GB2588853B - Fully reticulated detectors for curved focal plane arrays - Google Patents

Fully reticulated detectors for curved focal plane arrays Download PDF

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Publication number
GB2588853B
GB2588853B GB2015925.7A GB202015925A GB2588853B GB 2588853 B GB2588853 B GB 2588853B GB 202015925 A GB202015925 A GB 202015925A GB 2588853 B GB2588853 B GB 2588853B
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Prior art keywords
detectors
focal plane
plane arrays
curved focal
fully reticulated
Prior art date
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Active
Application number
GB2015925.7A
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GB202015925D0 (en
GB2588853A (en
Inventor
Zandian Majid
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teledyne Scientific and Imaging LLC
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Teledyne Scientific and Imaging LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/060,575 external-priority patent/US11581355B2/en
Application filed by Teledyne Scientific and Imaging LLC filed Critical Teledyne Scientific and Imaging LLC
Publication of GB202015925D0 publication Critical patent/GB202015925D0/en
Publication of GB2588853A publication Critical patent/GB2588853A/en
Application granted granted Critical
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14665Imagers using a photoconductor layer
    • H01L27/14669Infrared imagers
    • H01L27/1467Infrared imagers of the hybrid type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/1469Assemblies, i.e. hybrid integration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14694The active layers comprising only AIIIBV compounds, e.g. GaAs, InP
GB2015925.7A 2019-10-18 2020-10-07 Fully reticulated detectors for curved focal plane arrays Active GB2588853B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962923189P 2019-10-18 2019-10-18
US17/060,575 US11581355B2 (en) 2019-10-18 2020-10-01 Fully reticulated detectors for curved focal plane arrays

Publications (3)

Publication Number Publication Date
GB202015925D0 GB202015925D0 (en) 2020-11-18
GB2588853A GB2588853A (en) 2021-05-12
GB2588853B true GB2588853B (en) 2022-08-31

Family

ID=73223773

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2015925.7A Active GB2588853B (en) 2019-10-18 2020-10-07 Fully reticulated detectors for curved focal plane arrays

Country Status (1)

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GB (1) GB2588853B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100224950A1 (en) * 2009-03-05 2010-09-09 Rostam Dinyari Apparatus and method using patterned array with separated islands
WO2018022622A1 (en) * 2016-07-25 2018-02-01 L-3 Communications Cincinnati Electronics Corportation Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the same
WO2018156877A1 (en) * 2017-02-24 2018-08-30 Massachusetts Institute Of Technology Apparatus and methods for curved focal plane array
EP3624191A1 (en) * 2018-09-12 2020-03-18 Sensors Unlimited, Inc. Interconnect bump structures for photo detectors

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100224950A1 (en) * 2009-03-05 2010-09-09 Rostam Dinyari Apparatus and method using patterned array with separated islands
WO2018022622A1 (en) * 2016-07-25 2018-02-01 L-3 Communications Cincinnati Electronics Corportation Infrared detector devices and focal plane arrays having a transparent common ground structure and methods of fabricating the same
WO2018156877A1 (en) * 2017-02-24 2018-08-30 Massachusetts Institute Of Technology Apparatus and methods for curved focal plane array
EP3624191A1 (en) * 2018-09-12 2020-03-18 Sensors Unlimited, Inc. Interconnect bump structures for photo detectors

Also Published As

Publication number Publication date
GB202015925D0 (en) 2020-11-18
GB2588853A (en) 2021-05-12

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