GB8410039D0 - Manufacture of multi-layer circuit - Google Patents
Manufacture of multi-layer circuitInfo
- Publication number
- GB8410039D0 GB8410039D0 GB848410039A GB8410039A GB8410039D0 GB 8410039 D0 GB8410039 D0 GB 8410039D0 GB 848410039 A GB848410039 A GB 848410039A GB 8410039 A GB8410039 A GB 8410039A GB 8410039 D0 GB8410039 D0 GB 8410039D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- manufacture
- layer circuit
- circuit
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19833315615 DE3315615A1 (en) | 1983-04-29 | 1983-04-29 | METHOD FOR PRODUCING A MULTILAYER CIRCUIT |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8410039D0 true GB8410039D0 (en) | 1984-05-31 |
GB2140628A GB2140628A (en) | 1984-11-28 |
GB2140628B GB2140628B (en) | 1986-07-09 |
Family
ID=6197707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08410039A Expired GB2140628B (en) | 1983-04-29 | 1984-04-18 | Procedure for the manufacture of a multi-layer circuit |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS59207695A (en) |
DE (1) | DE3315615A1 (en) |
FR (1) | FR2545313B1 (en) |
GB (1) | GB2140628B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0211180A3 (en) * | 1985-08-02 | 1989-08-09 | Shipley Company Inc. | Method for manufacture of multilayer circuit board |
US6462107B1 (en) | 1997-12-23 | 2002-10-08 | The Texas A&M University System | Photoimageable compositions and films for printed wiring board manufacture |
EP0958736A1 (en) | 1998-05-12 | 1999-11-24 | Garden Systems in 't kort GARSY | Assembly of stacked plant containers |
DE10227658B4 (en) * | 2002-06-20 | 2012-03-08 | Curamik Electronics Gmbh | Metal-ceramic substrate for electrical circuits or modules, method for producing such a substrate and module with such a substrate |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1765013A1 (en) * | 1968-03-21 | 1971-07-01 | Telefunken Patent | Process for the production of multilevel circuits |
FR2042059A5 (en) * | 1969-04-02 | 1971-02-05 | Ibm | |
DE2202077A1 (en) * | 1971-05-17 | 1972-11-30 | Hochvakuum Dresden Veb | Process for the production of multilayer printed circuit boards |
FR2204940B1 (en) * | 1972-10-27 | 1976-01-30 | Thomson Csf Fr | |
DE2822011B2 (en) * | 1978-05-19 | 1980-06-04 | Fujitsu Ltd., Kawasaki, Kanagawa (Japan) | Semiconductor device and method for the production thereof |
FR2466103A1 (en) * | 1979-09-18 | 1981-03-27 | Lerouzic Jean | Circuit board with aluminium tracks on alumina base - uses metallic base with alumina layer over which granular aluminium is deposited and selectively oxidised to form conductive paths |
DE3013667C2 (en) * | 1980-04-09 | 1983-01-20 | Wilhelm Ruf KG, 8000 München | Printed circuit board and process for their manufacture |
GB2073951B (en) * | 1980-04-11 | 1984-10-03 | Hitachi Ltd | Multilayer interconnections for an integrated circuit |
-
1983
- 1983-04-29 DE DE19833315615 patent/DE3315615A1/en not_active Withdrawn
-
1984
- 1984-04-18 GB GB08410039A patent/GB2140628B/en not_active Expired
- 1984-04-27 FR FR8406667A patent/FR2545313B1/en not_active Expired
- 1984-04-27 JP JP8607284A patent/JPS59207695A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
GB2140628A (en) | 1984-11-28 |
JPS59207695A (en) | 1984-11-24 |
DE3315615A1 (en) | 1984-10-31 |
FR2545313A1 (en) | 1984-11-02 |
FR2545313B1 (en) | 1987-12-18 |
GB2140628B (en) | 1986-07-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |