patent/GB2179791B/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/58Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64Impedance arrangements
    • H01L23/647Resistive arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB8620275A 1985-08-21 1986-08-20 Semi-conductor packages Expired GB2179791B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8520907A GB8520907D0 (en) 1985-08-21 1985-08-21 Hybrid circuit packages

Publications (3)

Publication Number Publication Date
GB8620275D0 true GB8620275D0 (en) 1986-10-01
GB2179791A GB2179791A (en) 1987-03-11
GB2179791B GB2179791B (en) 1988-11-09

Family

ID=10584091

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8520907A Pending GB8520907D0 (en) 1985-08-21 1985-08-21 Hybrid circuit packages
GB8620275A Expired GB2179791B (en) 1985-08-21 1986-08-20 Semi-conductor packages

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8520907A Pending GB8520907D0 (en) 1985-08-21 1985-08-21 Hybrid circuit packages

Country Status (4)

Country Link
EP (1) EP0232401A1 (en)
JP (1) JPS63500628A (en)
GB (2) GB8520907D0 (en)
WO (1) WO1987001240A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4038168C2 (en) * 1990-11-30 1998-09-24 Daimler Benz Ag Method of manufacturing a multichip module

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4259684A (en) * 1978-10-13 1981-03-31 The Secretary Of State For Defence In Her Britannic Majesty's Government Of The United Kingdom Of Great Britain And Northern Ireland Packages for microwave integrated circuits
FR2506520A1 (en) * 1981-05-19 1982-11-26 Thomson Csf ENCAPSULATION BOX FOR POWER SEMICONDUCTOR OPERATING IN A FREQUENCY RANGE OF 2 TO 20 GHZ
JPS58446U (en) * 1981-06-25 1983-01-05 富士通株式会社 Hybrid integrated circuit device
FR2538617B1 (en) * 1982-12-28 1986-02-28 Thomson Csf ENCAPSULATION BOX FOR POWER SEMICONDUCTOR WITH IMPROVED INPUT-OUTPUT ISOLATION
JPS59126665A (en) * 1983-01-10 1984-07-21 Hitachi Ltd Thick film hybrid integrated circuit

Also Published As

Publication number Publication date
GB8520907D0 (en) 1985-09-25
GB2179791A (en) 1987-03-11
GB2179791B (en) 1988-11-09
EP0232401A1 (en) 1987-08-19
WO1987001240A1 (en) 1987-02-26
JPS63500628A (en) 1988-03-03

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee