GB2611444A - Electronic circuit and method of manufacture - Google Patents

Electronic circuit and method of manufacture Download PDF

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Publication number
GB2611444A
GB2611444A GB2218594.6A GB202218594A GB2611444A GB 2611444 A GB2611444 A GB 2611444A GB 202218594 A GB202218594 A GB 202218594A GB 2611444 A GB2611444 A GB 2611444A
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Prior art keywords
power rail
layer
circuit
power
dielectric material
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GB2218594.6A
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GB202218594D0 (en
Inventor
Cobb Brian
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Pragmatic Semiconductor Ltd
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Pragmatic Printing Ltd
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Priority to GB2218594.6A priority Critical patent/GB2611444A/en
Priority claimed from GB2200560.7A external-priority patent/GB2604728B/en
Publication of GB202218594D0 publication Critical patent/GB202218594D0/en
Publication of GB2611444A publication Critical patent/GB2611444A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/642—Capacitive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H01L23/5223—Capacitor integral with wiring layers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0707—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement being capable of collecting energy from external energy sources, e.g. thermocouples, vibration, electromagnetic radiation
    • G06K19/0708—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement being capable of collecting energy from external energy sources, e.g. thermocouples, vibration, electromagnetic radiation the source being electromagnetic or magnetic
    • G06K19/0709—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement being capable of collecting energy from external energy sources, e.g. thermocouples, vibration, electromagnetic radiation the source being electromagnetic or magnetic the source being an interrogation field
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0701—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management
    • G06K19/0715—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising an arrangement for power management the arrangement including means to regulate power transfer to the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
    • G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
    • G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
    • G06K7/10158—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves methods and means used by the interrogation device for reliably powering the wireless record carriers using an electromagnetic interrogation field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49589—Capacitor integral with or on the leadframe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/248—Supports; Mounting means by structural association with other equipment or articles with receiving set provided with an AC/DC converting device, e.g. rectennas

Abstract

An electronic circuit comprises: a first power rail 1; a second power rail 2; and a layer or other body of dielectric material 4. The first & second power rails respectively comprise first & second power rail portions 11 & 22 arranged on opposite sides of the layer or other body of dielectric material 4. The first power rail portion 11 and second power rail portion 22 are aligned with one another and a portion 42 of the dielectric sandwiched between them so as to provide a capacitance C to the circuit. The power rails may take the form of mesh or grid structures. The circuit may include a rectification means connected to the power rails and an antenna, configured to generate voltage between the power rails. A further portion 41 of the dielectric 4 may serve as a gate dielectric 35 of a field effect transistor 3.

Description

Electronic Circuit and Method of Manufacture
FIELD OF THE INVENTION
[0001] This invention relates to electronic circuits comprising first and second power rails and at least one field effect transistor. Certain embodiments relate to such circuits arranged to generate a DC voltage across the first and second power rails from a received wireless signal.
BACKGROUND OF THE INVENTION
[0002] In many electronic circuits, for example RFID integrated circuits receiving their power and data from an SF signal, perhaps via an antenna, there are challenges in providing a stable, low noise power supply to the circuits. This may be achieved using a large onboard capacitor between the power rails, for example across Vdd and ground. However, such large capacitors may consume a significant area of the integrated circuit, putting a limit on its ultimate miniaturisation. Alternatively, a large capacitor between the power rails may be provided as a discrete (off-chip) component, but this approach adds complexity, scale and cost to circuit assembly.
[0003] It is known from US 5202751 to provide capacitance to a conventional silicon-based semiconductor integrated circuit by arranging conductors of the two power rails in two layers mutually laminated in parallel, with a dielectric substance interposed between the two layers. However, such an arrangement complicates the circuit and its method of manufacture.
[0004] It is an object of certain aspects and embodiments of the present invention to solve, at least partly, one or more of the problems associated with the prior art.
BRIEF SUMMARY OF THE DISCLOSURE
[0005] A first aspect of the present invention provides an electronic circuit as defined by claim 1 [0006] Advantageously, the layer or other body of dielectric material has dual purpose, in that a first portion of it provides the gate dielectric for the FET, and a second portion of it forms, together with the first rail portion and second rail portion, a capacitance. Thus, in addition to, or as an alternative to, capacitance provided by a separate capacitor incorporated in the electronic circuit, capacitance may be provided (for example for power supply smoothing purposes) by portions of the first and second power rails arranged to overlap one another, to a desired degree (in other words providing a desired overlap area), separated by the same dielectric material that is already present in the circuit to provide the FET gate dielectric. This gate dielectric material may be high k material, and/or the layer of dielectric material may be thin, and hence the capacitance provided to the circuit by the overlapping portions of the power rails, with the high-k and/or thin dielectric material between them, may be substantial.
[0007] Advantageously, manufacture of electronic circuits embodying the invention may be simpler than methods used to construct prior art circuits, because the gate dielectric and dielectric for the "power rail capacitance" (formed from overlapping portions of the first and second power rails) may be formed at the same time, i.e. in a processing single step (e.g. by deposition, or other suitable technique). Furthermore, the first and second FET terminals and the first rail portion may be formed at the same time as each other (i.e. in a single processing step), and the gate terminal and second rail portion may be formed at the same time as each other, in another single processing step.
[0008] In certain embodiments, said layer or other body of dielectric material (4) is a layer.
[0009] In certain embodiments, said layer has a thickness in the range mm to 500nm, for example 5nm to 50nm. There are advantages in having the layer as thin as possible, subject to any other constraints, to result in greater capacitance being provided.
[0010] In certain embodiments, said dielectric material has a dielectric constant greater than 3.9, for example greater than 4, 5, 6, or 77, 12, or 19. For example, the dielectric material may be A1203 with K-8, Y203 with K-13 (and can be used for polysilicon TFTs), tantalum oxide 1a205 with K-20 (and can be used for organic TFTs), or one of many other high-K materials, as identified, for example, at https://pubs.acs.org/doi/10.1021/acs.chemrev.8b00045 [0011] In certain embodiments, said FET is a thin film transistor.
[0012] In certain embodiments, said first and second terminals (31, 32) and said first rail portion (11) are each substantially flat and coplanar with one another.
[0013] In certain embodiments, said first terminal (31) is directly connected to said first rail portion.
[0014] In certain embodiments, said first terminal (31) and said first rail portion (11) are respective portions of a flat layer or other body of conductive material.
[0015] In certain embodiments, said gate terminal (34) and said second rail portion (22) are each substantially flat and coplanar with one another.
[0016] In certain embodiments, said first rail portion (11) is in direct contact with said first side (421).
[0017] In certain embodiments, said second rail portion (22) is in direct contact with said second side (422).
[0018] In certain embodiments, the circuit further comprises an antenna (101) arranged to receive a wireless signal, rectifying means (102) connected to the antenna and to the first and second power rails and arranged to generate a DC voltage between (across) said first and second power rails from a received wireless signal.
[0019] In certain embodiments, the circuit further comprises a capacitor (103) connected between said first and second power rails to smooth said DC voltage.
[0020] In certain embodiments, the circuit further comprises a layer of semiconductive material (5), said first and second terminals (31, 32) and said first rail portion (11) are formed on a first surface of the layer of semiconductive material, said channel (33) being provided by a portion of the layer of semiconductive material (5), said layer or other body of dielectric material (4) is formed over the first and second terminals and said first rail portion, and said gate terminal (34) and second rail portion (22) are formed on a first surface of the layer or other body of dielectric material.
[0021] In certain embodiments, the circuit further comprises a substrate (6) under the layer of semiconductive material (5).
[0022] In certain embodiments, the circuit further comprises a substrate (6) and a layer of semiconductive material (5), wherein said first and second terminals (31, 32) and said first rail portion (11) are formed on a first surface of the substrate, said layer of semiconductive material (5) is formed over the first and second terminals and said first rail portion, said layer or other body of dielectric material (4) is formed over the layer of semiconductive material, and said gate terminal (34) and second rail portion (22) are formed on a first surface of the layer or other body of dielectric material (4).
[0023] In certain embodiments, the circuit further comprises a substrate (6) and a layer of semiconductive material (5), wherein said first and second terminals (31, 32) and said first rail portion (11) are formed on a first surface of the substrate, said layer of semiconductive material (5) is formed at least between the first and second terminals to provide said channel (33), said layer or other body of dielectric material (4) is formed over the layer of semiconductive material and the first and second terminals and the first rail portion, and said gate terminal (34) and second rail portion (22) are formed on a first surface of the layer or other body of dielectric material (4).
[0024] In certain embodiments, the circuit further comprises a substrate (6) and a layer of semiconductive material (5) , wherein said gate terminal (34) and said second rail portion (22) are formed on a first surface of the substrate, said layer or other body of dielectric material (4) of is formed over the gate terminal and said second rail portion, said first and second terminals (31, 32) and said first rail portion (11) are formed over the layer or other body of dielectric material, and said layer of semiconductive material (5) is formed at least between the first and second terminals to provide said channel.
[0025] In certain embodiments, the circuit further comprises a substrate (6) and a layer of semiconductive material (5), wherein said gate terminal (34) and said second rail portion (22) are formed on a first surface of the substrate, said layer or other body of dielectric material (4) is formed over the gate terminal and said second rail portion, said layer of semiconductive material (5) is formed over at least a portion of the layer or body of dielectric material (4) covering the gate terminal, and said first and second terminals (31, 32) and said first rail portion (11) are formed over the layer of semiconductive material and the layer or other body of dielectric material.
[0026] Another aspect of the invention provides an electronic circuit comprising: a first power rail (1); a second power rail (2); and a layer or other body of dielectric material (4), wherein the first power rail comprises a first rail portion (11) arranged on a first side of the layer or other body of dielectric material (4), and the second power rail comprises a second rail portion (22) arranged on a second side of the layer or other body of dielectric material, said second side being opposite said first side, said first rail portion comprising a first grid or mesh of crossing and intersecting conductive elements (11a-11i) and said second rail portion comprising a second grid or mesh of crossing and intersecting conductive elements (22a-22i), said first and second grids or meshes having the same shape (or, in other words, footprint, i.e. projection onto a plane) and being aligned with one another, on said opposite first and second sides, so as to form, together with a portion (42) of the layer or other body of dielectric material sandwiched between them, a capacitor.
[0027] In certain embodiments, the circuit further comprises a field effect transistor (3) comprising: a first terminal (31) coupled directly or indirectly to the first power rail; a second terminal (32) coupled directly or indirectly to the second power rail; a channel of semiconductive material (33) connecting the first terminal to the second terminal; a gate terminal (34) to which a voltage may be applied to control a conductivity of said channel, said channel providing a conduction path from the first terminal to the second terminal; and a gate dielectric (35) arranged to insulate the gate terminal from said channel, wherein said gate dielectric comprises a portion (41) of said layer or other body of dielectric material (4).
[0028] In certain embodiments, the electronic circuit comprises a further capacitor (103) connected between said power rails, said further capacitor comprising a first capacitor plate (1031), connected to the first power rail (1), and arranged on said first side, a second capacitor plate (1032), connected to the second power rail, and arranged on said second side, and a further portion (400) of said layer or other body of dielectric material, said further portion being a portion located between said first and second capacitor plates [0029] In certain embodiments, the circuit further comprises an antenna (101) arranged to receive a wireless signal, rectifying means (102) connected to the antenna and to the first and second power rails (1,2) and arranged to generate a DC voltage between (across) said first and second power rails from a received wireless signal.
[0030] Another aspect of the invention provides a method of manufacturing an electronic circuit comprising a first power rail (1), a second power rail (2), and a field effect transistor (3), FET, comprising a first terminal (31) coupled directly or indirectly to the first power rail, a second terminal (32) coupled directly or indirectly to the second power rail, a channel (33) of semiconducfive material connecting the first terminal to the second terminal, a gate terminal (34) to which a voltage may be applied to control a conductivity of said channel, said channel providing a conduction path from the first terminal to the second terminal; and a gate dielectric (35) arranged to insulate the gate terminal from said channel, the method comprising: forming a layer or other body of dielectric material comprising a first portion and a second portion; forming the first and second terminals and a first rail portion of the first power rail at the same time on a first side of the layer or other body of dielectric material; forming the gate terminal and a second rail portion of the second power rail at the same time on a second side of the layer or other body of dielectric material, wherein said first and second rail portions are positioned on opposite sides of said second portion so as to form, together with said second portion, a capacitor, and wherein said gate terminal and first and second terminals are positioned such that said first portion provides said gate dielectric.
[0031] In certain embodiments, said forming of the first and second terminals and first rail portion is performed before forming said layer or other body of dielectric material, and said forming of the gate terminal and second rail portion is performed after forming said layer or other body of dielectric material.
[0032] In certain embodiments, said forming of the first and second terminals and first rail portion is performed after forming said layer or other body of dielectric material, and said forming of the gate terminal and second rail portion is performed before forming said layer or other body of dielectric material.
[0033] It will be appreciated that, although the concept of arranging power and earth conductors in two parallel layers, with a dielectric in between to provide a capacitance, is known for a conventional silicon based IC from US 5,202,751, embodiments of aspects of the present invention are significantly different, and provide numerous advantages.
