GB8606354D0 - Target holder for cathodic sputtering - Google Patents

Target holder for cathodic sputtering

Info

Publication number
GB8606354D0
GB8606354D0 GB868606354A GB8606354A GB8606354D0 GB 8606354 D0 GB8606354 D0 GB 8606354D0 GB 868606354 A GB868606354 A GB 868606354A GB 8606354 A GB8606354 A GB 8606354A GB 8606354 D0 GB8606354 D0 GB 8606354D0
Authority
GB
United Kingdom
Prior art keywords
target holder
cathodic sputtering
cathodic
sputtering
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB868606354A
Other versions
GB2173217B (en
GB2173217A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OC Oerlikon Balzers AG
Original Assignee
Balzers AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Balzers AG filed Critical Balzers AG
Publication of GB8606354D0 publication Critical patent/GB8606354D0/en
Publication of GB2173217A publication Critical patent/GB2173217A/en
Application granted granted Critical
Publication of GB2173217B publication Critical patent/GB2173217B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
GB8606354A 1985-04-03 1986-03-14 Target holder for cathodic sputtering Expired GB2173217B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH144685A CH664303A5 (en) 1985-04-03 1985-04-03 HOLDING DEVICE FOR TARGETS FOR CATHODE SPRAYING.

Publications (3)

Publication Number Publication Date
GB8606354D0 true GB8606354D0 (en) 1986-04-23
GB2173217A GB2173217A (en) 1986-10-08
GB2173217B GB2173217B (en) 1989-04-19

Family

ID=4210652

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8606354A Expired GB2173217B (en) 1985-04-03 1986-03-14 Target holder for cathodic sputtering

Country Status (5)

Country Link
JP (1) JPS61231171A (en)
CH (1) CH664303A5 (en)
DE (1) DE3603646C2 (en)
FR (1) FR2579910B1 (en)
GB (1) GB2173217B (en)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3613018A1 (en) * 1986-04-17 1987-10-22 Santos Pereira Ribeiro Car Dos MAGNETRON SPRAYING CATHODE
EP0276962A1 (en) * 1987-01-27 1988-08-03 Machine Technology Inc. Cooling device for a sputter target and source
EP0393344A1 (en) * 1989-04-20 1990-10-24 Balzers Aktiengesellschaft Targets supporting device for sputtering sources and procedure for maintaining a target in a support
US5032246A (en) * 1990-05-17 1991-07-16 Tosoh Smd, Inc. Sputtering target wrench and sputtering target design
JPH074359Y2 (en) * 1990-07-10 1995-02-01 三ツ星ベルト株式会社 Toothed belt
DE9014857U1 (en) * 1990-10-26 1992-02-20 Multi-Arc Oberflaechentechnik Gmbh, 5060 Bergisch Gladbach, De
US6689254B1 (en) 1990-10-31 2004-02-10 Tokyo Electron Limited Sputtering apparatus with isolated coolant and sputtering target therefor
DE4133564C2 (en) * 1991-10-10 1999-11-18 Leybold Ag Device for releasably attaching a target or target body to the cathode holder
US5271817A (en) * 1992-03-19 1993-12-21 Vlsi Technology, Inc. Design for sputter targets to reduce defects in refractory metal films
US5286361A (en) * 1992-10-19 1994-02-15 Regents Of The University Of California Magnetically attached sputter targets
EP0824760A1 (en) * 1995-05-11 1998-02-25 Materials Research Corporation Sputtering apparatus with isolated coolant and sputtering target therefor
DE29510381U1 (en) * 1995-06-27 1995-09-07 Leybold Ag Device for coating a disc-shaped substrate
DE19535894A1 (en) * 1995-09-27 1997-04-03 Leybold Materials Gmbh Target for the sputter cathode of a vacuum coating system and process for its production
DE19648390A1 (en) * 1995-09-27 1998-05-28 Leybold Materials Gmbh Target for the sputter cathode of a vacuum coating plant
DE19627533A1 (en) * 1996-07-09 1998-01-15 Leybold Materials Gmbh Target for the sputter cathode of a vacuum coating installation
US6068742A (en) * 1996-07-22 2000-05-30 Balzers Aktiengesellschaft Target arrangement with a circular plate, magnetron for mounting the target arrangement, and process for coating a series of circular disc-shaped workpieces by means of said magnetron source
WO1998037568A1 (en) * 1997-02-24 1998-08-27 Novellus Systems, Inc. Internally cooled target assembly for magnetron sputtering
US5985115A (en) 1997-04-11 1999-11-16 Novellus Systems, Inc. Internally cooled target assembly for magnetron sputtering
DE19746988A1 (en) * 1997-10-24 1999-05-06 Leybold Ag Atomizer cathode
DE29801666U1 (en) * 1998-02-02 1998-04-02 Leybold Materials Gmbh Device for the production of targets for sputtering cathodes
DE19910786A1 (en) * 1999-03-11 2000-09-14 Leybold Systems Gmbh Magnetron cathode used in atomizing target, includes sealed liquid cooling system to prevent former corrosive damage, in construction dispensing with costly special fasteners
US6551470B1 (en) * 1999-06-15 2003-04-22 Academy Precision Materials Clamp and target assembly
US6123775A (en) * 1999-06-30 2000-09-26 Lam Research Corporation Reaction chamber component having improved temperature uniformity
US6264804B1 (en) 2000-04-12 2001-07-24 Ske Technology Corp. System and method for handling and masking a substrate in a sputter deposition system
US6413381B1 (en) 2000-04-12 2002-07-02 Steag Hamatech Ag Horizontal sputtering system
DE10018858B4 (en) * 2000-04-14 2005-08-18 Von Ardenne Anlagentechnik Gmbh magnetron
DE102012006717A1 (en) * 2012-04-04 2013-10-10 Oerlikon Trading Ag, Trübbach Target adapted to an indirect cooling device
CN103286403A (en) * 2013-05-06 2013-09-11 郑凯 Flat-plate welded furnace

