GB2596062B - LED array - Google Patents

LED array Download PDF

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Publication number
GB2596062B
GB2596062B GB2008816.7A GB202008816A GB2596062B GB 2596062 B GB2596062 B GB 2596062B GB 202008816 A GB202008816 A GB 202008816A GB 2596062 B GB2596062 B GB 2596062B
Authority
GB
United Kingdom
Prior art keywords
led array
led
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB2008816.7A
Other versions
GB202008816D0 (en
GB2596062A (en
Inventor
Armitage David
Keogh Patrick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baldwin Technology Ltd
Baldwin Tech Ltd
Original Assignee
Baldwin Technology Ltd
Baldwin Tech Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baldwin Technology Ltd, Baldwin Tech Ltd filed Critical Baldwin Technology Ltd
Priority to GB2008816.7A priority Critical patent/GB2596062B/en
Publication of GB202008816D0 publication Critical patent/GB202008816D0/en
Priority to PCT/GB2021/051446 priority patent/WO2021250414A1/en
Publication of GB2596062A publication Critical patent/GB2596062A/en
Application granted granted Critical
Publication of GB2596062B publication Critical patent/GB2596062B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Led Device Packages (AREA)
GB2008816.7A 2020-06-10 2020-06-10 LED array Active GB2596062B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2008816.7A GB2596062B (en) 2020-06-10 2020-06-10 LED array
PCT/GB2021/051446 WO2021250414A1 (en) 2020-06-10 2021-06-10 Led array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2008816.7A GB2596062B (en) 2020-06-10 2020-06-10 LED array

Publications (3)

Publication Number Publication Date
GB202008816D0 GB202008816D0 (en) 2020-07-22
GB2596062A GB2596062A (en) 2021-12-22
GB2596062B true GB2596062B (en) 2023-01-18

Family

ID=71615987

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2008816.7A Active GB2596062B (en) 2020-06-10 2020-06-10 LED array

Country Status (2)

Country Link
GB (1) GB2596062B (en)
WO (1) WO2021250414A1 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2734020A1 (en) * 2012-11-19 2014-05-21 ABB Technology AG Cooling arrangement with a two-phase thermosyphon for cooling a multiplicity of electric devices
US20150233619A1 (en) * 2011-06-27 2015-08-20 Ebullient, Llc Method of providing stable pump operation in a two-phase cooling system
US20180288903A1 (en) * 2017-03-31 2018-10-04 International Business Machines Corporation Passive two-phase cooling with forced cooling assist
WO2019017297A1 (en) * 2017-07-18 2019-01-24 日本電気株式会社 Phase change refrigerating device and phase change refrigerating method
WO2019087195A1 (en) * 2017-11-06 2019-05-09 Zuta-Core Ltd. Systems and methods for heat exchange
CN110634816A (en) * 2019-09-17 2019-12-31 深圳市科太科技有限公司 Liquid cooling phase transition vector heat transfer heat dissipation system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009064986A (en) * 2007-09-06 2009-03-26 Panasonic Electric Works Co Ltd Light source device
EP2229555B1 (en) * 2008-01-14 2011-11-02 Osram AG Arrangement for cooling semiconductor light sources and floodlight having this arrangement
EP2577156A4 (en) * 2010-06-01 2014-07-02 Pressco Ip Llc Distributed cooling of arrayed semi-conductor radiation emitting devices
US20170254574A1 (en) * 2016-03-01 2017-09-07 Jay Eunjae Kim Direct Cooling Platform With Vapor Compression Refrigeration Cycle And Applications Thereof
EP3301999B1 (en) * 2016-09-30 2020-06-17 HP Scitex Ltd Light emitting diode heatsink

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150233619A1 (en) * 2011-06-27 2015-08-20 Ebullient, Llc Method of providing stable pump operation in a two-phase cooling system
EP2734020A1 (en) * 2012-11-19 2014-05-21 ABB Technology AG Cooling arrangement with a two-phase thermosyphon for cooling a multiplicity of electric devices
US20180288903A1 (en) * 2017-03-31 2018-10-04 International Business Machines Corporation Passive two-phase cooling with forced cooling assist
WO2019017297A1 (en) * 2017-07-18 2019-01-24 日本電気株式会社 Phase change refrigerating device and phase change refrigerating method
WO2019087195A1 (en) * 2017-11-06 2019-05-09 Zuta-Core Ltd. Systems and methods for heat exchange
CN110634816A (en) * 2019-09-17 2019-12-31 深圳市科太科技有限公司 Liquid cooling phase transition vector heat transfer heat dissipation system

Also Published As

Publication number Publication date
WO2021250414A1 (en) 2021-12-16
GB202008816D0 (en) 2020-07-22
GB2596062A (en) 2021-12-22

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