[0034] For example, the distributed capacitance of the first and second rail portions when provided in grid or mesh form in certain embodiments, provide a significant part of the overall power rail capacitance for the integrated circuit, not just a small local charge reservoir.
[0035] Silicon integrated circuits do not have flat, planar metal layers, with high capacitance dielectrics between them, and certainly not among the device layers. Whilst such layers may be provided among the back end interconnect layers stacked above the device layers, these typically use low-k dielectrics to minimise coupling between layers, and are thicker, further reducing coupling between layers. Thus, conventional silicon processing cannot effectively incorporate the novel structures described in this patent specification into layers already existing in their processes.
BRIEF DESCRIPTION OF THE DRAWINGS
[0036] Embodiments of the invention will now be described with reference to the accompanying figures, of which: Fig. 1 is a schematic representation of an electronic circuit embodying the invention; Fig. 2 is a schematic cross section of part of another electronic circuit embodying the invention; Figs. 3-5 are schematic cross sections of alternative electronic circuits embodying the invention; each having a top gate structure; Figs. 6-9 are schematic cross sections of parts of further electronic circuits embodying the invention, each having a bottom gate structure; Figs. 10 and 11 are schematic cross sections of parts of further electronic circuits embodying the invention, each comprising two FETs; Fig. 12 is a schematic representation of a method of manufacturing an electronic circuit embodying the invention; Fig. 13 is a schematic plan view of another circuit embodying the invention; Fig. 14 and figs. 14a-14e are schematic representations of overlapping power meshes used in certain embodiments of the invention; and Fig. 15 is a schematic cross section of part of another electronic circuit embodying the invention.
DETAILED DESCRIPTION OF EMBODIMENTS OF THE INVENTION
[0037] Referring now to Fig. 1, this shows an electronic circuit embodying the invention.
The circuit 100 comprises an antenna 101 (or antenna means), arranged to receive a wireless signal and provide a corresponding alternating voltage, generated by the received signal, via antenna terminals 201, 202 to a rectifier or rectifying means 102. The rectifier 102 generates a DC supply voltage Vdd between two power rails, namely a first power rail 1 and a second power rail 2. The circuit further comprises a capacitor 103 arranged to provide some smoothing of the DC power supply voltage Vdd. The circuit further comprises an FET 3 having: a first terminal 31 coupled by coupling means 106 to the first power rail; a second terminal 32 coupled by coupling means 107 to the second power rail; a channel 33 of semiconducfive material connecting the first terminal to the second terminal; a gate terminal 34 to which a voltage may be applied to control a conductivity of the channel 33; and a gate dielectric 35 arranged to insulate the gate terminal from the channel. In this example, the control voltage supplied to the gate terminal of the FET 3 is supplied from a further portion 104 of the electronic circuit, whose details are not necessary for understanding the invention. Accordingly, that further portion 104 of the circuit is simply indicated by a broken line in the figure. Similarly, the voltage at the second terminal 32 of the FET 3 is provided to a further portion 105 of the circuit, whose details are not necessary for an understanding of the invention. In certain embodiments, the first terminal 31 is coupled directly to the first power rail 1, i.e. it is connected to the first power rail by conducting means (e.g. one or more conductive tracks) having insignificant resistance, and there is no circuit component between terminal 31 and the first power rail 1. However, in alternative embodiments, the first terminal 31 may be indirectly coupled to the first power rail 1, for example by one or more circuit components, such as one or more resistors, or one or more other passive circuit components, or one or more active components. Similarly, in various embodiments of the invention, the second terminal 32 may be coupled directly or indirectly to the second power rail 2.
[0038] In this first example, the circuit comprises a layer or other body of dielectric material, the gate dielectric 35 being provided by a first portion 41 of that layer or other body of dielectric material. Additionally, the first power rail 1 comprises a first rail portion 11 arranged on a first side of a second portion 42 of the layer or other body of dielectric material, and the second power rail 2 comprises a second rail portion 22 arranged on a second side of the second portion 42 of the layer or other body of dielectric material, that second side being opposite the first side. Thus, the second portion 42 of the layer or other body of dielectric material separates the first 11 and second 22 rail portions, and with the first and second rail portions provides a capacitance to the circuit in addition to that provided by capacitor 103.
[0039] It will be appreciated that Fig. 1 is highly schematic, and in practical embodiments of the invention the overlapping portions 11 and 22 of the first and second power rails may be separated by a small distance, that distance being the thickness of the second portion 42 of the layer or other body of dielectric material, which in certain embodiments is itself a thin layer of high-k material.
[0040] Referring now to Fig. 2, this illustrates a cross section of part of an electronic circuit embodying the invention. The circuit comprises a layer 5 of semiconductor material formed on a suitable substrate 6, which may, in certain embodiments be flexible. On top of the semiconductor layer 5 (i.e. on a first surface of the semiconductor layer) are formed the first and second terminals 31, 32 of the FET 3 and at least a portion of the first power rail 1. In this figure, neither the first terminal 31 nor second terminal 32 are directly connected to the power rail 1, but in alternative embodiments one of those terminals, for example the first terminal 31 may be directly connected to the first power rail 1. This direct connection or direct coupling may be achieved, for example, by forming the first terminal 31 and first power rail 1 as integral portions of a single body, layer, region, or area of conductive material. Such optional direct connection is indicated by the broken line Y in the figure. A layer 4 of high k dielectric material has been formed over the first and second terminals and the first power rail 1, such that the first and second terminals and first power rail 1 are arranged on an underside of the dielectric layer 4. On an upper surface or side of the dielectric layer 4 there are formed a gate terminal 34 and at least a portion of the second power rail 2. The gate terminal 34 is arranged generally over the gap between the first and second terminals 31, 32 so that a voltage applied to the gate terminal 34 may be used to control a conductivity of a semiconductive channel 33 in the semiconductive layer 5, providing an electric conduction path between the first terminal 31 and a second terminal 32. It will be appreciated that a first rail portion 11 of the first power rail 1 is overlapped by a second rail portion 22 of the second power rail, with, in this example, just a second portion 42 of the layer of dielectric material separating them. Thus, the first and second rail portions 11, 12, together with the second portion 42 of dielectric material form a capacitor, indicated by the arrow labelled C in the figure. A first portion 41 of that same layer of dielectric material 4 provides the gate dielectric 35 of the FET 3. It will be appreciated that in certain embodiments the structure may further include one or more additional device layers, indicated generally by reference number 800.
