GB8504311D0 - Sheet with double face printed conductors - Google Patents

Sheet with double face printed conductors

Info

Publication number
GB8504311D0
GB8504311D0 GB858504311A GB8504311A GB8504311D0 GB 8504311 D0 GB8504311 D0 GB 8504311D0 GB 858504311 A GB858504311 A GB 858504311A GB 8504311 A GB8504311 A GB 8504311A GB 8504311 D0 GB8504311 D0 GB 8504311D0
Authority
GB
United Kingdom
Prior art keywords
sheet
double face
printed conductors
face printed
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB858504311A
Other versions
GB2163007A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ADC GmbH
Original Assignee
Krone GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Krone GmbH filed Critical Krone GmbH
Publication of GB8504311D0 publication Critical patent/GB8504311D0/en
Publication of GB2163007A publication Critical patent/GB2163007A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
GB08504311A 1984-08-08 1985-02-20 Sheet with printed conductors on both sides and method of forming interconnections between the conductors Withdrawn GB2163007A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843429236 DE3429236A1 (en) 1984-08-08 1984-08-08 FILM WITH ELECTRICAL LEADS PRINTED ON SIDE SIDE

Publications (2)

Publication Number Publication Date
GB8504311D0 true GB8504311D0 (en) 1985-03-20
GB2163007A GB2163007A (en) 1986-02-12

Family

ID=6242632

Family Applications (2)

Application Number Title Priority Date Filing Date
GB08504311A Withdrawn GB2163007A (en) 1984-08-08 1985-02-20 Sheet with printed conductors on both sides and method of forming interconnections between the conductors
GB08519675A Withdrawn GB2163907A (en) 1984-08-08 1985-08-06 Making printed circuit boards

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB08519675A Withdrawn GB2163907A (en) 1984-08-08 1985-08-06 Making printed circuit boards

Country Status (3)

Country Link
JP (1) JPS6148997A (en)
DE (1) DE3429236A1 (en)
GB (2) GB2163007A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0754872B2 (en) * 1987-06-22 1995-06-07 古河電気工業株式会社 Method for manufacturing double-layer printed circuit sheet
JPH031876U (en) * 1989-05-27 1991-01-10
JPH0635499Y2 (en) * 1989-08-09 1994-09-14 ファイン電子株式会社 Double sided printed circuit board
FR2654296B1 (en) * 1989-11-03 1992-01-10 Horlogerie Photograph Fse TWO - SIDED PRINTED CIRCUIT, AND METHOD FOR THE PRODUCTION THEREOF.
EP0600051B1 (en) * 1992-06-15 1999-05-12 Dyconex Patente Ag Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction
DE19539181C2 (en) * 1995-10-20 1998-05-14 Ods Gmbh & Co Kg Chip card module and corresponding manufacturing process
DE10122414A1 (en) 2001-05-09 2002-11-14 Giesecke & Devrient Gmbh Through connection of flexible printed circuit boards
JP4308716B2 (en) 2004-06-09 2009-08-05 新光電気工業株式会社 Manufacturing method of semiconductor package
EP1814447A2 (en) * 2004-11-23 2007-08-08 Nessler Medizintechnik GmbH Process for through hole plating an electrically insulating substrate material
KR101411717B1 (en) * 2008-07-16 2014-06-26 삼성전자주식회사 Fabrication method for printed circuit board

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE29784E (en) * 1968-11-01 1978-09-26 International Electronics Research Corp. Thermal dissipating metal core printed circuit board
DE2241333A1 (en) * 1972-08-23 1974-03-21 Philips Patentverwaltung METHOD FOR ESTABLISHING AN ELECTRICALLY CONDUCTIVE CONNECTION BETWEEN TWO PARTS OF CURRENT PATHS OF THE SAME CONDUCTOR TRACK LAYING ON A CARRIER PLATE
DE2311736A1 (en) * 1973-03-06 1975-03-27 Berthold Ulrich METHOD OF MANUFACTURING PRINTED CIRCUIT BOARDS
DD112576A1 (en) * 1974-06-17 1975-04-12
DE2548258A1 (en) * 1975-10-28 1977-05-05 Siemens Ag METHOD FOR MANUFACTURING MULTI-LAYER MICROWIRINGS
FR2399184A1 (en) * 1977-07-28 1979-02-23 Telecommunications Sa PROCESS FOR REALIZING PRINTED CIRCUITS WITH METALLIC HOLES FROM INSULATING LAMINATE SUBSTRATES: GLASS-SYNTHETIC RESIN
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
JPS55138294A (en) * 1979-04-11 1980-10-28 Matsushita Electric Ind Co Ltd Method of forming through hole connector
JPS5612797A (en) * 1979-07-12 1981-02-07 Matsushita Electric Ind Co Ltd Multilayer printed circuit board and method of manufacturing same
DE3008143C2 (en) * 1980-03-04 1982-04-08 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Process for the production of printed circuit boards with perforations, the walls of which are metallized
EP0051378A2 (en) * 1980-11-03 1982-05-12 AMP INCORPORATED (a New Jersey corporation) Circuit board having cast circuitry and method of manufacture
FR2522459A1 (en) * 1982-02-26 1983-09-02 Serras Paulet Edouard PRINTED ELECTRICAL CIRCUIT
DE3245458A1 (en) * 1982-12-08 1984-06-14 Siemens AG, 1000 Berlin und 8000 München Method for producing through-plated contacts in thick-film technology
WO1985001415A1 (en) * 1983-09-21 1985-03-28 Allied Corporation Method of making a printed circuit board

Also Published As

Publication number Publication date
JPS6148997A (en) 1986-03-10
GB2163907A (en) 1986-03-05
GB2163007A (en) 1986-02-12
GB8519675D0 (en) 1985-09-11
DE3429236A1 (en) 1986-02-13

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)