GB861581A - Improvements in and relating to semi-conductor devices - Google Patents

Improvements in and relating to semi-conductor devices

Info

Publication number
GB861581A
GB861581A GB17043/57A GB1704357A GB861581A GB 861581 A GB861581 A GB 861581A GB 17043/57 A GB17043/57 A GB 17043/57A GB 1704357 A GB1704357 A GB 1704357A GB 861581 A GB861581 A GB 861581A
Authority
GB
United Kingdom
Prior art keywords
contact
metal
stud
recrystallized region
recrystallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB17043/57A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxar Space LLC
Original Assignee
Philco Ford Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philco Ford Corp filed Critical Philco Ford Corp
Publication of GB861581A publication Critical patent/GB861581A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
GB17043/57A 1956-06-08 1957-05-29 Improvements in and relating to semi-conductor devices Expired GB861581A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US590204A US3002271A (en) 1956-06-08 1956-06-08 Method of providing connection to semiconductive structures

Publications (1)

Publication Number Publication Date
GB861581A true GB861581A (en) 1961-02-22

Family

ID=24361273

Family Applications (1)

Application Number Title Priority Date Filing Date
GB17043/57A Expired GB861581A (en) 1956-06-08 1957-05-29 Improvements in and relating to semi-conductor devices

Country Status (3)

Country Link
US (1) US3002271A (enExample)
BE (1) BE563189A (enExample)
GB (1) GB861581A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3234320A (en) * 1963-06-11 1966-02-08 United Carr Inc Integrated circuit package

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3109234A (en) * 1957-07-22 1963-11-05 Rca Corp Method of mounting a semiconductor device
NL109858C (enExample) * 1957-09-20 1900-01-01
US3109225A (en) * 1958-08-29 1963-11-05 Rca Corp Method of mounting a semiconductor device
US3117179A (en) * 1959-07-24 1964-01-07 Clevite Corp Transistor capsule and header therefor
US3164885A (en) * 1960-11-15 1965-01-12 Semiconductors Ltd Semiconductors
US3204023A (en) * 1963-03-01 1965-08-31 Texas Instruments Inc Semiconductor device header with semiconductor support
US3442432A (en) * 1967-06-15 1969-05-06 Western Electric Co Bonding a beam-leaded device to a substrate
US3569798A (en) * 1969-05-13 1971-03-09 Rca Corp Double heat sink semiconductor device
US4787551A (en) * 1987-05-04 1988-11-29 Stanford University Method of welding thermocouples to silicon wafers for temperature monitoring in rapid thermal processing
DE112011105738B4 (de) * 2011-10-13 2014-12-31 Toyota Jidosha Kabushiki Kaisha Halbleitermodul

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2137617A (en) * 1936-03-04 1938-11-22 Mallory & Co Inc P R Electrical contact and method of making the same
US2409668A (en) * 1942-07-18 1946-10-22 Westinghouse Electric Corp Heat transfer means and method of assembly
US2464821A (en) * 1942-08-03 1949-03-22 Indium Corp America Method of preparing a surface for soldering by coating with indium
NL87620C (enExample) * 1952-11-14
BE527420A (enExample) * 1953-03-20
US2725505A (en) * 1953-11-30 1955-11-29 Rca Corp Semiconductor power devices
US2877396A (en) * 1954-01-25 1959-03-10 Rca Corp Semi-conductor devices
BE537167A (enExample) * 1954-04-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3234320A (en) * 1963-06-11 1966-02-08 United Carr Inc Integrated circuit package

Also Published As

Publication number Publication date
US3002271A (en) 1961-10-03
BE563189A (enExample)

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