GB2596569A - Electromagnetic shielding device and method of manufacturing an electromagnetic shielding device - Google Patents
Electromagnetic shielding device and method of manufacturing an electromagnetic shielding device Download PDFInfo
- Publication number
- GB2596569A GB2596569A GB2010063.2A GB202010063A GB2596569A GB 2596569 A GB2596569 A GB 2596569A GB 202010063 A GB202010063 A GB 202010063A GB 2596569 A GB2596569 A GB 2596569A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal frame
- electronic component
- adhesive layer
- electromagnetic shielding
- metal foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The electromagnetic shielding device 10 comprises a PCB 12 (see figs 1, 2 also) with at least a component 18 fixed to the top surface of the PCB (14) , surrounded by a, preferably open, metal frame 20 having a bottom edge 24 also fixed to the top of the PCB. The frame forms a cavity 26 for receiving the component, the cavity sealed by a metal foil 28 with a conductive adhesive layer 30 to electrically and mechanically attach to the top side 22 of the metal frame. The frame is preferably taller (arrow 36) than the component, and the foils is preferably 0.015 mm thick (arrow 34) or less. Figure 3 shows how a cover sheet 32 may be provided to protect the foil prior to attaching the foil to the frame. (see also flowchart figure 5)
Description
Description
Electromagnetic shielding device and method of manufacturing an electromagnetic shielding device The present invention relates to an electromagnetic shielding device and to a method of manufacturing such device.
Nowadays, for most applications, it is necessary that electronic components mounted, for example, on a printed circuit board, are electromagnetically shielded.
Therefore, electromagnetic shielding devices applied to electronic circuits are frequently used. However, it turned out, that using such electromagnetic shielding devices is cost intensive, difficult to apply and, in case a failure occurs within the electronic component, a hassle to remove and re-apply.
The object of the present invention, therefore, is to provide an electromagnetic shielding device as well as a method of manufacturing such a device, that provides electromagnetic shield at a low cost.
According to a first aspect of the present invention, an electromagnetic shielding device is proposed. The electromagnetic shielding device comprises a printed circuit board including a top surface and a bottom surface, an electronic component affixed to the top surface, a metal frame having a top side and a bottom side, the bottom side being affixed to the top surface, the metal frame surrounding the electronic component such that a cavity for receiving the electronic component is formed. The electromagnetic shielding device further includes a metal foil with a conductive adhesive layer, wherein the metal foil is arranged on the metal frame and conforms to the metal frame and wherein the conductive adhesive layer is adhered to the top side of the metal frame and closes the cavity.
The present invention is at least partially based on the idea that by using a metal foil with a conductive adhesive layer, a fully functional electromagnetic shielding device can be provided which allows easy removal of the metal foil in case of a failure, as well as an easy re-appliance of the metal foil. Also, by using a metal foil, variations in the height of the metal frame can be compensated due to the inherent flexibility of the metal foil. This reduces the cost for manufacturing the electromagnetic shielding device as well as the costs for inspection of the electronic component(s) in case of an error or failure.
According to a preferred embodiment of the electromagnetic shielding device, the metal foil has a thickness equal to or smaller than 0.015 mm. With such a thickness, the metal foil has the full flexibility which is necessary and expected from a foil, but still provides enough electromagnetic shielding for the electronic components affixed to the printed circuit board underneath the foil.
According to another preferred embodiment, a height of the metal frame is larger than a height of the electronic component. This ensures that the metal foil is not in contact with the electronic component placed underneath the foil. This avoids, on the one hand, a short circuit which may result due to a contact of the electronic component with the metal foil, and, on the other hand, reduces a heat transfer from the electronic component to the metal foil which would otherwise damage the metal foil and, in particular, the conductive adhesive layer.
According to a second aspect of the present invention, a method of manufacturing an electronic shielding device is proposed. The method comprises the steps of providing a printed circuit board with a top surface and a bottom surface, providing an electronic component, providing a metal frame with a cavity configured to receive the electronic component, arranging the metal frame such that the electronic component is received within the cavity, affixing a bottom side of the metal frame and the electronic component to the top surface of the printed circuit board, providing a metal foil with a conductive adhesive layer, arranging the metal foil on the metal frame, and adhering the conductive adhesive layer to the top side of the metal frame such that the cavity of the metal frame is closed by the metal foil.
The proposed method provides an easy and cost-effective way of producing an electromagnetic shielding device with a housing for the electronic component which basically comprises two components: one is the metal frame which surrounds the electronic component and receives the electronic component within its cavity, and the other component is the metal foil which closes the cavity from on top and provides the conductive connection to the metal frame using the conductive adhesive layer.
With such a method, it is also easy to inspect the electronic component placed underneath the metal foil. For this, for example, the metal foil is peeled off from the metal frame and, once the error or failure is corrected, is re-applied to the metal 10 frame.