[0041] Thus, in the embodiment of Fig. 2, the first rail portion 11 is arranged on a first side 421 of the second portion 42 of the layer of dielectric material 4, and the second rail portion 22 is arranged on a second side 422 of the second portion 42 of the layer of dielectric material 4. In other words, the first and second power rails 1, 2 are arranged to have portions 11 and 22 which are aligned with one another, on opposite sides of the dielectric layer 4 which also provides the gate dielectric. The areas of these overlapping portions 11, 22 may be selected (i.e. designed), together with the thickness of the dielectric layer 4 and dielectric constant k of the dielectric material 4, so as to provide a desired capacitance C to the circuit.
[0042] Referring now to Fig. 3, this illustrates an alternative electronic circuit also having a top gate structure. Here, rather than the semiconductor layer 5 being provided beneath the first and second terminals, it is formed over the first and second terminals and first rail portion 11. The gate dielectric layer 4 is then formed over the semiconductor layer 5, and the gate terminal 34 and second rail portion 22 are provided on top of the gate dielectric layer 4. Again, a first portion 41 of the gate dielectric layer provides the gate dielectric 35 to the FET 3, and a second portion 42 provides part of the capacitive material between the aligned, overlapping first and second portions 11, 22. Those first and second rail portions 11, 22 are additionally separated by a portion 52 of the layer of semiconductive material 5. It will be appreciated that this arrangement results in the "power rail capacitor" having a lower capacitance than if the portion 52 of semiconductor material were not present between the rail portions 11 and 22, but depending on device requirements, this may be tolerable or desirable.
[0043] Referring now to Fig. 4, in an alternative electronic circuit incorporating a top gate FET 3, rather than providing an extensive layer of semiconductor material, semiconductor material is provided just between the first and second terminals 31 and 32 to provide the channel portion 33. In this example, the second terminal and first terminal 32, 31 are not directly connected to the first rail portion 11, as indicated by arrow B (in contrast to the direct connection between the first terminal 31 and first rail portion 11 as indicated by arrow A in Fig. 3). The dielectric layer 4 is formed over the first and second terminals and first rail portion 11 and semiconducfive channel 33, so that in this example the first and second rail portions 11 and 22 are separated only by dielectric material 4, in particular the second portion 42 of dielectric layer 4.
[0044] In the example shown in Fig. 5, a layer of semiconductor material 5 has been formed over the first and second FET terminals, 31, 32 and over part of the first power rail 1. However, the layer of semiconductor material 5 does not extend between the first and second rail portions 11 and 22, which are separated only by the thickness of the second portion 42 of dielectric layer 4.
[0045] Referring now to Figs. 6-9, these show a series of alternative embodiments which can generally be described as incorporating bottom gate structures. Thus, in Fig. 6 the gate terminal 34 and second rail portion 22 are formed on a surface of a substrate 6, and the layer of dielectric material 4 has been formed on top of the gate and second rail portion 22. The first and second terminals 31, 32 and first rail portion 11 are formed on top of the layer of dielectric material 4, in this example with the first terminal 31 being directly connected (see arrow A) to the first rail portion 11. In this example the FET channel 33 is provided by semiconductive material arranged just between the first and second terminals 31 and 32, again on top of the layer of dielectric material 4.
[0046] In the example shown in Fig. 7, the semiconductive material is formed as a more extensive layer or body 5, covering the first and second terminals 31, 32, neither of which is directly connected to the first rail portion 11.
[0047] Fig. 8 shows an alternative structure, in which the semiconductive channel 33 is provided by a portion of a layer 5 of semiconductor material formed on top of the dielectric layer 4, and the first and second terminals 31, 32 and first rail portion 11 are formed on top of (i.e. on an upper surface of) the semiconductor layer 5. In this example, the capacitance C provided by the overlapping portions 11 and 22 of the power rails is determined by the areas of those portions 11, 22, the thicknesses of the portions 42 and 52 of the dielectric layer and semiconductor layer respectively, between the rail portions 11 and 22, and the dielectric constants of the semiconductor material 5 and dielectric material 4.
[0048] Fig. 9 illustrates an alternative bottom gate structure where a region of semiconductor material 5 is deposited on top of the gate dielectric layer 4 to provide the FET channel 33, and the first and second terminals 31 and 32 are formed so as to partially overlap the layer or body of semiconductor material S. In this example the layer of semiconductor material 5 does not extend between the first and second rail portions 11, 22 which are separated just by the second portion 42 of the dielectric layer 4.
[0049] The principles of the overlapping power rail portions to provide additional capacitance can be applied even to circuits in which the device terminals connected to power planes are separated by a large vertical distance. An example of such a circuit is shown in Fig. 10. In this example, the circuit comprises stacked device layers, in which two layers in the integrated circuit contain thin film transistor (TFT) channels 33a, 33b. Stacked TFT devices 3a and 3b share a common gate terminal 34 in this example. The uppermost and lowermost device terminal layers (source-drain for the respective devices) are connected to power planes Vdd and Gnd, respectively. To increase the capacitance between the Vdd plane and the Gnd plane, a metal plane 22 is inserted between them and then connected to one or other of those planes. In this example, the inserted layer 22 is conveniently formed in the gate metal layer and is connected to the Vdd layer. The inserted layer is more closely coupled to the Gnd layer than it would be in the Vdd layer, so the capacitance between them is increased. The same principles could be applied to other stepped gate structures, for example those employing two gate terminal layers, and those having bottom gate thin film transistors.
[0050] In more detail, the example shown in Fig. 10 comprises a first FET 3a having a first terminal 31a, a second terminal 32a, a common gate terminal 34, a semiconductive channel 33a provided by a portion of a semiconductor layer 5a formed on a substrate 6, and a gate dielectric 35a provided by a first portion 41a of a first layer of dielectric material 4a. In the same plane as the first and second terminals 31a, 32a there is provided a first rail portion 11, directly connected to the first terminal 31a in this example. The inserted layer provides the second rail portion 22, separated from the first rail portion 11 by the second portion 42a of dielectric material, and the second rail portion 22 is in the same plane as the common gate terminal 34. A second layer of dielectric material 4b is formed over the common gate 34 and second rail portion 22, and on top of that second dielectric layer 4b are formed the first terminal 31b and second terminal 32b of the second FET 3b (which is stacked above the first). A first via 71 connects the respective second terminals 32a and 32b, passing through the dielectric layers 4a and 4b. A second via 72 connects the first terminal 31b of the second FET 3h to the second rail portion 22, extending through the second dielectric layer 4b. A first portion 41b of the second dielectric layer 4b provides the gate dielectric 35b of the second FET 3b. Thus, in this compact arrangement, the gate terminal 34 simultaneously controls the conductivity of the channels 33a and 33b in the two FETs, and the conductive material 22 formed in the same plane as the common gate 34 provides capacitance to the circuit, in combination with second portion 42a of dielectric material and first rail portion 11.
