GB8321282D0 - Structure for thick film electrical circuits - Google Patents

Structure for thick film electrical circuits

Info

Publication number
GB8321282D0
GB8321282D0 GB838321282A GB8321282A GB8321282D0 GB 8321282 D0 GB8321282 D0 GB 8321282D0 GB 838321282 A GB838321282 A GB 838321282A GB 8321282 A GB8321282 A GB 8321282A GB 8321282 D0 GB8321282 D0 GB 8321282D0
Authority
GB
United Kingdom
Prior art keywords
thick film
electrical circuits
film electrical
circuits
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB838321282A
Other versions
GB2144922B (en
GB2144922A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB08321282A priority Critical patent/GB2144922B/en
Publication of GB8321282D0 publication Critical patent/GB8321282D0/en
Priority to AU30734/84A priority patent/AU3073484A/en
Priority to NZ209104A priority patent/NZ209104A/en
Publication of GB2144922A publication Critical patent/GB2144922A/en
Application granted granted Critical
Publication of GB2144922B publication Critical patent/GB2144922B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
GB08321282A 1983-08-06 1983-08-06 Substrate for thick-film electrical circuits Expired GB2144922B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB08321282A GB2144922B (en) 1983-08-06 1983-08-06 Substrate for thick-film electrical circuits
AU30734/84A AU3073484A (en) 1983-08-06 1984-07-16 Structure for thick film electrical circuits
NZ209104A NZ209104A (en) 1983-08-06 1984-08-03 Thick-film circuit with a substrate containing molybdenum

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08321282A GB2144922B (en) 1983-08-06 1983-08-06 Substrate for thick-film electrical circuits

Publications (3)

Publication Number Publication Date
GB8321282D0 true GB8321282D0 (en) 1983-09-28
GB2144922A GB2144922A (en) 1985-03-13
GB2144922B GB2144922B (en) 1986-06-18

Family

ID=10546965

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08321282A Expired GB2144922B (en) 1983-08-06 1983-08-06 Substrate for thick-film electrical circuits

Country Status (3)

Country Link
AU (1) AU3073484A (en)
GB (1) GB2144922B (en)
NZ (1) NZ209104A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2162694A (en) * 1984-08-04 1986-02-05 British Aerospace Printed circuits
GB8512916D0 (en) * 1985-05-22 1985-06-26 Horgan M F Probe cards
GB8908366D0 (en) * 1989-04-13 1989-06-01 Ist Lab Ltd Improvements in or relating to automotive electrical systems

Also Published As

Publication number Publication date
GB2144922B (en) 1986-06-18
AU3073484A (en) 1985-02-07
GB2144922A (en) 1985-03-13
NZ209104A (en) 1987-09-30

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930806