GB8422678D0 - Heat transfer devices - Google Patents

Heat transfer devices

Info

Publication number
GB8422678D0
GB8422678D0 GB8422678A GB8422678A GB8422678D0 GB 8422678 D0 GB8422678 D0 GB 8422678D0 GB 8422678 A GB8422678 A GB 8422678A GB 8422678 A GB8422678 A GB 8422678A GB 8422678 D0 GB8422678 D0 GB 8422678D0
Authority
GB
United Kingdom
Prior art keywords
heat transfer
transfer devices
devices
heat
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8422678A
Other versions
GB2146423A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REDPOINT Ltd
Original Assignee
REDPOINT Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by REDPOINT Ltd filed Critical REDPOINT Ltd
Priority to GB8422678A priority Critical patent/GB2146423A/en
Publication of GB8422678D0 publication Critical patent/GB8422678D0/en
Publication of GB2146423A publication Critical patent/GB2146423A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3677Wire-like or pin-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB8422678A 1984-09-07 1984-09-07 Heat transfer devices Withdrawn GB2146423A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8422678A GB2146423A (en) 1984-09-07 1984-09-07 Heat transfer devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8422678A GB2146423A (en) 1984-09-07 1984-09-07 Heat transfer devices

Publications (2)

Publication Number Publication Date
GB8422678D0 true GB8422678D0 (en) 1984-10-10
GB2146423A GB2146423A (en) 1985-04-17

Family

ID=10566422

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8422678A Withdrawn GB2146423A (en) 1984-09-07 1984-09-07 Heat transfer devices

Country Status (1)

Country Link
GB (1) GB2146423A (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4993482A (en) * 1990-01-09 1991-02-19 Microelectronics And Computer Technology Corporation Coiled spring heat transfer element
JP2544497B2 (en) * 1990-02-28 1996-10-16 株式会社日立製作所 Computer cooling device
JPH0629683A (en) * 1992-03-31 1994-02-04 Furukawa Electric Co Ltd:The Heat pipe type heat dissipation unit for electronic apparatus
DE4314199C2 (en) * 1993-04-30 1997-09-04 Bodenseewerk Geraetetech Device for heat dissipation from a vibration-damped suspended assembly
US5402313A (en) * 1993-05-21 1995-03-28 Cummins Engine Company, Inc. Electronic component heat sink attachment using a canted coil spring
TWI381494B (en) * 2004-01-07 2013-01-01 Jisouken Co Ltd Cooling device
JP4601610B2 (en) * 2004-03-31 2010-12-22 株式会社事業創造研究所 Heat sink manufacturing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB559107A (en) * 1942-10-29 1944-02-03 Edwin James Bowman Improvements in radiators for cooling liquids and for heating rooms
GB586860A (en) * 1944-09-15 1947-04-02 Ralph Poole Improvement in or relating to heat exchange apparatus for fluids
GB678352A (en) * 1950-02-18 1952-09-03 Air Preheater Improvements in or relating to heat exchangers
GB787286A (en) * 1954-09-13 1957-12-04 Air Preheater An assembly of parts for forming a heat exchanger envelope
GB857707A (en) * 1958-05-06 1961-01-04 Morris Motors Ltd Improvements relating to heat-exchangers
DE1501503A1 (en) * 1965-09-30 1969-12-18 David Dalin Heat exchanger with enlarged surface and process for its manufacture
FR2085171B1 (en) * 1969-12-23 1974-02-01 Radial Ste Nle
GB1423898A (en) * 1973-07-19 1976-02-04 Pertsev L P Heat exchangers
DE2714617C2 (en) * 1977-04-01 1982-08-26 Spiro Research B.V., Helmond Heat exchanger with a wire coil arranged on a support tube

Also Published As

Publication number Publication date
GB2146423A (en) 1985-04-17

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)