[0051] Referring now to Fig. 11, this shows part of another electric circuit embodying the invention and also comprising stacked FETs. This example is similar to that shown in Fig. 10, but here semiconductor material is provided just between the respective first and second terminals of each device 3a, 3b. This circuit may additionally comprise one or more further device layers, indicated generally by 800.
[0052] Referring now to Fig. 12, this illustrates a method of manufacturing an electronic circuit in accordance with an embodiment of the invention. In step A, a suitable substrate 6 is first provided. In step B a layer of semiconductor material 5 is formed on the substrate 6. It will be appreciated, however, that in alternative embodiments a layer of semiconductor material 5 may be formed at a different step in the sequence, depending on the desired FET structure. Illustrative examples of FET structures that may be manufactured in a circuit by this method are shown in Figures 2 to 11. In step C, the first and second FET terminals 31, 32 are formed at the same time (i.e. in a common processing step or operation) as at least a first rail portion 11 of a first power rail 1. Thus, terminals 31 and 32 and first rail portion 11 may be provided by conductive material suitably formed in a pattern on an upper surface of the semiconductor layer 5. In step D, a layer of dielectric material 4 is formed, comprising at least a first portion 41 and a second portion 42. In this example, the dielectric layer is formed over the first and second terminals and first rail portion 11, but in alternative embodiments the dielectric layer may be formed before the first and second terminals and first rail portion, for example over a bottom gate and second rail portion. In step E in this example, a gate terminal 34 and at least a second rail portion 22 of a second power rail 2 are formed at the same time (again, in a common processing step or operation) on an upper surface of the dielectric layer 4, suitably positioned so that the gate terminal 34 may be used to control a conductivity of the channel 33 in the semiconductor layer 5 between the first and second FET terminal 31, 32.
However, in alternative embodiments (for example incorporating bottom gate FETS), the gate 34 and second rail portion may be formed before the dielectric layer 4, e.g. on a substrate. The second power rail is suitably positioned so that a second rail portion 22 is located over the first rail portion 11 of the first power rail 1, with a second portion 42 of the dielectric layer 4 sandwiched between them so as to provide a capacitor. A first portion 41 of the dielectric layer 4 provides the gate dielectric 35 of the FET 3. In step F, additional device layers 80 and 81 have been formed over the underlying structure. It will be appreciated that advantages provided by this method of manufacture are that: The first and second FET terminals and the first rail portion are formed together, at the same time, in a common processing step or operation; The gate dielectric 35 and power rail capacitance dielectric (41 and 42) are formed together, at the same time, in a common processing step or operation, and they are integral portions of a single layer 4 of dielectric material; and The gate terminal and second rail portion 22 are formed together, at the same time, in a common processing step or operation.
[0053] Thus, additional capacitance may be provided to the circuit without requiring additional processing steps, that is processing steps in addition to those required for producing just the FET.
[0054] Referring now to Fig. 13, this is a highly schematic representation of part of another electronic circuit embodying the invention. The electronic circuit 200 comprises antenna contacts 201, 202, adapted to be attached to an antenna arranged to receive a wireless signal (e.g. an RE signal). A portion of the footprint or area of the circuit 200 is taken up by the plates of a capacitor 103 connected between the circuit's power rails so as to provide smoothing to the supply voltage generated from the AC voltage received via the antenna terminals 201, 202. A further portion 203 of the entire circuit area contains circuitry and circuit elements, including one or more FETs. That area 203 also includes at least portions of first and second power rails, those portions including at least a first rail portion and a second rail portion which are separated by a layer of dielectric material and provide additional capacitance to the circuit, that is capacitance in addition to that provided by capacitor 103. In certain embodiments of the invention, the area of overlap of the first and second power rails (i.e. the area of the first and second rail portions 11, 22) is selected to provide, together with separate capacitor 103, a desired total capacitance between the power rails.
[0055] Fig. 14 illustrates On a schematic perspective view) a power mesh structure which may be incorporated in certain embodiments of the invention. In this example, an electronic circuit comprises a first power rail 1, a second power rail 2, and a layer or other body of dielectric material 4 (the location of that layer 4 is indicated generally in Fig. 14, but the layer of dielectric material is not directly illustrated, so that the overlapping nature of the power rails 1 and 2 can be seen more clearly). The first power rail comprises a first rail portion 11 arranged on a first side of the layer or other body of dielectric material 4, and the second power rail comprises a second rail portion 22 arranged on an opposite side of the layer or other body of dielectric material 4. The first rail portion 11 comprises a first grid or mesh of crossing and/or intersecting conductive elements 11a-11i, and the second rail portion 22 comprises a second grid or mesh of crossing and/or intersecting conductive elements 22a-22i. The first and second grids or meshes have substantially the same shape (or, in other words, they have substantially the same footprint or projection onto a plane parallel to them). The first and second grids or meshes are aligned with one another so as to form, together with a portion of the layer or other body of dielectric material 4 sandwiched between them, a capacitor.
[0056] Thus, in embodiments employing power rails such as those shown in Fig. 14, the power rail capacitance is, at least in significant part, distributed in a power mesh structure that may place the Vdd and Gnd lines in different metal layers, and then routes them directly on top of each other within a circuit layout. Circuit elements, for example components, devices, and cells, in certain embodiments are placed in the areas between the overlapping conductive elements of the grids, and are connected to those conductive elements as appropriate for a given circuit design.
[0057] The coincident/overlapping grid or mesh structure shown in Fig. 14 has a significant advantage in reducing circuit footprint, since the area for Vdd and Gnd is shared, and directly reduces the amount of integrated circuit area that needs to be consumed by a dedicated capacitor. Indeed, in certain embodiments, utilising the overlapping/coincident mesh structure of Fig. 14 enables the dedicated capacitor area to be made smaller, and in further embodiments the separate or dedicated capacitor may not be required at all, if the power rail capacitance may be provided solely by the overlapping/coincident first and second rail portions 11, 22.
