GB2588853B - Fully reticulated detectors for curved focal plane arrays - Google Patents
Fully reticulated detectors for curved focal plane arrays Download PDFInfo
- Publication number
- GB2588853B GB2588853B GB2015925.7A GB202015925A GB2588853B GB 2588853 B GB2588853 B GB 2588853B GB 202015925 A GB202015925 A GB 202015925A GB 2588853 B GB2588853 B GB 2588853B
- Authority
- GB
- United Kingdom
- Prior art keywords
- detectors
- focal plane
- plane arrays
- curved focal
- fully reticulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003491 array Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14665—Imagers using a photoconductor layer
- H01L27/14669—Infrared imagers
- H01L27/1467—Infrared imagers of the hybrid type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14694—The active layers comprising only AIIIBV compounds, e.g. GaAs, InP
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962923189P | 2019-10-18 | 2019-10-18 | |
US17/060,575 US11581355B2 (en) | 2019-10-18 | 2020-10-01 | Fully reticulated detectors for curved focal plane arrays |
Publications (3)
Publication Number | Publication Date |
---|---|
GB202015925D0 GB202015925D0 (en) | 2020-11-18 |
GB2588853A GB2588853A (en) | 2021-05-12 |
GB2588853B true GB2588853B (en) | 2022-08-31 |
Family
ID=73223773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2015925.7A Active GB2588853B (en) | 2019-10-18 | 2020-10-07 | Fully reticulated detectors for curved focal plane arrays |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2588853B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100224950A1 (en) * | 2009-03-05 | 2010-09-09 | Rostam Dinyari | Apparatus and method using patterned array with separated islands |
WO2018022622A1 (en) * | 2016-07-25 | 2018-02-01 | L-3 Communications Cincinnati Electronics Corportation | Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the same |
WO2018156877A1 (en) * | 2017-02-24 | 2018-08-30 | Massachusetts Institute Of Technology | Apparatus and methods for curved focal plane array |
EP3624191A1 (en) * | 2018-09-12 | 2020-03-18 | Sensors Unlimited, Inc. | Interconnect bump structures for photo detectors |
-
2020
- 2020-10-07 GB GB2015925.7A patent/GB2588853B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100224950A1 (en) * | 2009-03-05 | 2010-09-09 | Rostam Dinyari | Apparatus and method using patterned array with separated islands |
WO2018022622A1 (en) * | 2016-07-25 | 2018-02-01 | L-3 Communications Cincinnati Electronics Corportation | Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the same |
WO2018156877A1 (en) * | 2017-02-24 | 2018-08-30 | Massachusetts Institute Of Technology | Apparatus and methods for curved focal plane array |
EP3624191A1 (en) * | 2018-09-12 | 2020-03-18 | Sensors Unlimited, Inc. | Interconnect bump structures for photo detectors |
Also Published As
Publication number | Publication date |
---|---|
GB202015925D0 (en) | 2020-11-18 |
GB2588853A (en) | 2021-05-12 |
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