According to a preferred embodiment of the method, the conductive adhesive layer is covered by a cover sheet and the method further includes the step of peeling off the cover sheet, before adhering the conductive adhesive layer to the top side of the metal frame. The cover sheet is a way of ensuring the integrity of the conductive adhesive layer and makes handling of the adhesive metal foil much easier.
As a further preferred embodiment of the method, the step of adhering the conductive adhesive layer to the top side of the metal frame includes the step of pressing the metal foil with the conductive adhesive layer onto the top side of the metal frame by applying a predetermined force to the metal foil for a predetermined period of time. This step can be easily applied during manufacturing. For example, a pressing device conforming to the metal foil and placed on top of the metal foil can be used to press the metal foil and therewith the conductive adhesive layer onto the top side of the metal frame. This ensures reliable and reproducible conductive connection between the metal foil and the metal frame which is necessary for a functional electromagnetic shielding device.
Exemplary embodiments of the invention are described by the accompanying drawings, which are incorporated herein and constitute a part of the specification. In the drawings: FIG 1 is a schematic view showing an electromagnetic shielding device according to the present invention, wherein the electromagnetic shielding device includes a metal frame surrounding electronic components to be shielded by the device, FIG 2 is a schematic view showing the electromagnetic shielding device of FIG 1, wherein a metal foil of the electromagnetic shielding device is arranged on top of the metal frame to cover the electronic component, FIG 3 shows a detailed view of the electromagnetic shielding device of FIG 2, wherein a cover sheet can be peeled off from the metal foil to uncover a conductive adhesive layer of the metal foil, FIG 4 shows a schematic cross-sectional view of the electromagnetic shielding device of FIG 2 along line A-A, and FIG 5 shows an example of a procedure for manufacturing an electromagnetic shielding device according to the present invention.
Within this disclosure, the same reference numbers refer to the same components.
Referring now to FIG 1, an electromagnetic shielding device 10 according to an embodiment of the present invention is shown. Electromagnetic shielding device 10 includes a printed circuit board (PCB) 12 having a top surface 14 and a bottom surface 16. Electromagnetic shielding device 10 further includes one or more electronic components 18 which are connected to top surface 14 of PCB 12 using connection means known to a person skilled in the art. Electronic component(s) 18 can be any type and any kind of electronic component(s) known to a person skilled in the art which needs electromagnetic shielding.
Electromagnetic shielding device 10 further includes a metal frame 20 having a top side 22 and a bottom side 24. Bottom side 24 is affixed to top surface 14 of PCB 12, for example, using soldering or other connection means known to a person skilled in the art. Metal frame 20 surrounds electronic component(s) 18. In the embodiment shown in FIG 1, metal frame 20 is a rectangular metal frame. In other embodiments not shown, metal frame 20 can have other shapes. Metal frame 20 includes a cavity 26 for receiving electronic component(s) 18. Cavity 26 is configured to accommodate electronic component(s) 18. Metal frame 20 and top side 14 of PCB 12 define a space for electronic component(s) 18 which is open to the outside only from on top by cavity 26.
Referring now to FIG 2, it is explained, how cavity 26 is closed by electromagnetic shielding device 10.
As can be seen in FIG 2, electromagnetic shielding device 10 further includes a metal foil 28 being arranged on metal frame 20 and conforming to metal frame 20 for closing cavity 26. Metal foil 28 is connected to top side 22 of metal frame 20. As will be explained further in connection with FIG 3, this connection between metal foil 28 and top side 22 of metal frame 20 is done by a conductive adhesive layer of metal foil 28. This conductive adhesive layer ensures a conductive connection between metal foil 28 and metal frame 20, thereby providing sufficient and reliable electromagnetic shielding to electronic component(s) 18.
Referring now to FIG 3, a schematic detailed view of electromagnetic shielding device 10 is shown. For clarity, PCB 12 and electronic component(s) 18 are not shown in FIG 3.
As already mentioned in connection with FIG 2, metal foil 28 includes a conductive adhesive layer 30. Conductive adhesive layer 30 adheres to top side 22 of metal frame 20. In order to not be able to manipulate conductive adhesive layer 30 and in order to ensure integrity of conductive adhesive layer 30 during manufacturing of electromagnetic shielding device 10, metal foil 28 includes a cover sheet 32 which covers conductive adhesive layer 30. When metal foil 28 needs to be applied to top side 22 of metal frame 20, cover sheet 32 is peeled off to uncover conductive adhesive layer 30. Once cover sheet 32 is peeled off, metal foil 28 can be applied to top side 22 of metal frame 20, for example, by pressing metal foil 28 onto top side 22 using a predetermined force over a predetermined period of time. This ensures that conductive adhesive layer 30 is properly and durably adhered to top side 22.