[0058] Furthermore, in electronic circuits incorporating the power rail grid/mesh structure shown in Fig. 14, layout and routing may be simplified since all cells may share the same orientation. Example approaches to layout are illustrated in Figs. 14b, 14c, 14d and 14e which show an offset plan view and a cross section for each approach. In these figures the upper grid and lower grid are separated by a layer of dielectric material, which for purposes of clarity is not shown. In Fig. 14b, connections from each power grid to circuit cells or devices may project from the grid on different sides of each window between cross members. In the specific example of Fig. 14b power rail connections from the upper grid project from the top side of the grid window, whilst power rail connections from the lower grid project from the bottom side of the window. Alternatively, as shown in Fig. 14c, connections from each power grid to circuit cells or devices may project from the grid on the same side of each window between cross members. In the specific example of Fig. 14c power rail connections from both upper and lower grids project from the top side of the grid window. In further examples, connections from any one grid may be made from more than one side of a window. In both approaches of Figs. 14b and 14c, both power rails are coupled into the devices, circuits or cells in the lower grid. It may be more appropriate in some cases to couple the power rails into devices, circuits or cells in the upper grid, as illustrated in Figs. 14d and 14e. In Fig. 14d, power rail connections from the upper grid project from the top side of the grid window, whilst power rail connections from the lower grid project from the bottom side of the window. Fig. 14e shows connections from each power grid to circuit cells or devices projecting from the grid on the same side of each window between cross members. In further examples, connections from any one grid may be made from more than one side of a window. The specifics of the layout may reflect the requirements of the design and application. Electronic circuits incorporating the power rail grid/mesh structure shown in Figs. 14 to 14e may also add an advantage in increasing the capacitance between these power rails locally to the cells of the circuit, which improves switching noise reduction. In other words, circuit elements may have overlapping/coincident first and second rail portions 11, 12 close to them, rather than capacitance provided remotely.
[0059] In certain embodiments, high capacitance is provided between the power rails by routing one rail in the FET (e.g. TFT) source-drain layer and the other power rail (or line) in the FET gate layer, with, for example, an aluminium oxide high-k dielectric between them.
[0060] It will be appreciated that the capacitance C of a capacitor is given by the equation: C = eA/d (C = capacitance, e = dielectric permittivity constant, A = area of parallel plates, and d = separation of parallel plates). Thus, a higher capacitance is provided by using a dielectric of higher permittivity constant, a larger plate area, and smaller plate separation.
[0061] Embodiments of the present invention, by increasing capacitance between the power rails and optionally providing that additional capacitance in a distributed form, have multiple positive effects, including: the circuit is more robust to ESD events input noise along the power rails is reduced resistance to internal dynamic IR drops is improved, and noise cross-talk between the gates is reduced.
[0062] Referring now to Fig. 15, this illustrates a cross section of part of another electronic circuit embodying the invention. Here, the circuit comprises a capacitor C, arranged, for example, for smoothing purposes to smooth the supply voltage between the power rails, and formed from capacitor plates 1031 and 1032 separated by a portion 400 of a layer of dielectric material 4. The circuit further comprises a power rail structure comprising a plurality of first power rail portions 11a-11c and a plurality of second rail portions 22a-22c. Each of the second rail portions 22 is arranged above a respective corresponding first rail portion 11 to provide, together with a respective portion 42 of the dielectric layer sandwiched between them, a respective power rail capacitance Cp to the circuit. In certain embodiments, each of the first rail portions 11a-11c may be part of a mesh or grid of the first power rail, and each of the second rail portions 22a-22c may be part of a second power rail mesh or grid, for example such as those shown in Fig. 14. In certain embodiments, the dielectric layer 4 which provides the capacitor dielectrics, also provides the gate dielectric of one or more FETs in the electronic circuit. Thus, at least the power grid capacitance may share the same dielectric material as one or more active devices in the circuit. Thus, the total capacitance between the power rails in certain electronic circuits embodying the invention may be shared and distributed between a dedicated capacitor and the power rails, and the power rail capacitance may be distributed over an area in which one or more active devices are located.
[0063] Throughout the description and claims of this specification, the words "comprise" and "contain" and variations of them mean "including but not limited to", and they are not intended to (and do not) exclude other moieties, additives, components, integers or steps. Throughout the description and claims of this specification, the singular encompasses the plural unless the context otherwise requires. In particular, where the indefinite article is used, the specification is to be understood as contemplating plurality as well as singularity, unless the context requires otherwise.
[0064] Features, integers, characteristics, compounds, chemical moieties or groups described in conjunction with a particular aspect, embodiment or example of the invention are to be understood to be applicable to any other aspect, embodiment or example described herein unless incompatible therewith. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and/or all of the steps of any method or process so disclosed, may be combined in any combination, except combinations where at least some of such features and/or steps are mutually exclusive. The invention is not restricted to the details of any foregoing embodiments.
The invention extends to any novel one, or any novel combination, of the features disclosed in this specification (including any accompanying claims, abstract and drawings), or to any novel one, or any novel combination, of the steps of any method or process so disclosed.
[0065] The reader's attention is directed to all papers and documents which are filed concurrently with or previous to this specification in connection with this application and which are open to public inspection with this specification, and the contents of all such papers and documents are incorporated herein by reference.
[0066] It will also be appreciated that certain aspects and embodiments of the present invention provide subject matter as defined by the following numbered paragraphs: Paragraph 1. An electronic circuit (100) comprising: a first power rail (1); a second power rail (2); and
a field effect transistor (3), FET, comprising:
a first terminal (31) coupled directly or indirectly to the first power rail; a second terminal (32) coupled directly or indirectly to the second power rail; a channel (33) of semiconducfive material connecting the first terminal to the second terminal; a gate terminal (34) to which a voltage may be applied to control a conductivity of said channel, said channel providing a conduction path from the first terminal to the second terminal; and a gate dielectric (35) arranged to insulate the gate terminal from said channel, characterised in that said circuit comprises a layer or other body of dielectric material (4), said gate dielectric (35) being a first portion (41) of said layer or other body of dielectric material, and in that the first power rail comprises a first rail portion (11) arranged on a first side (421) of a second portion (42) of the layer or other body of dielectric material, and the second power rail comprises a second rail portion (22) arranged on a second side (422) of the second portion (42) of the layer or other body of dielectric material, said second side being opposite said first side, whereby said second portion (42) of the layer or other body of dielectric material separates said first and second rail portions (11, 22) and with said first and second rail portions provides a capacitance to said circuit (or, in other words, forms a capacitor).
Paragraph 2. A circuit in accordance with Paragraph 1, wherein said layer or other body of dielectric material (4) is a layer.
Paragraph 3. A circuit in accordance with Paragraph 2, wherein said layer has a thickness in the range mm to 500nm, for example 5nm to 50nm.
Paragraph 4. A circuit in accordance with any preceding Paragraph, wherein said dielectric material has a dielectric constant greater than 3.9, for example greater than 4, 5, 6, 7, 12, 01 19.
Paragraph 5. A circuit in accordance with any preceding Paragraph, wherein said FET is a thin film transistor.
Paragraph 6. A circuit in accordance with any preceding Paragraph, wherein said first and second terminals (31, 32) and said first rail portion (11) are each substantially flat and coplanar with one another.
Paragraph 7. A circuit in accordance with Paragraph 6, wherein said first terminal (31) is directly connected to said first rail portion.