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2054161A1 (en) * 1969-11-12 1971-05-19 Varian Associates Atomizing coating device
US3878085A (en) * 1973-07-05 1975-04-15 Sloan Technology Corp Cathode sputtering apparatus
US4166018A (en) * 1974-01-31 1979-08-28 Airco, Inc. Sputtering process and apparatus
GB2058143B (en) * 1979-07-31 1983-11-02 Nordiko Ltd Sputtering electrodes
GB2110719B (en) * 1981-11-30 1985-10-30 Anelva Corp Sputtering apparatus
DE3148354A1 (en) * 1981-12-07 1983-06-09 Siemens AG, 1000 Berlin und 8000 München DEVICE FOR SPRAYING A METAL
JPS59200761A (en) * 1983-04-28 1984-11-14 Toshiba Corp Supporting device for sputtering target
US4428816A (en) * 1983-05-25 1984-01-31 Materials Research Corporation Focusing magnetron sputtering apparatus
US4448659A (en) * 1983-09-12 1984-05-15 Vac-Tec Systems, Inc. Method and apparatus for evaporation arc stabilization including initial target cleaning
US4581540A (en) * 1984-03-16 1986-04-08 Teledyne Industries, Inc. Current overload protected solid state relay
CH665057A5 (en) * 1984-07-20 1988-04-15 Balzers Hochvakuum TARGET PLATE FOR CATHODE SPRAYING.

Also Published As

Publication number Publication date
FR2579910A1 (en) 1986-10-10
DE3603646A1 (en) 1986-10-16
JPS61231171A (en) 1986-10-15
FR2579910B1 (en) 1990-01-12
DE3603646C2 (en) 1996-08-22
GB2173217B (en) 1989-04-19
GB2173217A (en) 1986-10-08
CH664303A5 (en) 1988-02-29

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950314