Referring now to FIG 4, a schematic cross-sectional view along the line A-A of FIG 2 is shown. As can be seen, metal frame 20 surrounds electronic component(s) 18 and forms a cavity 26 for receiving electronic component(s) 18. Bottom side 24 of metal frame 20 is affixed to top surface 14 of PCB 12. Metal foil 28 is arranged on top of metal frame 24. Conductive adhesive layer 30 adheres to top side 22 of metal frame 20 so that cavity 26 is closed by metal foil 28. Conductive adhesive layer 30 ensures a conductive connection between metal foil 28 and metal frame 20. Metal foil 28 can be, for example, a copper foil, an aluminum foil or another appropriate metallic foil. A thickness 34 of metal foil 28 is equal to or smaller than 0.015 mm to ensure a full flexibility of metal foil 28 at a given electromagnetic shielding property. In addition, a height 36 of metal frame 20 is larger than a height 38 of electronic component 18 to ensure no contact between electronic component 18 and metal foil 28. This is necessary to avoid heat transfer from electronic component 18 to metal foil 28 during operation, as well as short-circuits.
Referring now to FIG 5, an exemplary procedure for producing or manufacturing electromagnetic shielding device 10 is shown.
The procedure starts with step 500. At step 502, a PCB such as PCB 12 is provided. At step 504, an electronic component such as electronic component 18 is provided. At step 506, a metal frame with a cavity for receiving the electronic component is provided. Such a metal frame can be, for example, metal frame 20 which is arranged to surround electronic component 18, as can be seen in FIG 1.
As a next step, in step 508, the metal frame is arranged such that the electronic component is received within the cavity. That is metal frame 20 is arranged such that electronic component 18 is received within cavity 26. Then, at step 510, a bottom side of the metal frame and the electronic component are affixed to the PCB. That is bottom side 24 of metal frame 20 and electronic component 18 are affixed to top surface 14 of PCB 12. Affixing of bottom side 24 and electronic component 18 to top surface 14 can occur simultaneously or in sequence. Affixing may be performed by methods known to a person skilled in the art, for example, by an SMT-process, wherein SMT means surface-mount technology, as is known to a person skilled in the art.
Next, in step 514, the metal foil is arranged on the metal frame. That is metal foil 28 is arranged on metal frame 20. Metal foil 28 is arranged to basically conform to metal frame 20 to be able to close cavity 26.
As metal foil 28 includes conductive adhesive layer 30, conductive adhesive layer 30 needs to be uncovered. Thus, in step 516, cover sheet 32 is peeled off, thereby uncovering conductive adhesive layer 30.
In step 518, the conductive adhesive layer is adhered to the top side of the metal frame, thereby closing the cavity. That is conductive adhesive layer 30 is adhered to top side 22 of metal frame 20 such that cavity 26 is closed by metal foil 28. Step 518 includes, for example, step 520, wherein conductive adhesive layer 30 is pressed onto top side 22 of metal frame 20 using a predefined force for a predefined period of time.
The procedure ends with step 522.
The electromagnetic shielding device 10 of FIGs 1 to 4, as well as the procedure of FIG 5 for manufacturing such a device, ensure a reliable, durable and reproducible way for providing electromagnetic shielding for electronic components. In particular, when there is a failure or error occurring in the circuitry or electronic component 18, metal foil 28 can be easily peeled off from metal frame 20, electronic component 18 and/or the circuitry can then be inspected, the error or failure can be remedied, and metal foil 28 can be re-applied to metal frame 20.
Claims (6)
- Patent claims 1. An electromagnetic shielding device (10), comprising: - a printed circuit board (12) including a top surface (14) and a bottom surface (16), - an electronic component (18) affixed to the top surface (14), a metal frame (20) having a top side (22) and a bottom side (24), the bottom side (24) being affixed to the top surface (14), the metal frame (20) surrounding the electronic component (18) such that a cavity (26) for receiving the electronic component (18) is formed, and - a metal foil (28) with a conductive adhesive layer (30), the metal foil (28) being arranged on the metal frame (20) and conforming to the metal frame (20) and the conductive adhesive layer (30) being adhered to the top side (22) of the metal frame (20) closing the cavity (26).
- 2. The electromagnetic shielding device (10) of claim 1, wherein the metal foil (28) has a thickness equal to or smaller than 0.015mm.
- 3. The electromagnetic shielding device (10) of any one of claims 1 and 2, wherein a height (36) of the metal frame is larger than a height (38) of the electronic component (18).