Paragraph 8. A circuit in accordance with Paragraph 7, wherein said first terminal (31) and said first rail portion (11) are respective portions of a flat layer or other body of conductive material.
Paragraph 9. A circuit in accordance with any preceding Paragraph, wherein said gate terminal (34) and said second rail portion (22) are each substantially flat and coplanar with one another.
Paragraph 10. A circuit in accordance with any preceding Paragraph, wherein said first rail portion (11) is in direct contact with said first side (421).
Paragraph 11. A circuit in accordance with any preceding Paragraph, wherein said second rail portion (22) is in direct contact with said second side (422).
Paragraph 12. A circuit in accordance with any preceding Paragraph, further comprising an antenna (101) arranged to receive a wireless signal, rectifying means (102) connected to the antenna and to the first and second power rails and arranged to generate a DC voltage between (across) said first and second power rails from a received wireless signal.
Paragraph 13. A circuit in accordance with Paragraph 12, further comprising a capacitor (103) connected between said first and second power rails to smooth said DC voltage.
Paragraph 14. A circuit in accordance with any preceding Paragraph, wherein the circuit comprises a layer of semiconductive material (5), said first and second terminals (31, 32) and said first rail portion (11) are formed on a first surface of the layer of semiconductive material, said channel (33) being provided by a portion of the layer of semiconductive material (5), said layer or other body of dielectric material (4) is formed over the first and second terminals and said first rail portion, and said gate terminal (34) and second rail portion (22) are formed on a first surface of the layer or other body of dielectric material.
Paragraph 15. A circuit in accordance with Paragraph 14, further comprising a substrate (6) under the layer of semiconductive material (5).
Paragraph 16. A circuit in accordance with any one of Paragraphs 1 to 13, further comprising a substrate (6) and a layer of semiconductive material (5), wherein said first and second terminals (31, 32) and said first rail portion (11) are formed on a first surface of the substrate, said layer of semiconductive material (5) is formed over the first and second terminals and said first rail portion, said layer or other body of dielectric material (4) is formed over the layer of semiconductive material, and said gate terminal (34) and second rail portion (22) are formed on a first surface of the layer or other body of dielectric material (4).
Paragraph 17. A circuit in accordance with any one of Paragraphs 1 to 13, further comprising a substrate (6) and a layer of semiconductive material (5), wherein said first and second terminals (31, 32) and said first rail portion (11) are formed on a first surface of the substrate, said layer of semiconductive material (5) is formed at least between the first and second terminals to provide said channel (33), said layer or other body of dielectric material (4) is formed over the layer of semiconductive material and the first and second terminals and the first rail portion, and said gate terminal (34) and second rail portion (22) are formed on a first surface of the layer or other body of dielectric material (4).
Paragraph 18. A circuit in accordance with any one of Paragraphs 1 to 13, further comprising a substrate (6) and a layer of semiconductive material (5) , wherein said gate terminal (34) and said second rail portion (22) are formed on a first surface of the substrate, said layer or other body of dielectric material (4) of is formed over the gate terminal and said second rail portion, said first and second terminals (31, 32) and said first rail portion (11) are formed over the layer or other body of dielectric material, and said layer of semiconductive material (5) is formed at least between the first and second terminals to provide said channel.
Paragraph 19. A circuit in accordance with any one of Paragraphs 1 to 13, further comprising a substrate (6) and a layer of semiconductive material (5), wherein said gate terminal (34) and said second rail portion (22) are formed on a first surface of the substrate, said layer or other body of dielectric material (4) is formed over the gate terminal and said second rail portion, said layer of semiconductive material (5) is formed over at least a portion of the layer or body of dielectric material (4) covering the gate terminal, and said first and second terminals (31, 32) and said first rail portion (11) are formed over the layer of semiconductive material and the layer or other body of dielectric material.
Paragraph 20. An electronic circuit comprising: a first power rail (1); a second power rail (2); and a layer or other body of dielectric material (4), wherein the first power rail comprises a first rail portion (11) arranged on a first side of the layer or other body of dielectric material (4), and the second power rail comprises a second rail portion (22) arranged on a second side of the layer or other body of dielectric material, said second side being opposite said first side, said first rail portion comprising a first grid or mesh of crossing and intersecting conductive elements (11a-11i) and said second rail portion comprising a second grid or mesh of crossing and intersecting conductive elements (22a-22i), said first and second grids or meshes having substantially the same shape and being aligned with one another, on said opposite first and second sides, so as to form, together with a portion (42) of the layer or other body of dielectric material sandwiched between them, a capacitor.
Paragraph 21. An electronic circuit in accordance with Paragraph 20, and further comprising a field effect transistor (3) comprising: a first terminal (31) coupled directly or indirectly to the first power rail; a second terminal (32) coupled directly or indirectly to the second power rail; a channel of semiconductive material (33) connecting the first terminal to the second terminal; a gate terminal (34) to which a voltage may be applied to control a conductivity of said channel, said channel providing a conduction path from the first terminal to the second terminal; and a gate dielectric (35) arranged to insulate the gate terminal from said channel, wherein said gate dielectric comprises a portion (41) of said layer or other body of dielectric material (4).
Paragraph 22. An electronic circuit in accordance with Paragraph 20 or Paragraph 21, comprising a further capacitor (103) connected between said power rails, said further capacitor comprising a first capacitor plate (1031), connected to the first power rail (1), and arranged on said first side, a second capacitor plate (1032), connected to the second power rail, and arranged on said second side, and a further portion (400) of said layer or other body of dielectric material, said further portion being a portion located between said first and second capacitor plates.
Paragraph 23. A circuit in accordance with any one of Paragraphs 20 to 22, further comprising an antenna (101) arranged to receive a wireless signal, rectifying means (102) connected to the antenna and to the first and second power rails (1,2) and arranged to generate a DC voltage between (across) said first and second power rails from a received wireless signal.
Paragraph 24. A method of manufacturing an electronic circuit comprising a first power rail (1), a second power rail (2), and a field effect transistor (3), FET, comprising a first terminal (31) coupled directly or indirectly to the first power rail, a second terminal (32) coupled directly or indirectly to the second power rail, a channel (33) of semiconducfive material connecting the first terminal to the second terminal, a gate terminal (34) to which a voltage may be applied to control a conductivity of said channel, said channel providing a conduction path from the first terminal to the second terminal; and a gate dielectric (35) arranged to insulate the gate terminal from said channel, the method comprising: forming a layer or other body of dielectric material comprising a first portion and a second portion; forming the first and second terminals and a first rail portion of the first power rail at the same time on a first side of the layer or other body of dielectric material; forming the gate terminal and a second rail portion of the second power rail at the same time on a second side of the layer or other body of dielectric material, wherein said first and second rail portions are positioned on opposite sides of said second portion so as to form, together with said second portion, a capacitor, and wherein said gate terminal and first and second terminals are positioned such that said first portion provides said gate dielectric.
