GB8310771D0 - Light-sensitive resin composition - Google Patents

Light-sensitive resin composition

Info

Publication number
GB8310771D0
GB8310771D0 GB838310771A GB8310771A GB8310771D0 GB 8310771 D0 GB8310771 D0 GB 8310771D0 GB 838310771 A GB838310771 A GB 838310771A GB 8310771 A GB8310771 A GB 8310771A GB 8310771 D0 GB8310771 D0 GB 8310771D0
Authority
GB
United Kingdom
Prior art keywords
light
resin composition
sensitive resin
sensitive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB838310771A
Other versions
GB2118563A (en
GB2118563B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries Ltd filed Critical Daicel Chemical Industries Ltd
Publication of GB8310771D0 publication Critical patent/GB8310771D0/en
Publication of GB2118563A publication Critical patent/GB2118563A/en
Application granted granted Critical
Publication of GB2118563B publication Critical patent/GB2118563B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • C08F20/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GB08310771A 1982-04-22 1983-04-21 Light-sensitive unsaturated urethane resin composition Expired GB2118563B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6788882A JPS58183720A (en) 1982-04-22 1982-04-22 Photosensitive resin composition

Publications (3)

Publication Number Publication Date
GB8310771D0 true GB8310771D0 (en) 1983-05-25
GB2118563A GB2118563A (en) 1983-11-02
GB2118563B GB2118563B (en) 1985-06-05

Family

ID=13357879

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08310771A Expired GB2118563B (en) 1982-04-22 1983-04-21 Light-sensitive unsaturated urethane resin composition

Country Status (3)

Country Link
JP (1) JPS58183720A (en)
DE (1) DE3314258C2 (en)
GB (1) GB2118563B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115003718A (en) * 2020-03-31 2022-09-02 Tdk株式会社 Resin composition and laminate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07113767B2 (en) * 1986-10-02 1995-12-06 旭化成工業株式会社 Photosensitive resin printing plate for step ball printing
US5288571A (en) * 1986-10-02 1994-02-22 Asahi Kasei Kogyo Kabushiki Kaisha Photoresin printing plate for use in printing a corrugated board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3136818C2 (en) * 1980-09-19 1990-08-02 Hitachi Chemical Co., Ltd., Tokio/Tokyo Use of a photosensitive mixture and a photosensitive recording material for forming a solder mask

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115003718A (en) * 2020-03-31 2022-09-02 Tdk株式会社 Resin composition and laminate
CN115003718B (en) * 2020-03-31 2024-04-19 Tdk株式会社 Resin composition and laminate

Also Published As

Publication number Publication date
DE3314258C2 (en) 1994-09-29
JPH029610B2 (en) 1990-03-02
GB2118563A (en) 1983-11-02
JPS58183720A (en) 1983-10-27
DE3314258A1 (en) 1983-10-27
GB2118563B (en) 1985-06-05

Similar Documents

Publication Publication Date Title
DE3371090D1 (en) Resin composition
DE3476703D1 (en) Photosensitive resin composition
EP0092444A3 (en) Positive type photosensitive resin composition
GB2121045B (en) Epoxy resin composition
DE3361442D1 (en) Photosensitive polymer composition
GB8321161D0 (en) Polyolefin resin composition
DE3366697D1 (en) Polyolefin resin composition
GB8328160D0 (en) Synthetic resin composition
DE3370700D1 (en) Photosensitive composition
GB2073756B (en) Positive type photosensitive resin composition
DE3375016D1 (en) Curing composition
DE3378734D1 (en) Light-sensitive composition
GB2125177B (en) Light-sensitive composition
DE3369741D1 (en) Photosensitive resin composition
DE3367399D1 (en) Epoxy resin composition
EP0089206A3 (en) Resin composition
DE3373024D1 (en) Photosensitive resin composition
DE3475969D1 (en) Light-sensitive composition
GB2100278B (en) Photosensitive resin composition
DE3473654D1 (en) Photosensitive resin composition
DE3364191D1 (en) Epoxy resin composition
GB2134275B (en) Photosensitive resin compositions
GB8400676D0 (en) Solid resin composition
DE3276819D1 (en) Resin composition
GB8310771D0 (en) Light-sensitive resin composition

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950421