- 4. A method of manufacturing an electromagnetic shielding device (10), comprising the steps of: -providing a printed circuit board (12) with a top surface (14) and a bottom surface (16), - providing an electronic component (18), - providing a metal frame (20) with a cavity (26) configured to receive the electronic component (18), -arranging the metal frame (20) such that the electronic component (18) is received in the cavity (26), - affixing a bottom side (24) of the metal frame (20) and the electronic component (18) to the top surface (14) of the printed circuit board (12), - providing a metal foil (28) with a conductive adhesive layer (30), - arranging the metal foil (28) on the metal frame (20), and - adhering the conductive adhesive layer (30) to the top side (22) of the metal frame (20) such that the cavity (26) is closed by the metal foil (28).
- 5. The method of claim 4, wherein the conductive adhesive layer (30) is covered by a cover sheet (32) and the method further includes the step of: - peeling off the cover sheet (32), before adhering the conductive adhesive layer (30) to the top side (22) of the metal frame (20). 10
- 6. The method of claims 4 or 5, wherein the step of adhering the conductive adhesive layer (30) to the top side (22) of the metal frame (20) includes the step of: - pressing the metal foil (28) with the conductive adhesive layer (30) onto the top side (22) of the metal frame (20) by applying a predetermined force to the metal foil (28) for a predetermined period of time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2010063.2A GB2596569A (en) | 2020-07-01 | 2020-07-01 | Electromagnetic shielding device and method of manufacturing an electromagnetic shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2010063.2A GB2596569A (en) | 2020-07-01 | 2020-07-01 | Electromagnetic shielding device and method of manufacturing an electromagnetic shielding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB202010063D0 GB202010063D0 (en) | 2020-08-12 |
| GB2596569A true GB2596569A (en) | 2022-01-05 |
Family
ID=71949592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2010063.2A Pending GB2596569A (en) | 2020-07-01 | 2020-07-01 | Electromagnetic shielding device and method of manufacturing an electromagnetic shielding device |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2596569A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6169666B1 (en) * | 1997-05-29 | 2001-01-02 | U.S. Philips Corporation | Electromagnetic shielding screen and circuit support having such a screen |
| US20120281386A1 (en) * | 2010-02-03 | 2012-11-08 | Joinset Co., Ltd. | Easily solderable shield case for electromagnetic wave shielding |
| US20130120957A1 (en) * | 2011-11-15 | 2013-05-16 | Apple Inc. | Rf shielding for electronic components |
| US20140071634A1 (en) * | 2012-09-07 | 2014-03-13 | David A. PAKULA | Electronic Device Subassemblies |
| US20160113161A1 (en) * | 2014-10-17 | 2016-04-21 | Laird Technologies, Inc. | Electromagnetic interference (emi) shields including see-through portions |
| US20170171961A1 (en) * | 2015-12-11 | 2017-06-15 | Laird Technologies, Inc. | Board level shields including foil and/or film covers |
| WO2017152562A1 (en) * | 2016-03-11 | 2017-09-14 | 深圳市信维通信股份有限公司 | Shielding case structure |
| US20170325366A1 (en) * | 2016-12-05 | 2017-11-09 | Shanghai Allied Industrial Co.,Ltd | Circuit shielding structure |
| WO2017209429A1 (en) * | 2016-05-30 | 2017-12-07 | 주식회사 아모그린텍 | Thin electromagnetic shielding sheet and electronic device provided with same |
-
2020
- 2020-07-01 GB GB2010063.2A patent/GB2596569A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6169666B1 (en) * | 1997-05-29 | 2001-01-02 | U.S. Philips Corporation | Electromagnetic shielding screen and circuit support having such a screen |
| US20120281386A1 (en) * | 2010-02-03 | 2012-11-08 | Joinset Co., Ltd. | Easily solderable shield case for electromagnetic wave shielding |
| US20130120957A1 (en) * | 2011-11-15 | 2013-05-16 | Apple Inc. | Rf shielding for electronic components |
| US20140071634A1 (en) * | 2012-09-07 | 2014-03-13 | David A. PAKULA | Electronic Device Subassemblies |
| US20160113161A1 (en) * | 2014-10-17 | 2016-04-21 | Laird Technologies, Inc. | Electromagnetic interference (emi) shields including see-through portions |
| US20170171961A1 (en) * | 2015-12-11 | 2017-06-15 | Laird Technologies, Inc. | Board level shields including foil and/or film covers |
| WO2017152562A1 (en) * | 2016-03-11 | 2017-09-14 | 深圳市信维通信股份有限公司 | Shielding case structure |
| WO2017209429A1 (en) * | 2016-05-30 | 2017-12-07 | 주식회사 아모그린텍 | Thin electromagnetic shielding sheet and electronic device provided with same |
| US20170325366A1 (en) * | 2016-12-05 | 2017-11-09 | Shanghai Allied Industrial Co.,Ltd | Circuit shielding structure |
Also Published As
| Publication number | Publication date |
|---|---|
| GB202010063D0 (en) | 2020-08-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) |
Free format text: REGISTERED BETWEEN 20230223 AND 20230301 |