Paragraph 25. A method in accordance with Paragraph 24, wherein: said forming of the first and second terminals and first rail portion is performed before forming said layer or other body of dielectric material, and said forming of the gate terminal and second rail portion is performed after forming said layer or other body of dielectric material; or said forming of the first and second terminals and first rail portion is performed after forming said layer or other body of dielectric material, and said forming of the gate terminal and second rail portion is performed before forming said layer or other body of dielectric material.

Claims (11)

  1. Claims 1. An electronic circuit comprising: a first power rail (1); a second power rail (2), and a layer or other body of dielectric material (4), wherein the first power rail comprises a first power rail portion (11) arranged on a first side of the layer or other body of dielectric material (4), and the second power rail comprises a second power rail portion (22) arranged on a second side of the layer or other body of dielectric material, said second side being opposite said first side, said first power rail portion and said second power rail portion being aligned with one another, on said opposite first and second sides, to provide, together with a respective portion (42) of the dielectric layer sandwiched between them, a capacitance (Cp) to the circuit.
  2. 2. An electronic circuit in accordance with claim 1, wherein said first power rail comprises a plurality of first power rail portions (11a, 11b, 11c) arranged on said first side, said first power rail portion being one of said plurality of first power rail portions, said second power rail comprises a plurality of second power rail portions (22a, 22b, 22c) arranged on said second side, said second power rail portion being one of said plurality of second power rail portions, each of said plurality of first power rail portions being aligned with a respective one of said plurality of second power rail portions to provide, together with a respective portion (42a, 42b, 42c) of the dielectric layer sandwiched between them, a respective capacitance (Cpa, Cpb, Cpc) to the circuit.
  3. 3. An electronic circuit in accordance with claim 1 or claim 2, wherein said first power rail comprises a first mesh or grid of conductive elements, said second power rail comprises a second mesh or grid of conductive elements, each first power rail portion being a part of the first mesh or grid, and each second power rail portion being a part of the second mesh or grid.
  4. 4. An electronic circuit in accordance with claim 3, wherein said first grid or mesh of conductive elements comprises crossing and/or intersecting conductive elements (11a- 11i), said second grid or mesh of conducting elements comprises crossing and/or intersecting conductive elements (22a-22i), and said first and second grids or meshes have substantially the same shape and are aligned with one another, on said opposite first and second sides, so as to form, together with a portion (42) of the layer or other body of dielectric material sandwiched between them, a capacitor.
  5. 5. A circuit in accordance with any preceding claim, wherein the or each first rail portion (11, 11a, 11b, 11c) is in direct contact with said first side (421).
  6. 6. A circuit in accordance with any preceding claim, wherein the or each second rail portion (22, 22a, 22b, 22c) is in direct contact with said second side (422).
  7. 7. An electronic circuit in accordance with any preceding claim, comprising a further capacitor (103) connected between said power rails, said further capacitor comprising a first capacitor plate (1031), connected to the first power rail (1), and arranged on said first side, a second capacitor plate (1032), connected to the second power rail, and arranged on said second side, and a further portion (400) of said layer or other body of dielectric material, said further portion being a portion located between said first and second capacitor plates.
  8. 8. A circuit in accordance with any preceding paragraph, further comprising an antenna (101) arranged to receive a wireless signal, rectifying means (102) connected to the antenna and to the first and second power rails (1,2) and arranged to generate a DC voltage between (across) said first and second power rails from a received wireless signal.
  9. 9. A circuit in accordance with any preceding claim, wherein the first power rail further comprises a first power rail connection projecting, on said first side, from one of said first power rail portions, the circuit further comprising a via connecting the first power rail connection, through the layer or other body of dielectric material (4) to a region of conductive material arranged on said second side.
  10. 10. A circuit in accordance with any preceding claim, wherein the second power rail further comprises a second power rail connection projecting, on said second side, from one of said second power rail portions, the circuit further comprising a via connecting the second power rail connection, through the layer or other body of dielectric material (4) to a region of conductive material arranged on said first side.
  11. 11. An electronic circuit in accordance with any preceding claim, and further comprisinga field effect transistor (3) comprising:a first terminal (31) coupled to the first power rail; a second terminal (32) coupled to the second power rail; a channel of semiconductive material (33) connecting the first terminal to the second terminal; a gate terminal (34) to which a voltage may be applied to control a conductivity of said channel, said channel providing a conduction path from the first terminal to the second terminal; and a gate dielectric (35) arranged to insulate the gate terminal from said channel, wherein said gate dielectric comprises a portion (41) of said layer or other body of dielectric material (4).
GB2218594.6A 2018-09-10 2018-09-10 Electronic circuit and method of manufacture Withdrawn GB2611444A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0394878A2 (en) * 1989-04-26 1990-10-31 Kabushiki Kaisha Toshiba Semiconductor device having multi-layered wiring structure
US5202751A (en) * 1984-03-30 1993-04-13 Kabushiki Kaisha Toshiba Semiconductor integrated circuit
US6173899B1 (en) * 1998-04-03 2001-01-16 Alexander Rozin Method and system for contactless energy transmission and data exchange between a terminal and IC card
US6465868B1 (en) * 1998-12-16 2002-10-15 Infineon Technologies Ag Integrated circuit having capacitive elements
US20040092124A1 (en) * 1999-04-30 2004-05-13 Kazuhisa Suzuki Method of manufacturing a semiconductor integrated circuit device having a plurality of wiring layers and mask-pattern generation method
US20110272782A1 (en) * 2010-05-06 2011-11-10 Taiwan Semiconductor Manufacturing Company, Ltd. Power layout for integrated circuits

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5202751A (en) * 1984-03-30 1993-04-13 Kabushiki Kaisha Toshiba Semiconductor integrated circuit
EP0394878A2 (en) * 1989-04-26 1990-10-31 Kabushiki Kaisha Toshiba Semiconductor device having multi-layered wiring structure
US6173899B1 (en) * 1998-04-03 2001-01-16 Alexander Rozin Method and system for contactless energy transmission and data exchange between a terminal and IC card
US6465868B1 (en) * 1998-12-16 2002-10-15 Infineon Technologies Ag Integrated circuit having capacitive elements
US20040092124A1 (en) * 1999-04-30 2004-05-13 Kazuhisa Suzuki Method of manufacturing a semiconductor integrated circuit device having a plurality of wiring layers and mask-pattern generation method
US20110272782A1 (en) * 2010-05-06 2011-11-10 Taiwan Semiconductor Manufacturing Company, Ltd. Power layout for integrated circuits

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